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When ESD energy enters a circuit, an ESD protection diode turns on, shunting large current to GND. The voltage across the diode during an ESD event is defined as clamp voltage, VC. While the ESD protection diode is on, it can be regarded as being connected in parallel with the device under protection (DUP). It should be noted that a small amount of time is required for the ESD protection diode to turn on.
Therefore, ESD energy is applied to the DUP until the ESD protection diode turns on. Even after the ESD protection diode turns on, a voltage lower than its reverse breakdown voltage is applied to the DUP. The currents that flow to the ESD protection diode and the DUP are inversely proportional to their respective impedances. The impedance of the ESD protection diode during the “on” state is defined as dynamic resistance.
There are various types of ESD protection devices. ESD protection diodes have the following characteristics:
Figure 5 compares the performance of three ESD protection diodes with different clamp voltage (VC) specifications, showing the voltage measured at the input of the DUP after an ESD entry. Figure 5 should be considered merely as a guide as these waveforms are the results of ESD application to a connector, not to the end of an antenna. Although the DF2B5M5SL and DF2B5M4SL provide similar clamp voltages (VC), their first peak voltages differ roughly by 50%.
Figure 5 Effects of clamp voltage on ESD protection performance
(ESD protection diodes with different clamp voltage specifications)
The following are the considerations for preventing the degradation or destruction of the DUP:
The second requirement above contradicts the third requirement described in Section 1 (VRWM higher than the maximum signal amplitude). In order to enhance the overall ESD tolerance of a system, check the ESD tolerance of the RF IC and select an ESD protection diode capable of absorbing ESD energy exceeding the ESD tolerance.