※ : Products list (parametric search)
※ : Products list (parametric search)
※ : Products list (parametric search)
※ : Products list (parametric search)
※ : Products list (parametric search)
※ : Products list (parametric search)
※ : Products list (parametric search)
※ : Products list (parametric search)
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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
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It is necessary to protect the circuits of electronic devices from transient high voltages such as electrostatic discharge (ESD).
Semiconductors used in electronic devices have high performance and high density, and the manufacturing process is refined to downscale them. Downscaling tends to reduce device resistance to ESD. In addition, device connections are increasingly made externally via USB and similar interfaces as well as board-to-board connectors, increasing the risk of ESD during connection.
There are related explanations in the following materials, so please refer to them.