車用 MOSFETs

東芝提供了廣泛的功率MOSFET產品系列，以涵蓋12V至48V電池系統中的各種汽車應用。東芝開發了最新的晶圓製程來抑制開關噪音。並與低電阻封裝技術相結合，可以達到業界領先的低導通電阻水平。這種低電阻有助於減少能量損失並縮小應用。

產品陣容

You can narrow down the search for applicable products by selecting specifications.

VDSS(V)
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ID(A)
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Package name (Toshiba)
RDS(ON)Max(Ω)|VGS|=10V
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RDS(ON)Max(Ω)|VGS|=4.5V
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Results:

You can narrow down your search for applicable products by package type or number of pins.

unit:
SOT-723 (VESM)

Package Size

W : 1.2 mm 0.047 inch
L : 1.2 mm 0.047 inch
H : 0.5 mm 0.020 inch
SOT-416 (SSM)

Package Size

W : 1.6 mm 0.063 inch
L : 1.6 mm 0.063 inch
H : 0.7 mm 0.028 inch
SOT-323F (UFM)

Package Size

W : 2.0 mm 0.079 inch
L : 2.1 mm 0.083 inch
H : 0.7 mm 0.028 inch
SOT-323 (USM)

Package Size

W : 2.0 mm 0.079 inch
L : 2.1 mm 0.083 inch
H : 0.9 mm 0.035 inch
SOT-23F

Package Size

W : 2.9 mm 0.11 inch
L : 2.4 mm 0.094 inch
H : 0.8 mm 0.031 inch
SOT-346 (S-Mini)

Package Size

W : 2.9 mm 0.11 inch
L : 2.5 mm 0.098 inch
H : 1.1 mm 0.043 inch
DPAK+

Package Size

W : 6.5 mm 0.26 inch
L : 9.5 mm 0.37 inch
H : 2.3 mm 0.091 inch
SOT-563 (ES6)

Package Size

W : 1.6 mm 0.063 inch
L : 1.6 mm 0.063 inch
H : 0.55 mm 0.022 inch
SOT-1118 (UDFN6)

Package Size

W : 2.0 mm 0.079 inch
L : 2.0 mm 0.079 inch
H : 0.75 mm 0.030 inch
SOT-1220 (UDFN6B)

Package Size

W : 2.0 mm 0.079 inch
L : 2.0 mm 0.079 inch
H : 0.75 mm 0.030 inch
SOT-363F (UF6)

Package Size

W : 2.0 mm 0.079 inch
L : 2.1 mm 0.083 inch
H : 0.7 mm 0.028 inch
SOT-363 (US6)

Package Size

W : 2.0 mm 0.079 inch
L : 2.1 mm 0.083 inch
H : 0.9 mm 0.035 inch
TSOP6F

Package Size

W : 2.9 mm 0.11 inch
L : 2.8 mm 0.11 inch
H : 0.8 mm 0.031 inch
S-TOGL™

Package Size

W : 7.0 mm 0.28 inch
L : 8.44 mm 0.33 inch
H : 2.3 mm 0.091 inch
TSON Advance(WF)

Package Size

W : 3.1 mm 0.12 inch
L : 3.6 mm 0.14 inch
H : 0.85 mm 0.033 inch
DSOP Advance(WF)L

Package Size

W : 5.0 mm 0.20 inch
L : 6.0 mm 0.24 inch
H : 0.76 mm 0.030 inch
DSOP Advance(WF)M

Package Size

W : 5.0 mm 0.20 inch
L : 6.0 mm 0.24 inch
H : 0.76 mm 0.030 inch
SOP Advance(WF)

Package Size

W : 5.0 mm 0.20 inch
L : 6.0 mm 0.24 inch
H : 0.95 mm 0.037 inch
L-TOGL™

Package Size

W : 9.9 mm 0.39 inch
L : 11.81 mm 0.46 inch
H : 2.3 mm 0.091 inch

All package dimensions are guaranteed in millimeters as mentioned on datasheet. Package dimension in inches is round to 2 significant digits converted with 1mm=0.0393701inch.

型號需要超過三個文字以上

About information presented in this cross reference

The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

Technical Articles

MOSFETs / Automotive MOSFETs

Switching characteristics of the N-ch U-MOS series
The U-MOSVIII series suppresses VDS ringing by tuning Coss and Rs, thereby reducing EMI noise.

MOSFETs / Automotive MOSFETs

Process Trends of Automotive MOSFETs
The combination of small-geometry trench process technology and low-resistance packaging technology, such as Cu connector bonding, achieves industry-leading low on-resistance.

MOSFETs / Automotive MOSFETs

Package Trends of Automotive MOSFETs
DPAK+, DSOP Advance (WF), SOP Advance (WF), and TSON Advance (WF) adopt Cu connector structures, realizing high current conduction capability.

MOSFETs / Automotive MOSFETs

Automotive applications drive miniaturization of small MOSFET sets
This feature combines trench microfabrication and low-resistance packaging technologies to replace conventional power MOSFET areas, thereby contributing to the miniaturization of power sets.

文件下載

名稱 日期

應用

Automotive DC-DC Converter
Such as reduction of power consumption and miniaturization are important in designing DC-DC converter. Toshiba provides information on a wide range of semiconductor products suitable for step-up or step-down DC-DC converter units, etc., along with circuit configuration examples.
詳細資料
Inverter for xEV
Such as reduction of power consumption and miniaturization are important in designing xEV inverter. Toshiba provides information on a wide range of semiconductor products suitable for motor drive circuit units, etc., along with circuit configuration examples.
詳細資料
Battery Management System for Automotive
Such as reduction of power consumption and miniaturization are important in battery management system. Toshiba provides information on a wide range of semiconductor products suitable for charging circuit, cell balancing circuit, battery monitoring circuit, etc., along with circuit configuration examples.
詳細資料
Automotive Electric Pump (Water/Oil)
Such as ensuring tolerance to motor lock current and reduction of power consumption are important in electric pump (water/oil). Toshiba provides information on a wide range of semiconductor products suitable for motor drive unit, power supply unit, etc., along with circuit configuration examples.
詳細資料
Advanced Driver-Assistance Systems (ADAS)
Such as reduction of power supply and signal noise and reduction of power consumption are important in designing ADAS. Toshiba provides information on a wide range of semiconductor products suitable for image input units, power supply units, data transmission and audio output units, etc., along with circuit configuration examples.
詳細資料
Automotive Brake Control
Such as reduction of power consumption and miniaturization are important in designing brake control. Toshiba provides information on a wide range of semiconductor products suitable for brake actuator unit, motor driving unit and power supply units, etc., along with circuit configuration examples.
詳細資料
Automotive Integrated Starter Generator
Such as ensuring tolerance to motor lock current and reduction of power consumption are important in designing ISG. Toshiba provides information on a wide range of semiconductor products suitable for motor drive units, communication units, power supply units, etc., along with circuit configuration examples.
詳細資料
Automotive Electric Turbocharger
Such as ensuring tolerance to motor lock current and reduction of power consumption are important in designing electric turbocharger. Toshiba provides information on a wide range of semiconductor products suitable for motor drive units, communication units, etc., along with circuit configuration examples.
詳細資料
Automotive On-board Charger
Such as reduction of power consumption and miniaturization of circuit boards are important in designing on-board charger. Toshiba provides information on a wide range of semiconductor products suitable for DC-DC converter units, power supply units, etc., along with circuit configuration examples.
詳細資料
Automotive Electro Active Suspension
Such as reduction of power consumption and miniaturization are important in designing electro active suspension. Toshiba provides information on a wide range of semiconductor products suitable for motor drive units, power supply units, etc., along with circuit configuration examples.
詳細資料
Automotive Engine Control
Such as reduction of power consumption and miniaturization are important in designing engine control. Toshiba provides information on a wide range of semiconductor products suitable for power management circuit, injector drive circuit, actuator drive circuit, etc., along with circuit configuration examples.
詳細資料
IVI (In-vehicle Infotainment)
Such as information sharing and reduction of power consumption are important in designing IVI. Toshiba provides information on a wide range of semiconductor products suitable for display and audio output section, video and voice input section, wireless communications section, etc., along with circuit configuration examples.
詳細資料
Automotive HVAC
Such as ensuring tolerance to motor lock current and reduction of power consumption are important in designing HVAC. Toshiba provides information on a wide range of semiconductor products suitable for motor drive units, power supply units, etc., along with circuit configuration examples.
詳細資料
Automotive LED Headlamp
Such as reduction of power consumption and miniaturization of circuit boards are important in designing LED headlamp. Toshiba provides information on a wide range of semiconductor products suitable for LED matrix control units, power supply units, etc., along with circuit configuration examples.
詳細資料
Automotive Power Slide Door
Such as ensuring tolerance to motor lock current and reduction of power consumption are important in power sliding door. Toshiba provides information on a wide range of semiconductor products suitable for motor drive unit, power supply unit, etc., along with circuit configuration examples.
詳細資料
Automotive V2X
Such as reduction of power supply and signal noise and reduction of power consumption are important in designing V2X. Toshiba provides information on a wide range of semiconductor products suitable for RF block units, power supply units, etc., along with circuit configuration examples.
詳細資料
Automotive Radiator Fan
Such as ensuring tolerance to motor lock current and reduction of power consumption are important in designing radiator fan. Toshiba provides information on a wide range of semiconductor products suitable for motor drive units, communication units, etc., along with circuit configuration examples.
詳細資料
Automotive USB Power Charger
Such as reduction of power supply and signal noise and reduction of power consumption are important in designing USB power charger. Toshiba provides information on a wide range of semiconductor products suitable for circuit for cigar socket or accessory circuits, etc., along with circuit configuration examples.
詳細資料
Head-up Display (HUD)
Such as reduction of noise on signal line, reduction of power consumption and miniaturization are important in designing head-up display. Toshiba provides information on a wide range of semiconductor products suitable for motor drive units, power supply units, etc., along with circuit configuration examples.
詳細資料
Electric Power Steering
Such as ensuring tolerance to motor lock current and reduction of power consumption are important in designing electric power steering. Toshiba provides information on a wide range of semiconductor products suitable for motor drive units, power supply units, etc., along with circuit configuration examples.
詳細資料
Transmission Management
Such as reduction of power consumption and miniaturization are important in designing transmission management. Toshiba provides information on a wide range of semiconductor products suitable for motor drive units, power supply units, mechanical relay drive units, etc., along with circuit configuration examples.
詳細資料

參考設計

Automotive Brushed DC Motor Control Circuit Using TB9103FTG
The Automotive Brushed DC Motor Control Circuit Using TB9103FTG can control two motors in half-bridge mode or one motor in H-bridge mode. The Motor can be controlled using onboard switches or an external MCU. This reference design provides design guide, data, and other contents.
詳細資料
Automotive Buck-Boost DC-DC Converter for USB PD
This reference design provides design guide, data and other contents of Automotive Buck-Boost DC-DC Converter for USB PD.
詳細資料
Photo of Matrix LED Headlight
Matrix LED Headlight
This reference design provides design guide, data and other contents of LED Matrix Headlight. It controls the lighting of multiple LEDs independently according to the situation.
Reference Design Center
詳細資料

Simulation

PSpice®
Parametric Search

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