Tablet Device

Tablet Device

Such as low power consumption and miniaturization are important in designing tablet device. Toshiba provides information on a wide range of semiconductor products suitable for power supply management units, sensor signal input units, display units, over temperature monitoring unit, etc., along with circuit configuration examples.

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 Speaker Speaker Fingerprint Sensor Fingerprint Sensor SIM Card SIM Card microSD Card microSD Card ROM / RAM ROM / RAM Processor Processor Audio Amp. Audio Amp. Headphones Headphones PMIC PMIC MCU, Fingerprint Sensor, RAM / ROM, RF Module, WLAN SoC, Came... MCU, Fingerprint Sensor, RAM / ROM, RF Module, WLAN SoC, Camera, Audio Codec, Audio Amp. USB port USB port Display Display Interface Bridge InterfaceBridge Camera Camera WLAN SoC WLAN SoC Audio Codec Audio Codec Interface Bridge Interface Bridge TVS TVS MOSFET MOSFET eFuse IC / Gate Driver IC & N-ch MOSFET eFuse IC / Gate Driver IC & N-ch MOSFET Wi-Fi®/ LTE / GPS Wi-Fi®/LTE / GPS Over Temperature Detection IC Over Temperature Detection IC Battery Battery Common Drain MOSFET Common Drain MOSFET System power circuit Wireless communication circuit Display unit circuit Audio unit circuit Touch sensor circuit Over temperature monitoring circuit Camera unit circuit
System power circuit

Example of power supply control circuit using power management IC

Example of power supply control circuit without power management IC

Audio unit circuit

Example of ESD protection circuits for audio terminals and volume switch

Touch sensor circuit

Example of ESD protection circuit in touch sensor circuit

Example of ESD protection circuit in touch sensor circuit

Display unit circuit

Example of interface circuit corresponding to display signal

Camera unit circuit

Example of peripheral circuit of camera module (power supply and interface)

Wireless communication circuit

Example of power supply and ESD protection circuit for Wi-Fi and LTE communication module

Over temperature monitoring circuit

Example of multi-point over temperature monitoring circuit

子方塊圖

System power circuit
System power circuit (Method using power controller)

Example of power supply control circuit using power management IC

Example of power supply control circuit using power management IC
TVS diode
器件型號
Toshiba Package Name SL2 CST2C SL2 SL2 SL2
VESD (Max) [kV] +/-30 +/-30 +/-16 +/-15 +/-8
IR (Max) [µA] 0.1 0.1 0.1 0.1 0.1
Rdyn (Typ.) [Ω] 0.2 0.08 0.7 0.7 1.05
CT (Typ.) [pF] @ VR = 0 [V], f = 1 [MHz] 8.5 270 0.15 0.15 0.12
Electronic fuse (eFuse IC)(1)
器件型號
Toshiba Package Name WSON10B WSON10B WSON10B
VIN (Max) [V] 18 18 18
RON (Typ.) [mΩ] 28 28 28
VOVC (Typ.) [V]   6.04 15.1
Recovery Operation Type Auto-retry Auto-retry Auto-retry
Electronic fuse (eFuse IC)(2)
器件型號
Toshiba Package Name WSON10B WSON10B WSON10B WSON10
VIN (Max) [V] 18 18 18 13.2
RON (Typ.) [mΩ] 28 28 28 53
VOVC (Typ.) [V]   6.04 15.1  
Recovery Operation Type Latch Latch Latch Latch
N-ch MOSFET gate driver IC(1)
器件型號
Toshiba Package Name WCSP6E WCSP6E WCSP6G WCSP6G WCSP6G
VOVL_FA (Typ.) [V]     27.56 23.14 14.17
VOVL_RI (Typ.) [V]     27.73 23.26 14.29
VGS (Typ.) [V] 8.5 8.5 10 10 10
N-ch MOSFET gate driver IC(2)
器件型號
Toshiba Package Name WCSP6G WCSP6G WCSP6G
VOVL_FA (Typ.) [V] 14.17 10.71 6.19
VOVL_RI (Typ.) [V] 14.29 10.83 6.31
VGS (Typ.) [V] 5.6 5.6 5.6
N-ch common drain MOSFET
器件型號
Toshiba Package Name TCSPED-302701 TCSPAC-153001 TCSP6A-172101 TCSPAG-341501
VDSS (Max) [V]        
ID (Max) [A]        
RDS(ON) (Max) [Ω] @ |VGS| = 10.0 [V]        
Polarity N-ch×2 N-ch×2 N-ch×2 N-ch×2
System power circuit (Method without power controller)

Example of power supply control circuit without power management IC

Example of power supply control circuit without power management IC
TVS diode
器件型號
Toshiba Package Name SL2 CST2C SL2 SL2 SL2
VESD (Max) [kV] +/-30 +/-30 +/-16 +/-15 +/-8
IR (Max) [µA] 0.1 0.1 0.1 0.1 0.1
Rdyn (Typ.) [Ω] 0.2 0.08 0.7 0.7 1.05
CT (Typ.) [pF] @ VR = 0 [V], f = 1 [MHz] 8.5 270 0.15 0.15 0.12
Small signal MOSFET
器件型號
Toshiba Package Name UDFN6B UDFN6 UDFN6B
VDSS (Max) [V] 30 30 -30
ID (Max) [A] 15 4.0 -10
RDS(ON) (Max) [Ω] @ |VGS| = 4.5 [V] 0.012 0.064 0.028
Polarity N-ch N-ch×2 P-ch
Electronic fuse (eFuse IC)(1)
器件型號
Toshiba Package Name WSON10B WSON10B WSON10B
VIN (Max) [V] 18 18 18
RON (Typ.) [mΩ] 28 28 28
VOVC (Typ.) [V]   6.04 15.1
Recovery Operation Type Auto-retry Auto-retry Auto-retry
Electronic fuse (eFuse IC)(2)
器件型號
Toshiba Package Name WSON10B WSON10B WSON10B WSON10
VIN (Max) [V] 18 18 18 13.2
RON (Typ.) [mΩ] 28 28 28 53
VOVC (Typ.) [V]   6.04 15.1  
Recovery Operation Type Latch Latch Latch Latch
N-ch MOSFET gate driver IC(1)
器件型號
Toshiba Package Name WCSP6E WCSP6E WCSP6G WCSP6G WCSP6G
VOVL_FA (Typ.) [V]     27.56 23.14 14.17
VOVL_RI (Typ.) [V]     27.73 23.26 14.29
VGS (Typ.) [V] 8.5 8.5 10 10 10
N-ch MOSFET gate driver IC(2)
器件型號
Toshiba Package Name WCSP6G WCSP6G WCSP6G
VOVL_FA (Typ.) [V] 14.17 10.71 6.19
VOVL_RI (Typ.) [V] 14.29 10.83 6.31
VGS (Typ.) [V] 5.6 5.6 5.6
N-ch common drain MOSFET
器件型號
Toshiba Package Name TCSPED-302701 TCSPAC-153001 TCSP6A-172101 TCSPAG-341501
VDSS (Max) [V]        
ID (Max) [A]        
RDS(ON) (Max) [Ω] @ |VGS| = 10.0 [V]        
Polarity N-ch×2 N-ch×2 N-ch×2 N-ch×2
Audio unit circuit
Audio unit circuit

Example of ESD protection circuits for audio terminals and volume switch

Example of ESD protection circuits for audio terminals and volume switch
TVS diode
器件型號
Toshiba Package Name SL2 CST2C SL2 SL2 SL2
VESD (Max) [kV] +/-30 +/-30 +/-16 +/-15 +/-8
IR (Max) [µA] 0.1 0.1 0.1 0.1 0.1
Rdyn (Typ.) [Ω] 0.2 0.08 0.7 0.7 1.05
CT (Typ.) [pF] @ VR = 0 [V], f = 1 [MHz] 8.5 270 0.15 0.15 0.12
Touch sensor circuit
Touch sensor circuit (Optical type)

Example of ESD protection circuit in touch sensor circuit

Example of ESD protection circuit in touch sensor circuit
TVS diode
器件型號
Toshiba Package Name SL2 CST2C SL2 SL2 SL2
VESD (Max) [kV] +/-30 +/-30 +/-16 +/-15 +/-8
IR (Max) [µA] 0.1 0.1 0.1 0.1 0.1
Rdyn (Typ.) [Ω] 0.2 0.08 0.7 0.7 1.05
CT (Typ.) [pF] @ VR = 0 [V], f = 1 [MHz] 8.5 270 0.15 0.15 0.12
Touch sensor circuit (Capacitive type)

Example of ESD protection circuit in touch sensor circuit

Example of ESD protection circuit in touch sensor circuit
TVS diode
器件型號
Toshiba Package Name SL2 CST2C SL2 SL2 SL2
VESD (Max) [kV] +/-30 +/-30 +/-16 +/-15 +/-8
IR (Max) [µA] 0.1 0.1 0.1 0.1 0.1
Rdyn (Typ.) [Ω] 0.2 0.08 0.7 0.7 1.05
CT (Typ.) [pF] @ VR = 0 [V], f = 1 [MHz] 8.5 270 0.15 0.15 0.12
Display unit circuit
Display unit circuit

Example of interface circuit corresponding to display signal

Example of interface circuit corresponding to display signal
Small surface mount LDO regulator(1)
器件型號
Toshiba Package Name WCSP6F WCSP6F DFN5B DFN5B
IOUT (Max) [mA] 1500 1300 800 500
VOUT [V] 0.6 to 3.6 0.55 to 3.6 0.8 to 3.6 0.8 to 3.6
Small surface mount LDO regulator(2)
器件型號
Toshiba Package Name WCSP4F DFN4C WCSP4F ESV SMV
IOUT (Max) [mA] 500 300 300 200 200
VOUT [V] 0.9 to 5.0 0.9 to 4.5 0.8 to 5.0 0.8 to 3.6 1.5 to 5.0
Interface bridge
器件型號
Toshiba Package Name P-VFBGA64-0606-0.65-001 P-VFBGA81-0505-0.50-001 P-TFBGA65-0505-0.50-001 P-VFBGA72-0404-0.40A3
Product Category Display Interface Bridge Display Interface Bridge Display Interface Bridge Camera Interface Bridge
Schottky barrier diode
器件型號
Toshiba Package Name US2H CST2
VRRM (Max) [V]    
VR (Max) [V] 40 40
CT (Typ.) [pF] 300 28
TVS diode
器件型號
Toshiba Package Name SL2 CST2C SL2 SL2 SL2
VESD (Max) [kV] +/-30 +/-30 +/-16 +/-15 +/-8
IR (Max) [µA] 0.1 0.1 0.1 0.1 0.1
Rdyn (Typ.) [Ω] 0.2 0.08 0.7 0.7 1.05
CT (Typ.) [pF] @ VR = 0 [V], f = 1 [MHz] 8.5 270 0.15 0.15 0.12
Camera unit circuit
Camera unit circuit

Example of peripheral circuit of camera module (power supply and interface)

Example of peripheral circuit of camera module (power supply and interface)
Small surface mount LDO regulator(1)
器件型號
Toshiba Package Name WCSP6F WCSP6F DFN5B DFN5B
IOUT (Max) [mA] 1500 1300 800 500
VOUT [V] 0.6 to 3.6 0.55 to 3.6 0.8 to 3.6 0.8 to 3.6
Small surface mount LDO regulator(2)
器件型號
Toshiba Package Name WCSP4F DFN4C WCSP4F ESV SMV
IOUT (Max) [mA] 500 300 300 200 200
VOUT [V] 0.9 to 5.0 0.9 to 4.5 0.8 to 5.0 0.8 to 3.6 1.5 to 5.0
Interface bridge
器件型號
Toshiba Package Name P-VFBGA64-0606-0.65-001 P-VFBGA81-0505-0.50-001 P-TFBGA65-0505-0.50-001 P-VFBGA72-0404-0.40A3
Product Category Display Interface Bridge Display Interface Bridge Display Interface Bridge Camera Interface Bridge
TVS diode
器件型號
Toshiba Package Name SL2 CST2C SL2 SL2 SL2
VESD (Max) [kV] +/-30 +/-30 +/-16 +/-15 +/-8
IR (Max) [µA] 0.1 0.1 0.1 0.1 0.1
Rdyn (Typ.) [Ω] 0.2 0.08 0.7 0.7 1.05
CT (Typ.) [pF] @ VR = 0 [V], f = 1 [MHz] 8.5 270 0.15 0.15 0.12
Wireless communication circuit
Wireless communication circuit

Example of power supply and ESD protection circuit for Wi-Fi and LTE communication module

Example of power supply and ESD protection circuit for Wi-Fi<sup>Ⓡ</sup> and LTE communication module
Small surface mount LDO regulator(1)
器件型號
Toshiba Package Name WCSP6F WCSP6F DFN5B DFN5B
IOUT (Max) [mA] 1500 1300 800 500
VOUT [V] 0.6 to 3.6 0.55 to 3.6 0.8 to 3.6 0.8 to 3.6
Small surface mount LDO regulator(2)
器件型號
Toshiba Package Name WCSP4F DFN4C WCSP4F ESV SMV
IOUT (Max) [mA] 500 300 300 200 200
VOUT [V] 0.9 to 5.0 0.9 to 4.5 0.8 to 5.0 0.8 to 3.6 1.5 to 5.0
TVS diode
器件型號
Toshiba Package Name SL2 CST2C SL2 SL2 SL2
VESD (Max) [kV] +/-30 +/-30 +/-16 +/-15 +/-8
IR (Max) [µA] 0.1 0.1 0.1 0.1 0.1
Rdyn (Typ.) [Ω] 0.2 0.08 0.7 0.7 1.05
CT (Typ.) [pF] @ VR = 0 [V], f = 1 [MHz] 8.5 270 0.15 0.15 0.12
Over temperature monitoring circuit
Over temperature monitoring circuit 

Example of multi-point over temperature monitoring circuit

Example of multi-point over temperature monitoring circuit
Over temperature detection IC (ThermoflaggerTM )(1)
器件型號
Toshiba Package Name ESV ESV ESV ESV
VDD (Min) [V] 1.7 1.7 1.7 1.7
VDD (Max) [V] 5.5 5.5 5.5 5.5
IDD (Typ.) [µA] @ Tj = 25 [°C] 1.8 1.8 11.3 11.3
IPTCO (Typ.) [µA] @ Tj = 25 [°C] 1 1 10 10
FLAG Signal Output Push-pull Push-pull Push-pull Push-pull
Over temperature detection IC (ThermoflaggerTM )(2)
器件型號
Toshiba Package Name ESV ESV ESV ESV
VDD (Min) [V] 1.7 1.7 1.7 1.7
VDD (Max) [V] 5.5 5.5 5.5 5.5
IDD (Typ.) [µA] @ Tj = 25 [°C] 1.8 1.8 11.3 11.3
IPTCO (Typ.) [µA] @ Tj = 25 [°C] 1 1 10 10
FLAG Signal Output Open drain Open drain Open drain Open drain

解決方案

這些文件說明推薦的半導體產品的要點及其特徵,方便產品選擇。

參考設計

PCB photo example of Power multiplexer circuit
Power Multiplexer Circuit Using Common-Drain MOSFET
This power multiplexer circuit with 2 inputs and 1 output is realized on a small board. A new power multiplexer circuit usign common-drain MOSFET has been added to the already developed power multiplexer circuit reference design. These reference circuits allow switching between BBM and MBB modes by combining optimal devices such as MOSFET gate driver ICs and zener diodes from our diverse product lineup.
Power multiplexer circuit / 2 input and 1 output
Over Temperature Detection IC ThermoflaggerTM Application Circuit (TCTH021AE / Push-pull type)
This reference design provides design guide, data and other contents of Over Temperature Detection IC ThermoflaggerTM Application Circuits (TCTH021AE / Push-pull type). In combination with PTC thermistor(s), the ThermoflaggerTM can be used to detect over temperature at multiple locations within a device. Details of other application circuits of the ThermoflaggerTM are also provided.
Over Temperature Detection IC ThermoflaggerTM Application Circuit (TCTH021BE / Open-drain type)
This reference design provides design guide, data and other contents of Over Temperature Detection IC ThermoflaggerTM Application Circuit (TCTH021BE / Open-drain type). In combination with PTC thermistor(s), this ThermoflaggerTM can be used to detect over temperature at multiple locations within a device.
PCB photo example of Power multiplexer circuit
Power multiplexer circuit
In this reference design, a Power multiplexer circuit with 2 input and 1 output is implemented on a small PCB. MOSFET gate driver ICs, eFuse ICs, zener diodes and small package MOSFETs selected from Toshiba's diverse lineup are used create ideal diode like characteristics with BBM and MBB switching.
Power multiplexer circuit / 2 input and 1 output
Photo of non-isolated buck DC-DC converter.
Non-Isolated Buck DC-DC Converter
This reference design provides design guide, data and other contents of multiple non-isolated buck DC-DC converter power supplies. Multiple variations of the power supply are optimized for various outputs, loads and board mounting areas.
Reference Design Center
Power supply circuit example of LDO regulator TCR3UG series application for power supply of IoT devices.
LDO Regulator TCR3UG Series Application for Power Supply of IoT Devices
This reference design provides document with low consumption current, PSRR, and dynamic response.The LDO has small package, low consumed power, and fast load transient response.
LDO Regulator / TCR3UG
Power supply circuit example of LDO regulator TCR15AG (fixed output voltage type) application & circuit.
LDO Regulator TCR15AG (fixed output voltage type) Application & Circuit
This reference design provides document with PSRR, dynamic response and controlling output voltage.The LDO has very small package and fixed output voltage for consumer application.
LDORegulator / TCR15AG
Power supply circuit example of LDO regulator TCR15AGADJ application & circuit.
LDO Regulator TCR15AGADJ Application & Circuit
This reference design provides document with PSRR, dynamic response and controlling output voltage. The LDO has very small package and adjustable output for consumer application.
LDO Regulator / Design / Support / Reference Design Center

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  • MIPI®, CSI-2® and DSI® are registered service marks of MIPI Alliance, Inc. DPISM is service mark of MIPI Alliance, Inc.
  • DisplayPort™ and the DisplayPort™ logo are trademarks owned by the Video Electronics Standards Association (VESA®) .
  • Wi-Fi is a registered trademark of Wi-Fi Alliance.
  • ThermoflaggerTM is a trademark of Toshiba Electronic Devices & Storage Corporation.
  • Other company names, product names, and service names may be trademarks of their respective companies.
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