This webpage doesn't work with Internet Explorer. Please use the latest version of Google Chrome, Microsoft Edge, Mozilla Firefox or Safari.
型號需要超過三個文字以上
The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
型號需要超過三個文字以上
Describes the heat dissipation designs for the audio power IC.
Fig. 1 shows the thermal model and the name of each part of the package. Each symbol represents as follows.
Pd: IC power dissipation
Ta: Operating Ambient Temperature
Tj: Junction temperature
Tc: case temperature
Ttab: tab temperature (temperature of the heatsink of the audio power IC)
Rth(j-c): Thermal Resistance between Junction-case
Rth(j-t): Thermal Resistance between Junction-tab
Rth(c-a): Thermal Resistance between case-Ambient
Rth(HS): Thermal resistance of the heat sink (external heat sink)
This section describes the procedure in detail to obtain the size of the external heatsink, whose Rth(HS) (thermal resistance of the external heat sink) makes Tj be less than 150 °C, when the output power per channel is 4W and Ta is 40 °C for HZIP25 products
First, read the power dissipation when the output power per channel is 4W from Fig. 2. (Pd=15.3W)
Next, find the required Rth(HS) value of the thermal resistance of external heat sink by using the following equation.
The thermal resistance between junction and tab, Rth(j-t), of HZIP25 package is 1.0°C/W as shown in the data sheet.
Tj > (Rth(j-t) + Rth(HS)) * Pd + Ta
150 > (1.0 + Rth(HS)) * 15.3 + 40
Rth(HS) < 4.88 ℃/W
Then, read the required size of the external heat sink by using Fig. 3.
It can be estimated that 121cm^2 and more are required for 2mm aluminum plate.
The data sheet for each product shows Fig. 2 used in the above explanation, and Fig. 3 is available on the website of the manufacturer of the heat sink (external heat sink).
The following documents also contain related information.