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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
型號需要超過三個文字以上
The electric potential of the heatsink (metallic surface) on the package backside is GND.
The heatsink (metallic surface) on the package backside is connected to substrate (lowest electric potential) on the audio power IC chip backside through a conductive mounting material as shown in Fig. 1. Unintended operation may be appeared if the electric potential of the substrate becomes high. The IC can operate correctly even if this heat sink is open, but the heat sink should be connected to the lowest electric potential (GND) of the audio power IC if it is connected.
However, if the lowest electric potential (GND) is unstable due to the unsuitable pattern layout and so on, the performance and sound quality may be affected.
The following documents also contain related information.