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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
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How do I estimate the junction temperature?
The junction temperature Tj can be obtained by the following formula.
Tj = Rth(j-t) * Pd + Ttab
Rth(j-t): Thermal resistance of Audio power IC,
Pd: Power dissipation
Ttab: Temperature of the audio power IC's heatsink.
The temperature of the heatsink of the audio power IC, Ttab, is measured using a thermocouple as shown in Fig. 1.
Insert the thermocouple between the heatsink of the audio power IC and the external heat sink. Tighten the screws securely.
(Use a thermocouple as thin as possible for measurement, and ensure adhesion to the external heat sink by applying silicone grease, etc.)
The thermal resistance of IC, Rth(j-t), is shown in the datasheet. And refer to another FAQ “How do I calculate the current consumption and power dissipation?” for the calculation of the power dissipation Pd.
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