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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

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If the packages are the same, are the thermal resistances the same?

Even if the packages are the same, the thermal resistances are not always the same.
Thermal resistance varies depending on chip size and internal structure, too.

If the package is the same but the thermal resistance is different, even if the same power dissipation occurs, the junction temperature of the semiconductor device is different.

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