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無線通訊設備用IC
Technical information Downloading site
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technical information
●Datasheet
●Application note
●Sample software for evaluation board
●Software programming manual
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Toshiba Electronic Devices & Storage Corporation started mass production of the TC35680FSG and the TC35681FSG, which are both consumer-grade Bluetooth Ver.5.0 devices. Additionally, an automotive-grade IC that supports wide-temperature-range operation and is AEC-Q100-compliant is under development.
Note: The AEC-Q100 test is in progress and is scheduled for completion in Q3 of 2019
Bluetooth® 經典／低功耗雙型和Bluetooth® 低功耗（LE）元件被廣泛應用於音訊、手機裝置、穿戴式和醫療保健設備。預期往後幾年，Bluetooth經典／低功耗雙型和Bluetooth®低功耗元件將實現越來越普遍的應用。
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東芝藍牙LE元件特點是功耗低。我們的第II代LE元件符合藍牙V4.2標準，實現了業內最低級別的功耗水準，在Tx模式和Rx模式下分別為3.3mA和3.3mA。這些功耗低元件非常適用於採用鈕扣電池進行驅動的智慧型產品應用，有助於提升終端使用者產品的價值。
雖然藍牙低功耗（LE）元件在智慧手機中的應用越來越廣泛，但是市場上仍有許多智慧手機僅能夠支持藍牙經典型。東芝的藍牙經典／LE雙模元件能夠為所有智慧手機提供連線性。東芝也提供車用藍牙經典／LE雙模元件，以滿足各種應用需求。
* Bluetooth® 是 Bluetooth SIG, Inc公司的注冊商標.
* 部份內容轉自Bluetooth® SIG網站
【Content provided】
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●Hardware application note
●Software application note
●Sample software for IAR EWARM
●Sample software for MDK-ARM
●Software reference manual
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