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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
Parentheses including alphanumeric characters at the end of the product name indicate ADD codes that are our factory management codes.
There is no difference in the technical data sheet depending on the contents of ADD codes.
Example: TB67S128FTG(O,EL): ‘O’ and ‘EL’ are ADD codes.
■Example: Explanation of ADD codes for MCD products.
Z: Indicates that front-end process factory is Japan Semiconductor Corporation (Iwate operations).
O: Indicates that front-end process factory is Japan Semiconductor Corporation (Oita operations).
Q: Indicates that the product can be ordered with a smaller minimum order quantity (Ex. 500 pcs)
C: Indicates that the bonding wire material is copper.
8: Indicates that 8-inch wafer is used.
EL or E: Indicates that the packaging is embossed taping type.