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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
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Toshiba photorelays use the compact packaging technology cultivated in discrete. S-VSON4 packages have been developed for use in measuring instruments, enabling space-saving packaging.
The S-VSON4 package size is 2. 0 mm x 1.45 mm x 1.65 mm, and a compact package can be realized by applying the board construction. The large back electrode improves heat dissipation.
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