TJ90S04M3L

Power MOSFET (P-ch single)

Data sheet

TJ90S04M3L Data sheet/Japanese[Jun,2020]PDF: 975KB

Data sheet

TJ90S04M3L Data sheet/English[Jun,2020]PDF: 856KB

Simulation Model

PSpice Model[Apr,2018]ZIP: 5KB

Thermal Simulation Model

Simplified CFD Model[Aug,2023]ZIP: 8KB

Reliability Information

Reliability Data[Oct,2024]PDF: 276KB

Application Note

MOSFET SPICE model grade[May,2023]PDF: 1639KB

Application Note

Electrical Characteristics: Power MOSFET Application Notes[Feb,2023]PDF: 1266KB

Application Note

Quick Reference Guide for Thermal Design for Power Semiconductor SMD type: Part 2[Dec,2020]PDF: 3593KB

Application Note

Efficiency evaluation of Half-bridge DC-DC converter supporting 48V Bus system[Sep,2020]PDF: 1517KB

Application Note

Avalanche energy calculation[Mar,2020]PDF: 562KB

Application Note

Quick Reference Guide for Thermal Design for Discrete Semiconductor Devices[Feb,2020]PDF: 2104KB

Application Note

Resonant Circuits and Soft Switching[Nov,2019]PDF: 1071KB

Application Note

U-MOSⅨ-H 60V Low VDS spike TPH1R306P1[Aug,2019]PDF: 1081KB

Application Note

Hints and Tips for Thermal Design part3[Feb,2019]PDF: 3165KB

Application Note

Reverse Recovery Operation and Destruction of MOSFET Body Diode[Sep,2018]PDF: 472KB

Application Note

MOSFET Secondary Breakdown[Sep,2018]PDF: 450KB

Application Note

RC Snubbers for Step-Down Converters[Sep,2018]PDF: 1846KB

Application Note

Structures and Characteristics: Power MOSFET Application Notes[Jul,2018]PDF: 331KB

Application Note

Maximum Ratings: Power MOSFET Application Notes[Jul,2018]PDF: 705KB

Application Note

Selecting MOSFETs and Consideration for Circuit Design: Power MOSFET Application Notes[Jul,2018]PDF: 848KB

Application Note

Thermal Design and Attachment of a Thermal Fin: Power MOSFET Application Notes[Jul,2018]PDF: 789KB

Application Note

Parasitic Oscillation and Ringing: Power MOSFET Application Notes[Jul,2018]PDF: 1394KB

Application Note

Parasitic Oscillation between Parallel Power MOSFETs: Power MOSFET Application Notes[Jul,2018]PDF: 1178KB

Application Note

MOSFET Gate Drive Circuit: Power MOSFET Application Notes[Jul,2018]PDF: 1215KB

Application Note

Impacts of the dv/dt Rate on MOSFETs: Power MOSFET Application Notes[Jul,2018]PDF: 1077KB

Application Note

MOSFET Avalanche Ruggedness: Power MOSFET Application Notes[Jul,2018]PDF: 616KB

Application Note

Hints and Tips for Thermal Design for Discrete Semiconductor Devices[Jul,2018]PDF: 1266KB

Application Note

Calculating the Temperature of Discrete Semiconductor Devices[Jul,2018]PDF: 965KB

Application Note

Derating of the MOSFET Safe Operating Area[Jul,2018]PDF: 656KB

Application Note

MOSFET Self-Turn-On Phenomenon[Jul,2018]PDF: 1338KB

Application Note

Discrete Semiconductor Devices Hints and Tips for Thermal Design Part 2[Jul,2018]PDF: 1069KB

Application Note

Motor Control (Vacuum Cleaners)[Jul,2018]PDF: 2483KB

Catalog

Selection Guide MOSFETs 2024 Rev2.0[Jul,2024]PDF: 10837KB

Data sheet

TJ90S04M3L Data sheet/Japanese[Jun,2020]PDF: 975KB

Data sheet

TJ90S04M3L Data sheet/English[Jun,2020]PDF: 856KB

Application Note

MOSFET SPICE model grade[May,2023]PDF: 1639KB

Application Note

Electrical Characteristics: Power MOSFET Application Notes[Feb,2023]PDF: 1266KB

Application Note

Quick Reference Guide for Thermal Design for Power Semiconductor SMD type: Part 2[Dec,2020]PDF: 3593KB

Application Note

Efficiency evaluation of Half-bridge DC-DC converter supporting 48V Bus system[Sep,2020]PDF: 1517KB

Application Note

Avalanche energy calculation[Mar,2020]PDF: 562KB

Application Note

Quick Reference Guide for Thermal Design for Discrete Semiconductor Devices[Feb,2020]PDF: 2104KB

Application Note

Resonant Circuits and Soft Switching[Nov,2019]PDF: 1071KB

Application Note

U-MOSⅨ-H 60V Low VDS spike TPH1R306P1[Aug,2019]PDF: 1081KB

Application Note

Hints and Tips for Thermal Design part3[Feb,2019]PDF: 3165KB

Application Note

Reverse Recovery Operation and Destruction of MOSFET Body Diode[Sep,2018]PDF: 472KB

Application Note

MOSFET Secondary Breakdown[Sep,2018]PDF: 450KB

Application Note

RC Snubbers for Step-Down Converters[Sep,2018]PDF: 1846KB

Application Note

Structures and Characteristics: Power MOSFET Application Notes[Jul,2018]PDF: 331KB

Application Note

Maximum Ratings: Power MOSFET Application Notes[Jul,2018]PDF: 705KB

Application Note

Selecting MOSFETs and Consideration for Circuit Design: Power MOSFET Application Notes[Jul,2018]PDF: 848KB

Application Note

Thermal Design and Attachment of a Thermal Fin: Power MOSFET Application Notes[Jul,2018]PDF: 789KB

Application Note

Parasitic Oscillation and Ringing: Power MOSFET Application Notes[Jul,2018]PDF: 1394KB

Application Note

Parasitic Oscillation between Parallel Power MOSFETs: Power MOSFET Application Notes[Jul,2018]PDF: 1178KB

Application Note

MOSFET Gate Drive Circuit: Power MOSFET Application Notes[Jul,2018]PDF: 1215KB

Application Note

Impacts of the dv/dt Rate on MOSFETs: Power MOSFET Application Notes[Jul,2018]PDF: 1077KB

Application Note

MOSFET Avalanche Ruggedness: Power MOSFET Application Notes[Jul,2018]PDF: 616KB

Application Note

Hints and Tips for Thermal Design for Discrete Semiconductor Devices[Jul,2018]PDF: 1266KB

Application Note

Calculating the Temperature of Discrete Semiconductor Devices[Jul,2018]PDF: 965KB

Application Note

Derating of the MOSFET Safe Operating Area[Jul,2018]PDF: 656KB

Application Note

MOSFET Self-Turn-On Phenomenon[Jul,2018]PDF: 1338KB

Application Note

Discrete Semiconductor Devices Hints and Tips for Thermal Design Part 2[Jul,2018]PDF: 1069KB

Application Note

Motor Control (Vacuum Cleaners)[Jul,2018]PDF: 2483KB

Simulation Model

PSpice Model[Apr,2018]ZIP: 5KB

Thermal Simulation Model

Simplified CFD Model[Aug,2023]ZIP: 8KB

Reliability Information

Reliability Data[Oct,2024]PDF: 276KB

Catalog

Selection Guide MOSFETs 2024 Rev2.0[Jul,2024]PDF: 10837KB

Description

Application Scope Automotive / Switching Voltage Regulators / DC-DC Converters / Motor Drivers
Polarity P-ch
Generation U-MOSⅥ
Internal Connection Single
PPAP Capable(*)
AEC-Q101 Qualified(*)
RoHS Compatible Product(s) (#) Available

*: For detail information, please contact to our sales.

Package Information

Toshiba Package Name DPAK+
Package Image DPAK+
Pins 3
Mounting Surface Mount
Width×Length×Height
(mm)		 6.5×9.5×2.3
Package Dimensions View
Land pattern dimensions View
CAD data
(Symbol, Footprint and 3D model)		 Download from UltraLibrarian<sup>®</sup> in your desired CAD format (Note) Download from UltraLibrarian® in your desired CAD format (Note)

 Please refer to the link destination to check the detailed size.

 (Note) Ultra Librarian® is a Registered trademark and CAD data library of EMA (EMA Design Automation, Inc.).

Absolute Maximum Ratings

Characteristics Symbol Rating Unit
Drain-Source voltage VDSS -40 V
Gate-Source voltage VGSS +10/-20 V
Drain current ID -90 A
Power Dissipation PD 180 W

Electrical Characteristics

Characteristics Symbol Condition Value Unit
Gate threshold voltage (Max) Vth - -2.0 V
Gate threshold voltage (Min) Vth - -1.0 V
Drain-Source on-resistance (Max) RDS(ON) |VGS|=10V 4.3 mΩ
Drain-Source on-resistance (Max) RDS(ON) |VGS|=4.5V 6 mΩ
Input capacitance (Typ.) Ciss - 7700 pF
Total gate charge (Typ.) Qg VGS=-10V 172 nC
Reverse recovery time (Typ.) trr - 49 ns
Reverse recovery charge (Typ.) Qrr - 37 nC
Purchase and Sample
Please contact one of Toshiba's official distributors or the nearest Toshiba sales office.
You can search for and purchase a small on-line sample by clicking on the following link.

Document

  • If the checkbox is invisible, the corresponding document cannot be downloaded in batch.

Apr,2018

Aug,2023

Oct,2024

Orderable part number

Orderable part number
(example)		 MOQ(pcs) Reliability
Information		 RoHS AEC_Q100-Q101
TJ90S04M3L,LQ 2000 - Yes Yes

Applications

Advanced Driver-Assistance Systems (ADAS)
Such as reduction of power supply and signal noise and reduction of power consumption are important in designing ADAS. Toshiba provides information on a wide range of semiconductor products suitable for image input units, power supply units, data transmission and audio output units, etc., along with circuit configuration examples.
Details
Automotive Electro Active Suspension
Such as reduction of power consumption and miniaturization are important in designing electro active suspension. Toshiba provides information on a wide range of semiconductor products suitable for motor drive units, power supply units, etc., along with circuit configuration examples.
Details
Automotive Brake Control
Such as reduction of power consumption and miniaturization are important in designing brake control. Toshiba provides information on a wide range of semiconductor products suitable for brake actuator unit, motor driving unit and power supply units, etc., along with circuit configuration examples.
Details
Automotive Electric Pump (Water/Oil)
Such as ensuring
tolerance to motor lock current and reduction of power consumption are important in electric pump (water/oil). Toshiba provides information on a wide range of semiconductor products suitable for motor drive unit, power supply unit, etc., along with circuit configuration examples.
Details
Automotive Engine Control
Such as reduction of power consumption and miniaturization are important in designing engine control. Toshiba provides information on a wide range of semiconductor products suitable for power management circuit, injector drive circuit, actuator drive circuit, etc., along with circuit configuration examples.
Details
Automotive HVAC
Such as ensuring tolerance to motor lock current and reduction of power consumption are important in designing HVAC. Toshiba provides information on a wide range of semiconductor products suitable for motor drive units, power supply units, etc., along with circuit configuration examples.
Details
Automotive LED Headlamp
Such as reduction of power consumption and miniaturization of circuit boards are important in designing LED headlamp. Toshiba provides information on a wide range of semiconductor products suitable for LED matrix control units, power supply units, etc., along with circuit configuration examples.
Details
IVI (In-vehicle Infotainment)
Such as information sharing and reduction of power consumption are important in designing IVI. Toshiba provides information on a wide range of semiconductor products suitable for display and audio output section, video and voice input section, wireless communications section, etc., along with circuit configuration examples.
Details
Automotive Power Slide Door
Such as ensuring tolerance to motor lock current and reduction of power consumption are important in power sliding door. Toshiba provides information on a wide range of semiconductor products suitable for motor drive unit, power supply unit, etc., along with circuit configuration examples.
Details
Automotive Radiator Fan
Such as ensuring tolerance to motor lock current and reduction of power consumption are important in designing radiator fan. Toshiba provides information on a wide range of semiconductor products suitable for motor drive units, communication units, etc., along with circuit configuration examples.
Details
Electric Power Steering
Such as ensuring tolerance to motor lock current and reduction of power consumption are important in designing electric power steering. Toshiba provides information on a wide range of semiconductor products suitable for motor drive units, power supply units, etc., along with circuit configuration examples.
Details
Automotive USB Power Charger
Such as reduction of power supply and signal noise and reduction of power consumption are important in designing USB power charger. Toshiba provides information on a wide range of semiconductor products suitable for circuit for cigar socket or accessory circuits, etc., along with circuit configuration examples.
Details
Automotive V2X
Such as reduction of power supply and signal noise and reduction of power consumption are important in designing V2X. Toshiba provides information on a wide range of semiconductor products suitable for RF block units, power supply units, etc., along with circuit configuration examples.
Details
Transmission Management
Such as reduction of power consumption and miniaturization are important in designing transmission management. Toshiba provides information on a wide range of semiconductor products suitable for motor drive units, power supply units, mechanical relay drive units, etc., along with circuit configuration examples.
Details
Head-up Display (HUD)
Such as reduction of noise on signal line, reduction of power consumption and miniaturization are important in designing head-up display. Toshiba provides information on a wide range of semiconductor products suitable for motor drive units, power supply units, etc., along with circuit configuration examples.
Details

Technical inquiry

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Frequently Asked Questions

FAQs

Notes

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