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Automotive MOSFETs with Small Package Featuring Wettable Flank Structure
Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched five products of automotive MOSFETs that combine space-saving and high-mountability by using small DFN2020B(WF) package with a wettable flank structure[1]. The N-channel MOSFETs are "XSM6K361NW, XSM6K519NW, XSM6K376NW, and XSM6K336NW," and the P-channel MOSFET is "XSM6J372NW."
The DFN2020B(WF) package adopts a wettable flank structure, which improves solder wettability compared to Toshiba’s existing UDFN6B package. In addition, the improved visibility of the solder fillet[2] allows for confirmation of solderability in automatic visual inspection (AVI) equipment, contributing to the automation of inspection on the manufacturing line. Furthermore, in the solder joint mounting shear strength[3] test, it is approximately 23%[4] stronger than Toshiba’s existing SOT-23F[5] package, contributing to improved reliability of the equipment.
The package size of DFN2020B(WF) is 2.0×2.0×0.6mm (typ.), which reduces the mounting area by approximately 43% and the package height by approximately 25% compared to the SOT-23F package, contributing to the miniaturization of equipment. Furthermore, it features a high power dissipation despite a small package. The maximum power dissipation rating of XSM6K361NW, one of new products, is 1.84W[6].
The new products comply with AEC-Q101, the automotive industry standard reliability test specification. The PPAP[7] of IATF16949, the international standard for quality management systems specific to the automotive industry, is available[8]. These products can be used in various automotive applications such as DC-DC converters in ECUs[9] and LED headlamp load switches.
Toshiba will continue to expand its lineup of MOSFET and 2in1 MOSFET products for automotive applications, housed in packages with wettable flank structure.
Notes:
[1] Shape of side leads of package.
[2] Solder fillet refers to the soldered portion of a component mounted on a printed circuit board.
[3] Mounting shear strength is one of the testing methods for evaluating the strength of joints in electronic components and semiconductor packages.
[4] Toshiba compared with mean of actual measured value.
[5] Existing products such as SSM3K361R, the package size: 2.4×2.9×0.8mm (typ.)
[6] Device mounted on a 25.4×25.4×1.6mm, Cu pad: 645mm2, FR-4 glass epoxy board
[7] PPAP: Abbreviation for Production Part Approval Process, a mass-produced part approval processing.
[8] Please contact Toshiba sales representatives for more details
[9] ECU: Abbreviation for Electronic Control Unit, an electronic device for controlling various functions of a vehicle.
Features
- Package with wettable flank structure enables automatic visual inspection of board mounting conditions
- Small, low profile high power dissipation package
Features Explanation
1. Package with wettable flank structure enables automatic visual inspection of board mounting conditions
By adopting a wettable flank structure, the solder fillet visibility is improved compared to Toshiba’s existing UDFN6B package. This allows for solder joint inspection using automatic visual inspection (AVI) equipment, contributing to the automation of inspections on the production line.
2. Small, low profile high power dissipation package
DFN2020B(WF) packages have higher power dissipation than SOT-23F packages. The maximum power dissipation rating of XSM6K361NW, one of new products, is 1.84W[6], approximately 1.5 times higher than 1.2W[6] of Toshiba’s existing product SSM3K361R with SOT-23F package. Therefore, the new products contribute to the development of various automotive equipment such as DC-DC converters for ECUs that require compact size and high power dissipation MOSFETs and load switches for LED headlamps.
Applications
Automotive equipment
- DC-DC converters for ECUs, load switches for LED headlamps, etc.
Main Specifications
(Ta=25°C)
| Part number | XSM6K361NW | XSM6K519NW | XSM6K376NW | XSM6K336NW | XSM6J372NW | |||
|---|---|---|---|---|---|---|---|---|
| Polarity | N-channel | P-channel | ||||||
| Package | Name | DFN2020B(WF) | ||||||
| Size (mm) | Typ. | 2.0×2.0×0.6 | ||||||
| Absolute maximum ratings | Drain-source voltage VDSS (V) |
100 | 40 | 30 | 30 | -30 | ||
| Gate-source voltage VGSS (V) |
+20/-20 | +20/-20 | +12/-8 | +20/-20 | -12/+6 | |||
| Drain current (DC) ID (A) |
3.5 | 8.0 | 4.0 | 3.0 | -6.0 | |||
| Power dissipation PD[6] (W) |
1.84 | 1.84 | 1.53 | 1.53 | 1.53 | |||
| Electrical character istics |
Drain-source On-resistance RDS(ON) (mΩ) |
VGS=|10V| | Max | 69 | 17.8 | - | 95 | 42 |
| VGS=|4.5V| | Max | 92 | 36.3 | 56 | 140 | 50 | ||
| VGS=|2.5V| | Max | - | - | 72 | - | 72 | ||
| VGS=|1.8V| | Max | - | - | 109 | - | 144 | ||
| Input capacitance Ciss (pF) | Typ. | 430 | 797 | 200 | 126 | 560 | ||
| Total gate charge Qg (nC) | Typ. | 3.2 | 6.5 | 2.2 | 1.7 | 8.2 | ||
| Sample Check & Availability |  |
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Related Contents
Refer to the following page for details on new products.
XSM6K361NW
XSM6K519NW
XSM6K376NW
XSM6K336NW
XSM6J372NW
DFN2020B(WF) videos of the package are shown in the link below.
DFN2020B(WF) package
Follow the link below for more on Toshiba Automotive MOSFETs.
Automotive MOSFETs
For examples of applications, see the following pages.
Automotive LED Headlamp
IVI (In-vehicle Infotainment)
Stock Check & Purchase
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