3-23. Datasheets of MOSFET: Maximum Ratings

<Absolute maximum ratings>

  • Drain-source voltage (VDSS)
    Maximum voltage of drain to source that can be applied
  • Gate-source voltage(VGSS)
    Maximum voltage of drain to source that can be applied
    Circuit must be designed not to exceed this voltage including surge voltage.
  • Drain current (ID)
    Maximum drain current
  • Drain current (pulsed) (IDP)
    Maximum pulsed drain current
    Normally, pulse width is described in safe operating area.
  • Power dissipation (PD)
    Power loss allowed to generate in the device
    Allowable thermal capability at Tc=25℃.
  • Avalanche energy, single-pulse and continuous (EAS)
    Maximum allowed energy under designated condition
  • Avalanche current (IAR)
    Maximum current at avalanche operation
  • Channel temperature (Tch)
    Maximum channel temperature at which the device can operate
  • Storage temperature (Ttsg)
    Temperature range for storage without operating the MOSFET
Absolute maximum ratings

Note 1: Ensure that the channel temperature does not exceed 150℃.
Note 2: VDD = 90 V, Tch = 25℃(initial), L = 4.36 mH, RG = 25 Ω, IAR = 3.0 A
Note 3: Repetitive rating: pulse width limited by maximum channel temperature This transistor is an electrostatic-sensitive device. Please handle with caution.

Chapter III : Transistors

3-1. Types of Transistors
3-2. Bipolar Transistors (BJTs)
3-3. Bias Resistor Built-in Transistors (BRTs)
3-4. Junction Field-Effect Transistors (JFETs)
3-5. Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs)
3-6. Differences between BJT and MOSFET
3-7. Structure and Operation of MOSFET
3-8. MOSFET Performance Improvement: Decision Factors of RDS(ON)
3-9. MOSFET Performance Improvement: Approach to Low RDS(ON)
3-10. MOSFET Performance Improvement: Super-Junction MOSFETs (SJ-MOS)
3-11. Summary of MOSFET Features by Structure
3-12. Performance of MOSFETs: Drain Current and Power Dissipation
3-13. Performance of MOSFETs: Avalanche Capability
3-14. Performance of MOSFETs: Characteristic of Capacitance
3-15. Performance of MOSFETs: Safe Operating Area(or Area of Safe Operation)
3-16. Insulated-Gate Bipolar Transistors (IGBTs)
3-17. Operation of Insulated-Gate Bipolar Transistors (IGBTs)
3-18. Performance Improvement of IGBTs: Evolution of Vertical Design
3-19. What are RC-IGBTs and IEGTs?
3-20. Application of IGBTs
3-21. Comparison of Forward Characteristics of IGBTs and MOSFETs
3-22. Comparison of Transistors by Structure
3-24. Datasheets of MOSFET: Electrical Characteristics
3-25. Datasheets of MOSFET: Capacitance and Switching Characteristics
3-26. Datasheets of MOSFET: Body Diode

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