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About information presented in this cross reference

The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

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Find everything you need for your next product design. Simply select an application and click through to the block diagram to discover our semiconductor solutions.

新產品/新聞

What is the meaning of alphanumeric characters at the end of the product name?

Parentheses including alphanumeric characters at the end of the product name indicate ADD codes that are our factory management codes.

There is no difference in the technical data sheet depending on the contents of ADD codes.

Example: TBD62003AFNG (Z, EL): ‘Z’ and ‘EL’ are ADD codes.

■Example: Explanation of ADD codes for product name "TBD62xxx series"

Z: Indicates that front-end process factory is Japan Semiconductor Corporation (Iwate operations).

HZ: Indicates that the back-end process factory is a Chinese partner factory.

HJ: Indicates that the back-end process factory is a Chinese partner factory.

HJW: Indicates that the back-end process factory is a Chinese partner factory.

HZW: Indicates that the back-end process factory is a Chinese partner factory.

EL or E: Indicates that the packaging is embossed taping type.

■Example: Explanation of ADD codes for product name "TD62xxx series"

5: Indicates that 5-inch wafer is used.

S: Indicates the product chip version.

N: Indicates the product chip version.

O: Indicates that front-end process factory is Japan Semiconductor Corporation (Oita operations).

EL or E: Indicates that the packaging is embossed taping type.

LP: Indicates that the product supports long-term storage.