Small-Package Photorelays for Semiconductor Testers Combining High ON-State Current and Low OFF-State Leakage Current

Small-Package Photorelays for Semiconductor Testers Combining High ON-State Current and Low OFF-State Leakage Current

Toshiba Electronic Devices & Storage Corporation (“Toshiba”)  has launched two photorelays, "TLP3487" and "TLP3491", for semiconductor testers, featuring small P‑SON4 [1] packages that achieve both high ON‑state current and low OFF‑state leakage current.

A semiconductor tester (ATE: Automatic Test Equipment) is a system that applies voltages and currents to each pin of a device under test (DUT), such as system LSIs and semiconductor memories, to verify proper operation. In such testers, it is necessary to switch power and signal paths for each pin of the DUT; therefore, photorelays—a type of solid‑state relay with MOSFET outputs—are widely used. On the other hand, in semiconductor testers, OFF‑state leakage current of relays can cause measurement errors, making the reduction of leakage current essential for improving measurement accuracy. In addition, applications such as power supply and load control also require support for high current, creating a need for switching devices that can satisfy these requirements at a high level.

The new products TLP3487 and TLP3491 achieve both high ON‑state current and low OFF‑state leakage current through optimized device design of the MOSFET output section—performance that was difficult to realize with Toshiba’s existing P‑SON4 package photorelays[2]. Previously, in applications requiring high current, multiple devices have often been used in combination. As a result, this has led to issues such as an increased mounting area due to a higher component count and increased OFF‑state leakage current. Since TLP3487 and TLP3491 support both high ON‑state current and low OFF‑state leakage current, they can be configured as a single device, contributing to a reduction in component count and board space.

In addition, by adopting the P‑SON4 package, the mounting area can be reduced by approximately 74% compared with the 2.54SOP4 package and by approximately 84% compared with the 2.54SOP6 package used in Toshiba’s existing products, supporting high‑density mounting.

With these features, the new products are suitable for high‑precision measurement applications requiring low OFF‑state leakage current, and can be used in a wide range of semiconductor tester applications, including memory testers and SoC testers.

Toshiba will continue to pursue further reductions in OFF‑state leakage current, support for higher current, and miniaturization of photorelays, expanding its product lineup to meet the needs for higher precision and higher density in semiconductor testers.

Notes:

[1] P‑SON4: Power Small Outline Non‑leaded

[2] Toshiba’s existing product TLP3481, etc.

Features

  1.  Low OFF‑state current (IOFF) characteristics that minimize the impact on measurement signals
  2. Capable of use in locations where large currents flow, with an ON‑state current (ION) of 2A (max)
  3. Small P‑SON4 package suitable for high‑density mounting

Features Explanation

1. Low OFF‑state current (IOFF) characteristics that minimize the impact on measurement signals

In tester applications, even a small amount of current flowing when the relay is in the off state (leakage) can cause errors in measurement values and signals. Therefore, minimizing OFF‑state current (IOFF) is essential for improving measurement accuracy. The new products optimize the device design of the MOSFET output stage to simultaneously achieve both high ON‑state current and low OFF‑state leakage current—an approach that was difficult to realize with small packages—and, compared with existing products[3], can suppress leakage current when the relay is off.

  • TLP3487: OFF‑state current (IOFF) of 10nA (VOFF=60V) (max)
  • TLP3491: OFF‑state current (IOFF) of 1nA (VOFF=40V) (max)

Note:

[3] TLP3481 (OFF‑state current (IOFF) of 10nA (max) at VOFF=40V, and 1μA (max) at VOFF=60V)

2.Capable of use in locations where large currents flow, with an ON‑state current (ION) of 2A (max)

Figure 1. DPS circuit block diagram
Figure 1. DPS circuit block diagram

In semiconductor testers, not only signal switching but also paths for supplying power to the DUT—such as device power supplies (DPS)—handle high currents on the order of several amperes. Therefore, switching devices are also required to have high current capability.
Since both new products support an ON‑state current (ION) of 2A (max), they can be used in applications where large currents flow, including power supply and load control.

Figure 2. Example of reduction in component count and board space
Figure 2. Example of reduction in component count and board space

Conventionally, in applications requiring high current, multiple devices have often been used in combination. However, such configurations can lead to issues such as an increase in mounting area due to a higher component count and the possibility of increased OFF‑state leakage current resulting from the combined configuration.

Because the TLP3487 and TLP3491 simultaneously achieve both high ON‑state current and low OFF‑state leakage current, they can be readily configured using a single device, contributing to a reduction in component count and board space (Figure 2).

Note:

[4] PMU stands for Parametric Measurement Unit. It is a DC measurement unit that applies voltage or current to the DUT (Device Under Test) and measures the resulting current or voltage as a response.

3.Small P‑SON4 package suitable for high‑density mounting

Figure 3. Package size comparison
Figure 3. Package size comparison

In semiconductor testers, multiple DUTs are measured simultaneously, requiring a large number of relays to be mounted on a limited test board area. While technological innovations such as higher processing speeds continue to advance, there is also increasing demand for cost reduction and high reliability, making higher test board density unavoidable.

By adopting the P‑SON4 package, the new product features a compact mounting area of 7.2mm2 (typ.). This enables a reduction in mounting area of approximately 74% compared with the conventional 2.54SOP4 package and approximately 84% compared with the 2.54SOP6 package, thereby supporting high‑density mounting.

Applications

  • Semiconductor testers used to evaluate memories, SoC, LSI, etc.
  •  Peripheral equipment for semiconductor testers (probe cards, test interface boards [load boards], I/O interface boards, etc.)

Main Specifications

(Unless otherwise specified, Ta=25℃)

Part number TLP3487 TLP3491
Contact 1a
(Normally opened)
Package Name P-SON4
Size (mm) Typ. 3.4×2.1×1.3
Absolute
maximum
ratings		 OFF-state output terminal voltage VOFF (V) 60
ON-state current ION (A) 2
ON-state current (pulsed) IONP (A) 6
Operating temperature Topr (°C) -40 to 110
Coupled
electrical
characteristics		 Trigger LED current
IFT (mA)		 ION=1A Max 3
ON-state resistance
RON (mΩ)		 IF=5mA, ION=2A,
t < 1s		 Max 130
Electrical
characteristics		 OFF-state current
IOFF (nA)		 VOFF=40V Max - 1
VOFF=60V Max 10 1000
VOFF=20V,
Ta=50℃		 Max - 10
Output capacitance
COFF (pF)		 V=0V, f=１MHz Typ. 200
Isolation
characteristics		 Isolation voltage BVS
(Vrms)		 AC, 60s Min 500
Switching
characteristics		 Turn-on time tON
(ms)		 IF=5mA,
VDD=20V,
RL=200Ω		 Max 3
Turn-off time tOFF
(ms)		 Max 0.5
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Related Contents

Follow the link below for more on Toshiba’s isolators and solid state relays.
Isolators/Solid State Relays

For more details about photorelays, please refer to the page below.
What is a photorelay?

Application Notes
Points for photorelays in high frequency circuit applications
Points for photorelays in high frequency circuit applications 2

For FAQs about our isolator and solid state relay (SSR) products, please refer to the page below.
Isolators/Solid State Relays

Back to Photorelays (MOSFET Output)

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