In recent years, the size reduction in electronic equipment, high-density mounting, and severe operating conditions such as high ambient temperatures have caused a variety of heat issues when selecting, placing electronic components to be used and designing boards. Therefore, the importance of thermal design using cooling simulation with three forms of heat transfer: thermal conduction, thermal convection, and thermal radiation, is increasing.
Thermal models, such as the enclosure, the board, and the mounted components are required for cooling simulations. Toshiba Electronic Devices & Storage Corporation ("Toshiba") has created the Simplified CFD Model that is suitable for cooling simulations, focusing on MOSFET, and has started releasing this model. Simplified CFD Model can be used with thermal fluid analysis tool to visualize three-dimensional behavior (temperature distribution and flow velocity).
Please refer to the application note for the usage of the Simplified CFD Model.
Figure 2 shows a simulation result of which losses are applied to a MOSFET and heat is generated. It shows heat spread to the board and heatsink as MOSFET temperature rises.
Figure 3 shows the air velocity and heat flow in the chamber set during the analysis. The flow velocity and path of fluid (air) around the board can be checked.
Please refer to the following web page for the list of MOSFETs with Simplified CFD Model.
Thermal Management for Designs Using Discrete Semiconductor Devices
There are several effective ways to manage the high temperatures of today’s discrete semiconductors in your design.