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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
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Do the technical datasheets of diodes specify thermal resistance from the junction to the ambient?
Toshiba specify the thermal resistance from the junction to the case in the technical datasheet of the diode in the lead type package but does not specify it in the technical datasheet of the diode in the surface mount type package.
This is because surface mount type packaged products have a small amount of self-heating and the surface temperature of the package cannot be measured accurately.
However, the thermal resistance from junction to ambient (Rth (j-a)) is described, so please use that for heat dissipation design.
For thermal design, please refer to the following application note.
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