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About information presented in this cross reference

The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

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Through Hole type Small Outline Package (SOP)

  • Features: Small form factor, low pin count, leadframe, excellent cost performance
  • Structure: Packages that have “gull-wing” leads on two sides
  • Intended Use: Consumer equipment, office equipment, etc.
  • Lead Pitch: 0.50 / 0.65 / 1.27 mm
  • Body size: 4.4 × 5.0 to 12 × 8 mm
  • Lead Count: 16 to 48 pins

SOP Lineup

Package Type Package Name Pins Body Size
(mm)
Pin Pitch
(mm)
Height(Max)
(mm)
SOP 16 4 x 10 1.27 1.73
18 8 x 12 1.27 1.73
SSOP 16 5 x 4.4 0.65 1.92
18 6.5 x 4.4 0.65 1.6
20 6.5 x 4.4 0.65 1.55
24 7.8 x 5.6 0.65 1.6
30 9.7 x 5.6 0.65 1.6
HSSOP 36 8 x 11 0.5 2.45
HTSSOP 16 5 x 5 0.65 1.2
24 5 x 8 0.65 1.1
48 12.5 x 6.1 0.5 1.2
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