40V N-channel Power MOSFET "XPMR7404PB" with SOP Advance(EWF) Package Contributing to Higher Efficiency and Larger Current Capacity in Automotive Equipment

40V N-channel Power MOSFET "XPMR7404PB" with SOP Advance(EWF) Package Contributing to Higher Efficiency and Larger Current Capacity in Automotive Equipment

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched the "XPMR7404PB," a 40V N-channel power MOSFET featuring the new SOP Advance(EWF) package, for automotive applications such as inverters, semiconductor relays, load switches, and motor drives.
To meet the needs for higher efficiency and larger current capacity in automotive equipment, the product achieves low loss and high heat dissipation through an optimized package structure. This contributes to lower power consumption and improved reliability in applications.

The SOP Advance(EWF) adopts a post-less structure that integrates the chip and outer leads using a Cu clip (Figure 1). This reduces the resistance of the current path compared with the conventional structure and improves current carrying capability. In addition, the source-coupled structure, which connects the source terminal on the back side of the package (Figure 2), increases the connection area with the board, thereby reducing package resistance and enhancing heat dissipation performance.
In addition to these structural features, the optimized internal design realizes low drain-source On-resistance (RDS(ON)) and low channel-to-case thermal impedance (Zth(ch-c)), thereby contributing to lower loss and higher efficiency in application equipment.

The package also adopts a wettable flank structure[1], which improves the visibility of solder joints, facilitating mounting quality inspection by automated visual inspection (AVI), and contributing to greater manufacturing efficiency and improved reliability.

The product complies with AEC-Q101, the reliability test standard for automotive applications, meeting the high-quality requirements demanded for automotive use.

Toshiba will continue to strengthen its lineup of power semiconductors, contributing to the advancement of automotive equipment through highly efficient and highly reliable products, and thereby supporting the realization of carbon neutrality.

Note:
[1] Wettable flank: Shape of the side leads on the package

特性

  1. Low RDS(ON)
  2. Low Zth(ch-c)
  3. SOP Advance(EWF) package with a wettable flank structure, which facilitates automated visual inspection of board mounting conditions

Features Explanation

1. Low RDS(ON)

The SOP Advance(EWF) package adopted for the new product features a post-less structure and a source-coupled structure, reducing package resistance by approximately 54% compared with the existing SOP Advance(WF) package. Compared with the existing SOP Advance(WF) package product XPHR7904PS, the XPMR7404PB achieves approximately a 6% reduction in RDS(ON)​, while the XPMR5904PB, currently under development, achieves approximately a 25% reduction, contributing to lower loss and higher efficiency in applications.

Figure 1. Comparison of post structure and post-less structure
Figure 1. Comparison of post structure and post-less structure
Figure 2. Source-coupled structure
Figure 2. Source-coupled structure
Figure 3. Comparison of R<sub>DS(ON)</sub><sup>[3]</sup>
Figure 3. Comparison of RDS(ON)[3]

Notes:
[2] Under development
[3] Measurement conditions: VGS=10V, Ta=25°C

2. Low Zth(ch-c)

Figure 4. Comparison of Z<sub>th(ch-c)</sub><sup>[4]</sup>
Figure 4. Comparison of Zth(ch-c)[4]

Compared with the existing product XPHR7904PS, the XPMR7404PB achieves approximately a 33% reduction in Zth(ch−c)​, while the XPMR5904PB, currently under development, achieves approximately a 38% reduction. The lower thermal impedance suppresses temperature rise and reduces RDS(ON)​, which has a positive temperature coefficient, thereby contributing to lower loss and higher efficiency in application equipment.

Note:
[4] Measurement condition: Tc=25°C

3. SOP Advance(EWF) package with a wettable flank structure, which facilitates automated visual inspection of board mounting conditions

Figure 5. Dimensions and terminal structure of the SOP Advance(EWF) package
Figure 5. Dimensions and terminal structure of the SOP Advance(EWF) package

The SOP Advance(EWF) package adopts a wettable flank structure at the terminal section. This structure improves both the solder joint visibility and solder wettability. As a result, it facilitates the inspection of component mounting conditions using automated visual inspection (AVI) equipment and contributes to enhanced reliability.

應用

  • Automotive equipment: inverters, semiconductor relays, load switches, motor drives, etc.

Main Specifications

(Unless otherwise specified, Ta=25°C)

Part number XPMR7404PB XPMR5904PB[2] XPMR8504PB[2]
Polarity N-channel
Series U-MOSⅨ-H
Absolute
maximum
ratings		 Drain-source voltage VDSS (V) 40
Drain current (DC) ID (A) 160 180 140
Drain current (pulsed) IDP (A) 480 540 420
Channel temperature Tch (°C) 175
Electrical
characteristics		 Drain-source On-resistance
RDS(ON) (mΩ)		 VGS=6V Max 1.28 1.05 1.52
VGS=10V Max 0.74 0.59 0.85
Gate threshold voltage
Vth (V)		 VDS=10V 2.0 to 3.0
Input capacitance
Ciss (pF)		 VDS=10V,
VGS=0V,
f=300kHz		 Typ. 7550 9240 6350
Thermal characteristics Channel-to-case thermal impedance
Zth(ch-c) (°C/W)		 Tc=25°C Max 0.59 0.55 0.66
Package Name SOP Advance(EWF)
Size (mm) Typ. 4.9×6.47×1.0
Sample check & availability Buy Online Under development Under development

Related Contents

For details about the application, please refer to the page below.

Electric Power Steering
Automotive Electric Pump (Water/Oil)
Automotive Junction Box

Back to Automotive MOSFETs

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