TC35661SBG-503

停產產品

Bluetooth® IC

產品概要

Feature BR+LE dual / Small BGA Package
Automotive Support
Bluetooth Category Bluetooth® dual-mode
Bluetooth Core spec. 4.2
Embedded Profiles GATT / SMP / SPP
Interfacing I2C / SPI / UART
User RAM Size (KB)
User Flash Size (KB)
Function ARM® ARM7TDMI-S™ / RF analog circuitry / low power mode
RoHS Compatible Product(s) (#) Available
Status Under mass production

包裝資訊

Toshiba Package Name P-TFBGA64-0505-0.50
Package name BGA
Pins 64
Mounting Surface Mount
Package size 5.0 mm x 5.0 mm
Pin pitch 0.5 mm

電器特性

項目 符號 條件 單位
Operating Temperature (Max) Topr - 85 (*1)
Operating Temperature (Min) Topr - -20 or -40 (*1)
Power supply voltage (Max) - - 3.6 (*2) V
Power supply voltage (Min) - - 1.7 (*2) V
Current Consumption in RX Active mode (peak) IRX (3.3V) 63 mA
Current Consumption in TX Active mode (peak) ITX (3.3V) 63 mA
Current Consumption in Sleep mode ISleep - 30 μA
Transmit Power(Max) PTrans - 2 dBm
Receiver Sensitivity - - -91 dBm

(*1) Operating Temperature: If the ending of product number is (ELA or (ELC, min. rating is -20 deg C, the others are -40 deg C

(*2) Power supply voltage: 1.7 to 1.9 or 2.7 to 3.6.

文檔

  • 如果沒看到確認框則對應文件目前無法下載

技術方面問題

聯絡我們

聯絡我們

常見問題

常見問答

Notes

返回列表頁

Do you want to add this page to your favorites?

Do you want to remove this page from your favorites?

Membership registration required
開啟新視窗