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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
Each device has different thermal conductivity paths, but basically, you should calculate the thermal resistance from a semiconductor chip in a package to ambient air. Use this information when considering thermal dissipation for a system design. Power devices, in particular, have considerable loss, which significantly affects the system reliability and life time. Extreme care should be exercised when considering thermal design. Allow sufficient margins relative to the maximum allowable junction temperature for each device (120°C, 150°C, etc).
Thermal Design and Attachment of a Thermal Fin: Power MOSFET Application Notes (PDF:1,061KB)