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About information presented in this cross reference

The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

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IEGT (PPI)

Press-Pack IEGT縮寫為PPI。 PPI是帶有內置IEGT晶片的壓焊大功率元件。 PPI通過低損耗晶片和高可靠性封裝,此產品有助於節能,小型化和設備效率。

Press-Pack IEGTs (PPIs)
將多個IEGT晶片以陣列放置在同一平面上,並使用鉬板從兩側均勻地壓制單個IEGT晶片。通過施加機械壓力,每個IEGT芯片的集電極和發射電極通過鉬板與壓裝盒外殼的相應銅電極接觸。這不僅可以進行電氣連接,還可以散熱。
PPI Structure and Cross-Sectional View Of a PPI
Principle of Operation
IEGT是一種高功率元件,可以通過馬達驅動來控制大電流,通過設計IGBT *發射極的元件結構,可以改善隨集電極-發射極電壓增加而導通電壓的急劇增加。

*IGBT: Insulated Gate Bipolar Transistor
Cross-Sectional View of and Carrier Distribution in an IEGT

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