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Package & Packing Information

We introduce package dimensions and packing methods of Toshiba semiconductor.
In developing your designs, please ensure the datasheet.

By products

Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3.

  • 3D model(.stp): 3D model Data in STEP Format
  • Land Pattern(.dxf): Land pattern Data in DXF Format
  • Land Pattern(.xml):Land pattern Data in JEITA LPB C-format
  • Land Pattern(.dra):Land pattern Data for Cadence®OrCAD®
  • Land Pattern(.ftp): Land pattern Data for Zuken®CR-5000/CR-8000

IC packages by type


Package Mounting Guide

This online document describes design techniques and mounting methods for improving the solder ability and heat dissipation of our products, and aims at producing the printed circuit board assembly (PCBA) with high manufacturability.

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·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.