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  • Discrete Semiconductor Device
  • Chapter I : Basis of Semiconductors : p-type Semiconductor
  • Chapter I : Basis of Semiconductors : What is a Compound Semiconductor?
  • Chapter I : Basis of Semiconductors : What is a pn Junction?
  • Chapter I : Basis of Semiconductors : Types of Semiconductor Devices
  • Chapter I : Basis of Semiconductors : What is a Semiconductor?
  • Chapter I : Basis of Semiconductors : Semiconductor Materials
  • Chapter I : Basis of Semiconductors : n-type Semiconductor
  • Chapter II : Diodes : Types of Diodes
  • Chapter II : Diodes : Characteristics Application of Various Diodes
  • Chapter II : Diodes : Schottky Barrier Diodes (SBDs)
  • Chapter II : Diodes : Functions of Rectifier Diodes
  • Chapter II : Diodes : Reverse Recovery Characteristic of Schottky Barrier Diodes (SBDs)
  • Chapter II : Diodes : TVS diode (ESD protection diode)
  • Chapter II : Diodes : Difference Depending on Metal of Schottky Barrier Diodes (SBDs)
  • Chapter II : Diodes : Forward Characteristic of Rectifier Diodes (IF-VF Characteristic)
  • Chapter II : Diodes : Difference between TVS Diodes and Zener Diodes (2)
  • Chapter II : Diodes : Variable-capacitance Diodes (Varicap Diodes)
  • Chapter II : Diodes : Difference between TVS Diodes and Zener Diodes (1)
  • Chapter II : Diodes : FRDs (Fast Recovery Diodes)
  • Chapter II : Diodes : Voltage Regulator Diodes (Zener Diodes)
  • Chapter III : Transistors : Types of Transistors
  • Chapter III : Transistors : Performance of MOSFETs: Characteristic of Capacitance
  • Chapter III : Transistors : Performance of MOSFETs: Safe Operating Area(or Area of Safe Operation)
  • Chapter III : Transistors : Bipolar Transistors (BJTs)
  • Chapter III : Transistors : Bias Resistor Built-in Transistors (BRTs)
  • Chapter III : Transistors : Junction Field-Effect Transistors (JFETs)
  • Chapter III : Transistors : Application of IGBTs
  • Chapter III : Transistors : Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs)
  • Chapter III : Transistors : Differences between BJT and MOSFET
  • Chapter III : Transistors : Structure and Operation of MOSFET
  • Chapter III : Transistors : MOSFET Performance Improvement: Decision Factors of RDS(ON)
  • Chapter III : Transistors : MOSFET Performance Improvement: Approach to Low RDS(ON)
  • Chapter III : Transistors : MOSFET Performance Improvement: Super-Junction MOSFETs (SJ-MOS)
  • Chapter III : Transistors : Summary of MOSFET Features by Structure
  • Chapter III : Transistors : Performance of MOSFETs: Drain Current and Power Dissipation
  • Chapter III : Transistors : Performance of MOSFETs: Avalanche Capability
  • Chapter III : Transistors : Comparison of Forward Characteristics of IGBTs and MOSFETs
  • Chapter III : Transistors : Insulated-Gate Bipolar Transistors (IGBTs)
  • Chapter III : Transistors : Operation of Insulated-Gate Bipolar Transistors (IGBTs)
  • Chapter III : Transistors : Performance Improvement of IGBTs:Evolution of Vertical Design
  • Chapter III : Transistors : What are RC-IGBTs and IEGTs?
  • Chapter III : Transistors : Comparison of Transistors by Structure
  • Chapter III : Transistors : Datasheets of MOSFET: Maximum Ratings
  • Chapter III : Transistors : Datasheets of MOSFET: Electrical Characteristics
  • Chapter III : Transistors : Datasheets of MOSFET: Capacitance and Switching Characteristics
  • Chapter III : Transistors : Datasheets of MOSFET: Body Diode
  • Chapter IV : Local Power Supply ICs : Operation of Switching Regulators
  • Chapter IV : Local Power Supply ICs : Why POL Supply ICs Are Wanted?
  • Chapter IV : Local Power Supply ICs : Functions of LDO
  • Chapter IV : Local Power Supply ICs : Types of Local Power Supply ICs
  • Chapter IV : Local Power Supply ICs : Load Switch IC
  • Chapter IV : Local Power Supply ICs : Functions of Load Switch IC
  • Chapter IV : Local Power Supply ICs : Power Management IC
  • Chapter IV : Local Power Supply ICs : Operation of Linear Regulators
  • Chapter IV : Local Power Supply ICs : Example of Power Line Structure in a System
  • Chapter V : Optical Semiconductors : Types of Optical Semiconductors
  • Chapter V : Optical Semiconductors : Characteristics of Photocouplers(Current Transfer Ratio: CTR)
  • Chapter V : Optical Semiconductors : Principal Characteristics of Photocouplers(Trigger LED Current)
  • Chapter V : Optical Semiconductors :Aging Variation Data of Photocouplers
  • Chapter V : Optical Semiconductors : How to Use a Photocoupler
  • Chapter V : Optical Semiconductors : Types of Photocouplers
  • Chapter V : Optical Semiconductors : Types of Photocouplers (Internal Structure)
  • Chapter V : Optical Semiconductors : How to Use a Photocoupler “Output-Side Resistor”
  • Chapter V : Optical Semiconductors : Types of Photocouplers (Packages)
  • Chapter V : Optical Semiconductors : The wavelength range of LEDs
  • Chapter V : Optical Semiconductors : Safety Standards of Photocouplers
  • Chapter V : Optical Semiconductors : How to Use a Photocoupler “Input Current”
  • Chapter V : Optical Semiconductors : How to Use a Photocoupler Check
  • Chapter V : Optical Semiconductors : How to Use a Photocoupler “Output Current”
  • Chapter V : Optical Semiconductors : What Is a Photocoupler?
  • Chapter V : Optical Semiconductors : Why Are Photocouplers Necessary?
  • Chapter V : Optical Semiconductors : Light-Emitting Principal of LEDs
  • Problem-Solving Examples
  • Case 1: Selection of a MOSFET to meet power supply specifications: DC-DC converter
  • Case 2: Selection of a MOSFET to increase the withstand voltage margin: Power supply product
  • Case 3: Selection of a MOSFET to improve the efficiency of a server power supply
  • Case 4: EMI noise solutions based on the results of simulation
  • Case 5: Using a photocoupler to solve a problem of an industrial robot caused by overcurrent
  • Case 6: Using a solid-state relay to reduce the size and prolong the service life of power supply units for Programmable Logic Controller (PLC)
  • Example of Toshiba’s Solution for a Customer’s Problem
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  • Frequently Asked Questions (FAQs)
  • Diodes
  • Absolute Maximum Ratings
  • Are there any reasons why junction-to-case (or channel-to-case) thermal resistance is not specified for small-signal devices housed in small packages?
  • Are there any special considerations for temperature?
  • Are there any special considerations for the temperature coefficients of a Zener diode?
  • Are there any special considerations for using switching diodes?
  • Definitions of the Terms in the Electrical Characteristics Table
  • Do SBDs have reverse recovery characteristic (trr)?
  • For what purposes are Zener diodes used?
  • How can I calculate the junction-to-ambient thermal resistance, Rth(j-a), of a small-signal diode?
  • How can I distinguish between the anode and cathode terminals?
  • How can I use a Zener diode to create a relatively constant voltage that is not affected significantly by changes in temperature and supply voltage?
  • How do diodes work?
  • In what kinds of applications are fast recovery diodes (FRDs) used?
  • In what kinds of circuits are Zener diodes used?
  • Is it OK to connect multiple diodes with the same part number in parallel?
  • Is it OK to connect multiple Zener diodes in parallel?
  • Is it OK to connect multiple Zener diodes in series?
  • Is it possible to use Zener diodes in the same manner as typical diodes?
  • What are diodes?
  • What are Schottky barrier diodes (SBDs)?
  • What are the characteristics Zener voltage?
  • What are the key characteristics of a varicap diode?
  • What happens if trr is large?
  • What is an FRD?
  • What is an HED?
  • What is a switching diode?
  • What is a variable capacitance diode (varicap diode)?
  • What is a Zener diode?
  • What is the difference between rectifier diodes and general switching diodes?
  • What is the forward voltage (VF) of an SBD?
  • What is the impedance of a Zener diode?
  • What is the operation frequency when using FRDs?
  • What is trr?
  • What is trr level of FRD?
  • What kinds of characteristics does an SBD have?
  • What types of diodes exist?
  • Why is no operating temperature range specified?
  • General-Purpose Linear ICs
  • How does a boost converter work?
  • How does a buck converter work?
  • In what parts are power supply ICs used?
  • What kinds of local power supply ICs exist?
  • What kinds of switching-type local power supply ICs (switching regulators) exist?
  • Optical Semiconductor Devices
  • What is a photocoupler?
  • Why is a photocoupler necessary?
  • What types of photocouplers are available?
  • What is the internal structure of a photocoupler?
  • How many volts can be applied to the input side LED?
  • Is it possible to use a photocoupler in such a way that for items such as the LED current, output current, and output voltage, the value specified for the absolute maximum rating is exceeded for a short time?
  • What are the parameters specific to photocoupler and photorelay optical isolation devices, transfer ratio (CTR), trigger LED current, and threshold input current?
  • How are the current transfer ratio (CTR), trigger LED current, and threshold input current measured?
  • For a photocoupler and photorelay incorporating a LED device, in designing equipment, which should be considered: LED life or photodetector life?
  • A photocoupler is an isolation device. What is dielectric strength, which indicates its insulation capability?
  • What is the difference between a photocoupler and a photorelay?
  • What are the safety standards required for photocouplers?
  • What are required by safety standards applicable to photocouplers? How are they specified in products?
  • How can I find safety standard authentication information about photocouplers?
  • What is the current transfer ratio?
  • What is the CTR classification by rank?
  • Why are there two current transfer ratios: CTR and CTR (Saturation)?
  • What is the difference between a dark current and OFF-state collector current?
  • Why is VECO very low (0.3V) for Darlington transistors such as TLP187 and TLP387? What precautions should be taken when using such transistors?
  • In designing a circuit using a transistor coupler, how should the current transfer ratio be reflected?
  • How should a circuit driving the LED of a transistor coupler be selected?
  • In a circuit using a transistor coupler, how should load resistance be selected?
  • How many volts are minimally required for transistor couplers to operate?
  • How many milliamps are minimally required for transistor couplers to operate?
  • Up to what frequency can transistor couplers transmit signals?
  • For a transistor coupler with the base terminal, if not using the base terminal, is it OK to keep the base terminal open and do nothing?
  • For IC couplers, there is a requirement related to common-mode transient immunity. However, for transistor couplers, such a requirement does not exist. Why?
  • What is the threshold input current?
  • In designing a circuit using an IC coupler, how should the threshold input current be reflected?
  • How should a circuit driving the LED at the input side of an IC coupler be selected?
  • In a circuit using a high-speed IC coupler, how should output pull-up resistance be selected?
  • For example, for 1Mbps-type IC couplers such as TLP109 and TLP759 to operate, how many volts are minimally required?
  • For IC couplers, some products are defined with a threshold input current, and others are defined with a current transfer ratio. What is the difference between them?
  • Is a bypass capacitor required between the VCC and GND terminals?
  • How should a frequency for signals that can be transmitted by a high-speed IC coupler be estimated?
  • What is the UVLO function?
  • Is there any problem with waveforms with input signals rising or falling gently?
  • What is the difference between the open collector output type and the totempole output type? Also, what precautions should be taken for use?
  • What is the voltage range in which IC couplers can operate?
  • What is common-mode transient immunity? Why is this required for IC couplers?
  • How can I find the resistance values when the photorelay is OFF and when it is ON?
  • Up to what level of voltage can be used at the switch section of a photorelay?
  • How much input current should be passed for switch operation?
  • Up to what level of current can be used at the switch section of a photorelay? Also, for a pulsed current or AC current, what happens?
  • For signals to be switched, up to what frequency can be used?
  • How long does it take from when an input signal enters until the switch changes?
  • Can photorelays be used by series connections or parallel connections? If yes, what points require attention?
  • What is the CR product of the photorelay?
  • Can photorelays be replaced with and used in the same way as mechanical relays? What is the difference, if any?
  • What are Form A contacts and Form B contacts in a photorelay? Also, what are A, B, and C connections? What is the difference?
  • For what purposes are triac couplers used?
  • What precautions should be taken when replacing mechanical relays with triac couplers?
  • What are the differences among triac couplers, SSR (solid state relays), and photorelays?
  • What is the difference between zero-cross triac couplers and non-zero-cross triac couplers? How should they be used properly?
  • What precautions should be taken when performing phase control with triac couplers?
  • For triac couplers, how should a VDRM (400V, 600V, 800V) be selected?
  • How much input current should be set for turning the triac ON/OFF?
  • What precautions should be taken when using triac couplers for a long time?
  • How should values be selected for the constants for the snubber circuit connected to the triac?
  • When using a triac coupler to drive the main triac, how should the current limiting resistor RT directly connected to the triac be determined?
  • Can high-frequency signals be switched ON/OFF with a triac coupler?
  • When controlling a load with a triac coupler, can a load be controlled even if using a rectangular wave power supply at the load side instead of a sinusoidal wave (AC) power supply?
  • What are fiber couplers (TOSLINK?) used for?
  • What are the characteristics of optical transmission?
  • What is a fiber coupler (TOSLINK™)?
  • What is optical fiber?
  • What is optical transmission?
  • What types of optical connectors are available?
  • MOSFETs / Bipolar Transistors
  • A dotted line in a safe operating area is annotated as “This area is limited by RDS(ON).” What does it mean?
  • Aren't there maximum guaranteed values for capacitance, gate charge (Qg) and switching characteristics?
  • Are there any reasons why forward transfer admittance,
  • Are there any special considerations for using MOSFETs?
  • Electrical characteristics of MOSFETs (Static Characteristics IGSS/IDSS/V(BR)DSS/V(BR)DXS)
  • Electrical characteristics of MOSFETs (Body diode IDR/IDRP/VDSF/trr/Qrr/dv/dt)
  • Electrical characteristics of MOSFETs (Charge Characteristic Qg/Qgs1/Qgd/QSW/QOSS)
  • Electrical characteristics of MOSFETs (Dynamic Characteristics Ciss/Crss/Coss)
  • Electrical characteristics of MOSFETs (Dynamic Characteristics　tr/ton/tf/toff)
  • Electrical characteristics of MOSFETs (Static Characteristics RDS(ON))
  • Electrical characteristics of MOSFETs (Static Characteristics Vth)
  • How can I calculate the channel-to-ambient thermal resistance, Rth(ch-a), of a small-signal MOSFET?
  • How does the series gate resistor affect the MOSFET?
  • How do N-channel MOSFETs work?
  • How much gate-source voltage should be applied to drive the MOSFET?
  • I heard that MOSFETs have a diode between drain and source. What kind of diode is it?
  • Why are two MOSFETs used in series in the Lithium-ion secondary battery protection circuit?
  • Is it OK to use the body diode (parasitic diode) between the drain and source for a particular purpose?
  • Is it possible to use the Zener diode between the gate and source for surge absorption?
  • Is the MOSFET drive current necessary?
  • Is the on-state resistance of a MOSFET dependent on temperature?
  • MOS is sensitive to static electricity. How do you protect MOSFETs from static electricity?
  • How to select a suitable high voltage MOSFET for the application that current flows in the body diode. (e.g. Bridge circuit)
  • How to calculate the avalanche energy.
  • Resistors are often inserted between a CPU and MOSFETs. Why are these resistors necessary?
  • The MOSFET does not turn off by a turn-off signal. How do I solve this problem?
  • What are super junction MOSFETs (SJ-MOSs)?
  • What are the capacitance characteristics of MOSFET.
  • What are the considerations when using MOSFETs in parallel?
  • What attention should be paid when the reverse voltage is applied between drain and source of power MOSFET?
  • What attention should be paid to rising and falling time of the driving signal for MOSFET?
  • What does derating of Safe Operating Area (SOA) mean?
  • What does the dv/dt of the MOSFET mean?
  • What is avalanche capability?
  • What is the avalanche capability specified as part of the absolute maximum ratings?
  • What is the definition of "drain current (DC) (Silicon limit)" listed in the Absolute Maximum Ratings table?
  • What is the definition of power dissipation?
  • What is the meaning of “Logic-Level Gate Drive” for the MOSFET?
  • What should I pay attention to when mounting a MOSFET?
  • When using a MOSFET as a load switch, how do I reduce the inrush current that occurs?
  • Where can I find information about the MOSFET naming conventions?
  • Why do Toshiba's power MOSFETs exhibit larger gate-source leakage current, IGSS, than those of other companies?
  • Why is no operating temperature range specified?
  • All Semiconductor Devices
  • How much power is it permissible for the semiconductor device to dissipate?
  • How to approximate power dissipation wave to square wave
  • How to calculate for selecting a heat sink of a semiconductor device (1)
  • How to calculate for selecting a heat sink of a semiconductor device (2)
  • How to calculate the junction temperature of a semiconductor device whose datasheets do not include a “thermal resistance” value
  • How to calculate the junction temperature when the power is dissipated in a semiconductor device
  • How to calculate the transient thermal impedance at short pulse width, which is not included in the datasheet
  • If the packages are the same, are the thermal resistances the same?
  • In a board design, what are the methods for reducing the junction temperature?
  • Is case temperature or lead temperature the same as junction temperature?
  • What are the effects of a double-sided cooling package?
  • What are the effects of thermal via holes?
  • What are the important considerations when using a heat sink?
  • What do the thermal resistance suffixes in Rth(j-c), Rth(j-a) and Rth(ch-c) mean?
  • What is a radiation equivalent circuit?
  • What is thermal resistance?
  • What is transient thermal impedance?
  • When multiple semiconductor devices are arranged on the same board, is it necessary to consider thermal interference?
  • General-Purpose Logic ICs
  • Radio-Frequency Devices
  • Are there any special considerations for using RF devices?
  • How can I distinguish between the cathode and anode terminals?
  • What is an RF MMIC (RF cell pack)?
  • What is an RF MOSFET?
  • What is an RF Schottky barrier diode?
  • What is an RF switching diode?
  • What is a PIN diode?
  • What is a variable-capacitance diode?
  • What is important when selecting a variable-capacitance diode?
  • What is "rs" shown in the Electrical Characteristics table?
  • Radio-Frequency Devices
  • Microcomputer
  • Are there any products that allow memory to be connected without using an external address decoder ?
  • Are there any products that support an extended operating temperature range ?
  • Are there any products with a built-in CAN controller ?
  • What is the meaning of LSB in representation of AD conversion errors ?
  • How do I submit ROM data ?
  • Does Toshiba provide Flash programming service ?
  • Are there any products with a built-in CAN controller ?
  • Are there any products with a built-in LCD driver ?
  • What is the meaning of LSB in representation of AD conversion errors ?
  • How do I connect a microcontroller with 16-bit data bus and a NOR Flash memory with 16-bit data bus ?
  • How do I identify whether a malfunction is caused by hardware or software ?
  • Although operation checks with test tools in the development environment were successful, proper operation cannot be achieved with the actual device.
  • It looks as if the argument is not passed to the function properly.
  • It looks as if the function call returns an unintended value.
  • What is a wide-band-gap semiconductor?
  • What is surge current?
  • What is the temperature characteristic of the SiC-Schottky barrier diode (SBD)?
  • What is thermal runaway * of the SiC Schottky barrier diode (SBD)?
  • Why does the SiC Schottky barrier diode (SBD) have a high withstand voltage?
  • Are decoupling capacitors required across power and ground lines?
  • How can I calculate current and power consumption?
  • How can I purchase samples and evaluation boards?
  • How many parts are supplied per tape-and-reel?
  • Is it OK to connect capacitors to the output lines?
  • Is it OK to make deliberate use of the equivalent diode structure between the drain (D) and the source (S)?
  • MOS devices are typically sensitive to electrostatic discharge (ESD). How should I protect MOSFETs against ESD?
  • Please explain permissible power dissipation.
  • Tell me about the recommended land pattern.
  • What are the differences between the absolute maximum ratings and the recommended operating conditions?
  • What is the definition of “allowable power dissipation”?
  • What would happen if static electricity were discharged to the motor driver logic? Isn’t any protection implemented on-chip?
  • Are decoupling capacitors required across power and ground lines?
  • How can I calculate current and power consumption?
  • How can I purchase samples and evaluation boards?
  • How many parts are supplied per tape-and-reel?
  • Is it OK to connect capacitors to the output lines?
  • Is it OK to make deliberate use of the equivalent diode structure between the drain (D) and the source (S)?
  • Is there anything to keep in mind when using a sensorless DC motor?
  • MOS devices are typically sensitive to electrostatic discharge (ESD). How should I protect MOSFETs against ESD?
  • Please explain permissible power dissipation.
  • Tell me about the recommended land pattern.
  • What are the benefits of lead angle control?
  • What are the differences between the absolute maximum ratings and the recommended operating conditions?
  • What causes motor failure and sine-wave distortion?
  • What is the definition of “allowable power dissipation”?
  • What is the maximum RPM supported by sine-wave driver ICs?
  • What would happen if static electricity were discharged to the motor driver logic? Isn’t any protection implemented on-chip?
  • Are decoupling capacitors required across power and ground lines?
  • How can I calculate current and power consumption?
  • How can I program the output current?
  • How many parts are supplied per tape-and-reel?
  • How many watts does the REXT resistor need to be rated at?
  • How should the power and input signals be sequenced at power-up and power-down?
  • I want to connect multiple LED drivers in cascade. Is it okay if the SCK waveform becomes shallow?
  • What are the differences between the absolute maximum ratings and the recommended operating conditions?
  • What is the definition of “allowable power dissipation”?
  • You have announced that the TB62705CFG and TB62725BFG 8-channel LED drivers will be discontinued. Do you have any replacements for these devices?
  • You have announced that the TB62706BFG and TB62726AFG 16-channel LED drivers will be discontinued. Do you have any replacements for these devices?
  • What is a high-side switch?
  • What is a low-side switch?
  • What is a short to ground?
  • What is a short to power?
  • What is the difference between IPD and IPS?
  • What does the diagnostic function available with low-voltage IPDs do?
  • What is the open-load detection function available with low-voltage IPDs?
  • What is active clamping available with low-voltage IPDs?
  • How does a low-voltage IPD sense temperature for thermal shutdown?
  • How does the thermal shutdown of a low-voltage IPD work for device protection?
  • How does the overcurrent protection of a low-voltage IPD work?
  • Are low-voltage IPDs with a high-side and a low-side switch distinguished with part numbers?
  • Are decoupling capacitors required across power and ground lines?
  • Do stepping motor drivers incorporate body diodes to absorb back-EMF?
  • How can I calculate current and power consumption?
  • How can I purchase samples and evaluation boards?
  • How many parts are supplied per tape-and-reel?
  • Is it OK to connect capacitors to the output lines?
  • Is it OK to make deliberate use of the equivalent diode structure between the drain (D) and the source (S)?
  • MOS devices are typically sensitive to electrostatic discharge (ESD). How should I protect MOSFETs against ESD?
  • Please explain permissible power dissipation.
  • Tell me about the recommended land pattern.
  • What are the differences between the absolute maximum ratings and the recommended operating conditions?
  • What is the definition of “allowable power dissipation”?
  • What would happen if static electricity were discharged to the motor driver logic? Isn’t any protection implemented on-chip?
  • Are the collector and emitter terminals of a bipolar transistor interchangeable?
  • Are there any special considerations for heat dissipation from bipolar transistors?
  • Electrical characteristics of bipolar transistors
  • Example of measurement of the key bipolar transistor characteristics
  • How can I calculate the junction-to-ambient thermal resistance, Rth(j-a), of a small-signal transistor?
  • How does an ambient temperature rise affect the transistor breakdown voltage?
  • How do npn and pnp transistors operate?
  • Reading individual technical datasheets for bipolar transistors
  • Datasheets and other documents for bipolar transistors contain a safe operating area (SOA) graph. What is it?
  • Transient thermal resistance vs. safe operating area (SOA)
  • What is the difference between small-signal transistors and power transistors?
  • What are the applications of bipolar transistors (bipolar junction transistors: BJTs)?
  • What is the relationship between the base-emitter and collector-emitter voltages of a bipolar transistor?
  • What types of bipolar transistors (bipolar junction transistors: BJTs) are available?
  • What occurs if voltage exceeding the absolute maximum rated emitter-base voltage is applied to the base terminal?
  • A junction FET is widely used for impedance conversion. What is it for?
  • Are there any reasons why junction-to-case (or channel-to-case) thermal resistance is not specified for small-package devices?
  • Are there any special considerations for thermal calculation?
  • What drives transistors: current or voltage
  • I heard that a junction FET could be used as a constant-current source. How can I create a constant-current source?
  • Is it OK to use a transistor as diodes?
  • Neither Rth(ch-a) nor Rth(j-a) is specified for MOSFETs, IGBTs and bipolar transistors. Why is that?
  • Technical documents for MOSFETs and bipolar transistors contain a safe operating area (SOA) graph. What is it?
  • What is a bias resistor built-in transistor?
  • What is a bipolar transistor?
  • What is a JFET?
  • What is a MOSFET?
  • What is a multi-chip discrete device?
  • What is an IGBT?
  • What kinds of tape packing does Toshiba offer for transistors?
  • What types of transistors are available?
  • Why is no operating temperature range specified?
  • What is an IPD?
  • What is an SOI?
  • How can I distinguish high-voltage IPDs for sine-wave and square-wave drive based on part numbers?
  • What are the applications of high-voltage IPDs?
  • How does a high-voltage IPD detect temperature for thermal shutdown?
  • What is the bootstrap circuit in high-voltage IPDs?
  • What is the level-shift driver in high-voltage IPDs?
  • What type of Hall-effect devices is suitable for use with a high-voltage IPD?
  • Does the E-Pad (metal frame) exposed on the surface of a high-side IPD have the same potential as GND?
  • Is it possible to use the E-Pad (metal frame) exposed on the surface of a high-voltage IPD as a conductive pin?
  • Metals are exposed on the sides of the SSOP30 package for high-voltage IPDs. What voltage potential do they have?
  • How are local power supply ICs used?
  • What kinds of linear-type local power supply ICs (linear regulators) exist?
  • Do linear-type local power supply ICs (linear regulators) need external parts?
  • About absolute maximum ratings (Understanding datasheet values)
  • About electrical characteristics (Understanding datasheet values)
  • Is it possible to use LDO regulators at low supply voltage? What is the minimum voltage required for their proper operation?
  • How can a low-noise power supply be created using an LDO regulator?
  • What is the resistance of the pulldown resistor connected to the CONTROL pin of the LDO regulator?
  • How does overcurrent protection work in an LDO regulator?
  • When the operating mode of the load-side IC is changed, the output voltage of an LDO regulator drops, causing the IC to malfunction. What can I do to prevent a malfunction?
  • What is the thermal shutdown (TSD) that is available with LDO regulators?
  • Are there any LDO regulators with adjustable output voltage available (requiring external resistors)?
  • What type of capacitor is suitable for use with an LDO regulator?
  • What is the quiescent current of an LDO?
  • Which characteristics in a datasheet should I refer to in order to determine whether a given LDO maintains a regulated output voltage even when input voltage varies?
  • The output voltage of an LDO drops when I increase the output current even though it is operating within the rated conditions. What type of LDO should I choose to avoid such a problem?
  • A small noise is superimposed on the output voltage of an LDO. What can I do to reduce the noise?
  • What voltage is required at the CONTROL terminal to enable an LDO?
  • Why does the LDO output voltage oscillate?
  • How can I quickly bring the output voltage of a circuit with an LDO to zero in order to set a power supply sequence for the load IC?
  • Why is the output of an LDO disabled when its input voltage decreases?
  • How can I prevent the output voltage from overshooting following the application of the control voltage to an LDO?
  • Large inrush current flows when an LDO is enabled. What can I do to prevent this?
  • Is the power-on sequence of the input voltage (VIN) and the control voltage (VCT) of an LDO significant?
  • What is the purpose of the capacitor connected to one of the external resistors for an adjustable-output LDO?
  • Is it OK to reverse-bias an LDO, causing its output voltage to become higher than the input voltage?
  • How can I calculate the junction temperature of an LDO?
  • What is an output discharge function of the load switch IC?
  • What is the input-tolerant function?
  • Is it OK to apply the input voltage following the application of an “on” signal to the CONTROL terminal?
  • How can I suppress inrush current with a load switch IC?
  • What is the value of the pull-down resistor connected to the active-High CONTROL terminal of load switch ICs?
  • Does the overvoltage lockout of the load switch IC recover automatically?
  • Does the undervoltage lockout function of the load switch IC provide a hysteresis?
  • What is the FLAG output function of the load switch IC?
  • What is the hold time of a load switch IC?
  • What are the Auto Selection and Manual Selection modes?
  • What is a break-before-make circuit?
  • What is reverse-current blocking using external back-to-back MOSFETs?
  • What is the difference between true reverse-current blocking and reverse-current blocking?
  • How does a load switch IC operate if overcurrent protection is tripped?
  • How can I calculate the power dissipation and junction temperature of a load switch IC?
  • What is a bus switch?
  • Tell me about the handling of the input of bus switches and analog switches.
  • Are the output states of flip-flops, registers, counters and one-shot multi-vibrators determinate?
  • Is it OK to leave the bidirectional pin of a bidirectional bus buffer open when it is floating?
  • Is it possible to apply a signal with a low slew rate to a Schmitt-trigger input type?
  • The output of a CMOS logic IC does not stabilize in the High or Low state. What could be the cause of this?
  • The output voltage from a CMOS logic IC alternates between High and Low for a certain period of time. That is, the output goes into oscillation. What can I do to prevent this?
  • The output voltage from a buffer type does not reach the supply voltage. What can I do to prevent this?
  • The output waveform of a CMOS logic IC has transients that look like spikes. What can I do to prevent this?
  • The input pin of a CMOS logic IC connected to High or Low has noise. What could be the cause of this?
  • What are the differences between the series?
  • What are the differences between "absolute maximum ratings" and "recommended operating conditions"?
  • Tell me about the input tolerant function.
  • Tell me about the output tolerant function.
  • In what sequence should I turn on and off the power and input signals?
  • Is a decoupling capacitor required between Vcc and GND?
  • Is it OK to leave the unused inputs of general-purpose CMOS logic ICs open?
  • Tell me about the function of bus-hold.
  • Is it OK to leave unused outputs of general-purpose CMOS logic ICs open?
  • Are there any guidelines for inputs with a slowly rising or falling edge?
  • Is it OK to connect a capacitor to an output?
  • Is it OK to short-circuit the outputs of multiple general-purpose CMOS logic ICs?
  • If multiple outputs from a general-purpose CMOS logic IC come into conflict, is the IC adversely affected?
  • The datasheets for some logic ICs do not show the maximum operating frequency. What is their maximum operating frequency?
  • How many amperes of current can an output pin drive?
  • How can I calculate fan-out?
  • How can I calculate the operating supply current and power dissipation?
  • What kinds of faults could occur if an electrostatic discharge is introduced into a general-purpose CMOS logic IC? How can the faults be prevented?
  • Tell me about thermal design.
  • Tell me about the devices suitable for use as level shifters.
  • What options do I have to perform level shifting from 5 V to 3.3 V and vice versa?
  • What options do I have to perform level shifting from 1.8 V to 2.5 V and vice versa?
  • Are there level shifters compatible with communication standards?
  • What is the difference between a level-shifting bus switch type and a bus buffer type?
  • Tell me about the power-up sequence and signal input timing for dual-supply level shifters?
  • Do bidirectional bus buffers have any constraints on the timing of the direction (DIR) and other input signals?
  • Is it necessary to add an external pullup resistor between the input or output pin of a level-shifting bus switch and the power supply (VCCA or VCCB)?
  • What is the maximum operating frequency of level shifters?
  • What is an IGBT?
  • What is the difference between MOSFETs and IGBTs?
  • For what applications should MOSFETs and IGBTs be used?
  • What is the principle of operation of the IGBT?
  • In what structures are IGBTs available?
  • What is a reverse-conducting IGBT (RC-IGBT)?
  • What is conductivity modulation?
  • What is a safe operating area?
  • What is the definition of IGBT power dissipation?
  • What is the tail current of an IGBT?
  • Please give some application examples for IGBTs.
  • Please explain hard switching and soft switching using IGBTs.
  • Please explain the operation of voltage-resonant soft switching of an IGBT.
  • Please explain the operation of current-resonant soft switching of the IGBT.
  • How can I provide protection against the surge voltage generated by the turn-off of an IGBT?
  • Is it possible to connect multiple IGBTs in parallel? If so, is there anything to note about parallel connection?
  • At what voltage should the IGBT gate be driven?
  • Besides silicon, what other types of semiconductors exist?
  • Do semiconductor devices tolerate the rated absolute maximum conditions if such conditions exist only instantaneously?
  • Generally speaking, what does “semiconductor” mean?
  • What is a compound semiconductor?
  • What happens if a P-type semiconductor contacts an N-type?
  • What is an N-type semiconductor?
  • What is a P-type semiconductor?
  • Where can I find information on tape specifications and packing quantities per reel?
  • linear_opamp
  • What are open-loop and closed-loop gains of an op-amp?
  • For what applications are op-amps used?
  • Why is feedback used in op-amps?
  • What is an operational amplifier?
  • What types of amplifier circuits can be configured using an op-amp?
  • What types of op-amps are available?
  • What is the maximum frequency at which an op-amp can be used?
  • What is the purpose of using a differential amplifier? (Common-mode rejection ratio: CMRR)
  • What is the ideal op-amp?
  • What is the virtual short of an op-amp?
  • What is the input offset voltage of an op-amp?
  • Is it necessary to connect bypass capacitors to the power supply terminal of an op-amp?
  • Is there any way to amplify a signal with a voltage close to the GND level?
  • What types of noise affect an op-amp?
  • When the supply voltage is low, what can I do to increase the dynamic range of an op-amp?
  • Motor Driver ICs
  • What is the meaning of alphanumeric characters at the end of the product name?
  • What is the meaning of alphanumeric characters at the end of the product name?
  • General Catalog
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  • The Journey of Motor Control
  • MOSFETs
  • 12V - 300V MOSFETs
  • DSOP Advance, a Thermally Enhanced Double Side Cooling Package, improves the efficiency of power supply for high-current applications.
  • The U-MOSⅨ-H series are the ideal MOSFETs for improving the efficiency of switched-mode power supplies.
  • A wide choice of product variations ranging from ultra-small packages to general-purpose packages.
  • Pch MOSFET series using latest process
  • The U-MOSⅨ-H series has a greatly improved figure of merit that represents losses.
  • Switching noise reduction by snubber circuits (Low Spike Technology)
  • Toshiba's MOSFETs are ideal for low-voltage drive equipment.
  • Automotive MOSFETs
  • Process Trends of Automotive MOSFETs
  • Switching characteristics of the N-ch U-MOS series
  • Package Trends of Automotive MOSFETs
  • Automotive applications drive miniaturization of small MOSFET sets
  • 400V - 900V MOSFETs
  • State-of-the-art super junction MOSFET DTMOSVI
  • Commercialization of new TO-247-4L packaging 600-V Super Junction Power MOSFET (DTMOSIV-H Series)
  • State-of-the-art double-diffusion MOSFET(D-MOS)π-MOSIX series
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  • What is a photorelay?
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  • 3-phase Brushless DC Motor Driver IC, built-in Power Devices
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  • Reduction of Loss by the Latest High-breakdown-voltage SOI Processes
  • Reduction of mounting area by small surface-mount package compatible with high voltage
  • Automotive Driver ICs
  • High-side and low-side switch products
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  • Optimal driver ICs for various automotive applications
  • General Purpose Logic ICs
  • New Series with Level Shift Functions: 7UL1Gxx / 7UL1Txx
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  • SiC devices suitable for power supply circuits
  • Improved JBS structure to reduce the leakage current and increase the surge current capability
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  • High withstand voltage (reverse voltage) characteristics of SiC SBDs
  • TVS Diodes (ESD Protection Diodes)
  • ESD tolerance
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  • Extensive package lineup: developing smaller packages
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  • Extensive package lineup: multi-bit packages
  • Ensuring signal quality: insertion power loss
  • Radio-Frequency Devices
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  • Not Recommended for New Design / EOL Announced Products
  • TX19A Series
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  • Oscillator Manufacturer Information
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  • Fast load transient response performance
  • Reduction of power consumption by low dropout voltage
  • Ultra-low Quiescent current
  • Extensive package lineup
  • Various additional functions
  • Load Switch ICs
  • Overcurrent protection function
  • Overvoltage protection function
  • Inrush current reduction circuit
  • Thermal shutdown
  • Extensive package lineup
  • Low input voltage operation/low on-resistance characteristics
  • Low current consumption characteristic
  • Smaller Area and Higher Functionality
  • PFC Control ICs
  • LED Driver ICs
  • eFuse ICs
  • High-precision overvoltage clamp function
  • IEC 62368-1 Safety standard certification
  • Function to suppress inrush current
  • All major protection functions are realized in one package
  • Quick short-circuit protection
  • High-precision overcurrent protection
  • Thermal shutdown function and recovery operation
  • Reverse current blocking function
  • Linear ICs
  • Operational Amplifiers and Comparators
  • Contributing to long-term operation of equipment, ultra-low-current operational amplifier
  • Low-voltage, wide-range input signals can be amplified and processed
  • Ultra-low-noise Operational Amplifier Optimal for Sensor Small-signal Amplification
  • Extensive package lineup
  • Transistor Arrays
  • Transistor Arrays: New and Old Product Correspondence Table
  • Transistor Arrays: New Product Functional List
  • Transistor Arrays: Key Features of New Products
  • Power Amplifier ICs
  • 4-channel High-Efficiency Linear Power Amplifier for Car Audio: TCB701FNG
  • 4-channel High-Efficiency Linear Power Amplifier for Car Audios Featuring Maximum 45W Output: TCB702FNG
  • Power Amplifier for Car Audio with Strong Resistance to Power Surges: TCB503HQ
  • Current-Feedback 4ch Power Amplifier IC for Car Audio with Built-In Full-Time Offset Detection: TCB502HQ
  • 45-W class 4-channel power amplifier IC with using a new CD-0.13 process: TCB001HQ
  • Current-Feedback 4ch Power Amplifier IC for Car Audio with Built-In Full-Time Offset Detection: TCB501HQ
  • Supports external audible outputs from vehicles, allowing use of electric vehicle warning sound systems in HEVs and EVs: TB2909FNG
  • Automotive Devices
  • Automotive Microcontrollers
  • Motor Control Technologies
  • Automotive Development Tools and Partners
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  • Automotive Microcontroller Lineups
  • Automotive Microcontroller Lineups：PMD Microcontroller for Electronic Power Steering (EPS) Applications: TMPM350FDTFG (Mass Production)
  • Automotive Microcontroller Lineups：M/G Microcontroller for HEV and EV Applications: TMPR454F10TFG (Mass Production)
  • Automotive Microcontroller Lineups：Battery Monitoring Applications and Microcontroller for General-Purpose Automotive: TMPM358FDTFG (Mass Production)
  • Automotive Microcontroller Lineups：PMD Microcontroller for Electronic Power Steering (EPS) Applications: TMPM351F10TFG (Mass Production)
  • Automotive Microcontroller Lineups：M/G Microcontroller for HEV and EV Applications: TMPM354F10TAFG (Mass Production)
  • Automotive Interface Bridge ICs
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  • TC9560 Series
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  • Dual / Single-Picture Video Processors
  • TC90195AXBG
  • TC90175XBG [New Product]
  • Automotive Brushless Motor Driver ICs
  • 3-phase BLDC Motor Pre-driver IC for Sine Wave Current Control: TB9080FG
  • Sensorless 3-phase BLDC Motor Pre-driver IC: TB9061AFNG
  • Three-Phase Brushless Sensorless Pre-driver IC TB9062FNG
  • 3-Phase BLDC Motor Pre-driver IC for EPS Applications: TB9081FG
  • RF ICs for Extremely Low-Power Radio Applications
  • Automotive TVS Diodes (ESD Protection Diodes)
  • ESD tolerance
  • Low dynamic resistance
  • Ensuring signal quality: insertion power loss
  • Extensive product lineup in a wide choice of packages: developing smaller packages
  • Automotive Stepping Motor Driver ICs
  • Automotive Stepping Motor Driver IC:IC TB9120FTG
  • Automotive Brushed DC Motor Driver ICs
  • 1-Channel Brushed DC Motor Driver IC: TB9051FTG
  • H-bridge Pre-driver IC: TB9057FG
  • Automotive DC motor driver IC with LIN slave function：TB9058FNG
  • Video Decoder ICs
  • Product Introduction
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  • TB9044AFNG Overview
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  • Image Recognition Processors Visconti™
  • Image Recognition Processors Visconti™: Features
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  • Launch of Image Recognition Processors, Visconti™4 for Automotive Applications
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  • AC switch implementation using photo relays (under 0.3A)
  • Wireless/key input section details
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  • Toshiba Launches High-Current 4-Channel H-bridge Motor Driver IC
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  • Vulnerability found related to the generation and management of WPA2 Key on CANVIO (STOR.E) wireless products
  • 11
  • Toshiba Expands Line-up of Latest Generation Trench MOSFETs with Ultra-Compact 40V Device for Low EMI Designs
  • Toshiba’s New Three-phase Brushless Motor Drivers Realise High Speed Rotation for Small Motors
  • Toshiba Expands Line-up of New-generation Transistor Arrays
  • Toshiba starts sample shipment of automotive stepping motor driver
  • New Stepper Motor Drivers from Toshiba Improve Motion Accuracy and Motor Efficiency
  • Toshiba Announces 10TB Surveillance Hard Disk Drive
  • Toshiba Memory Europe Unveils UFS Devices Utilizing 64-Layer, 3D Flash Memory
  • Toshiba Increases Performance, Doubles Capacity with New XG5-P NVMe SSDs
  • 12
  • Toshiba introduces new Bluetooth® low energy IC for automotive applications
  • Toshiba sets new standard with advanced high-efficiency Audio Power Amplifier
  • Toshiba Electronic Devices & Storage Corporation Launches World’s First 14TB HDD with Conventional Magnetic Recording
  • Toshiba Memory Europe Announces UFS 2.1-Compliant Embedded NAND Flash for Automotive Applications
  • Toshiba and Western Digital Reach Global Settlement and Agree to Strengthen Flash Memory Collaboration
  • UPDATE:SDHC/SDXC Memory Card with embedded wireless LAN functionality FlashAir™ may have a security vulnerability related to the generation and management of WPA2 key
  • Toshiba Introduces New 10,500rpm Enterprise Performance HDD Model Generation
  • News Release
  • 2017
  • 10
  • Relationship with Wor(l)d Media Technology Corp.
  • 2018
  • 01
  • Toshiba releases new Bluetooth 4.2 evaluation and prototyping platform
  • Toshiba launches two new ICs compliant with Bluetooth® Ver. 5.0
  • Toshiba Unveils Mainstream RC100 NVMe SSD Series at CES 2018
  • Ultra-Compact Bi-Directional ESD Protection Diode for Portable Devices
  • Toshiba launches small LDO regulator ICs suitable for IoT applications
  • 02
  • Toshiba releases 100V N-channel power MOSFETs for industrial applications
  • Toshiba adds power amplifier IC adopting pure MOS for car audio
  • Toshiba releases medium voltage, high current photorelay in small package
  • Toshiba introduces SOI process for low-noise RF Amplifiers
  • Toshiba Announces New 2TB Hard Disk Drive for Client Storage Applications
  • Default Password Vulnerability in CANVIO (STOR.E) wireless products
  • 03
  • Toshiba Launches High Peak Pulse Current TVS Diodes for Power Line Protection
  • Toshiba add new line-up of high speed signal transmission photorelays
  • Toshiba releases N-channel MOSFET driver ICs
  • Toshiba Launches Photocoupler with UVLO Function for Digitally Controlled Switching Power Supplies and IPM Drives
  • Toshiba launches 1.5A LDO regulators in ultra-small package
  • Toshiba unveils next generation 600V planar MOSFET series
  • Toshiba releases high-current photorelays for factory automation
  • 04
  • Toshiba releases medium voltage photorelay for industrial applications
  • Toshiba launches new surface-mount brushed motor driver IC
  • Toshiba gate driver photocoupler with 2.5A peak output current in low profile package
  • Toshiba releases new, powerful surveillance and video streaming internal hard disk drives
  • 05
  • PCIM 2018: Toshiba releases automotive 40V N-Channel power MOSFETs in 5mm x 6mm package
  • Toshiba to exhibit multiple exciting new products at PCIM Europe
  • Toshiba releases photorelay for factory automation and other industrial applications
  • Toshiba releases new three-phase brushless fan motor driver IC
  • World’s first[1] 14 TB[2] server HDD joins Toshiba’s enterprise and consumer product line up on api - partner stand at CEBIT 2018
  • Toshiba develops 4.5 kV press-pack IEGT with improved rupture resistance
  • 06
  • Toshiba releases interface bridge devices for automotive infotainment applications
  • Toshiba announce new evaluation board for three-phase BLDC motor drive ICs
  • Toshiba Launches active-clamp MOSFET series for relay drivers
  • 07
  • Toshiba Announces 14TB HDD Availability on Select Supermicro Storage Servers
  • Toshiba announce new analog output IC photocoupler for automotive applications
  • Toshiba develops low reverse-current Schottky diode with improved thermal performance
  • Toshiba release compact power MOSFET gate driver intelligent power device
  • Multiple Vulnerabilities in CANVIO Network Storage Products
  • Toshiba launch high current photorelays in DIP4 package
  • 08
  • Toshiba adds new three-phase brushless fan motor controller IC
  • Toshiba obtains UL 508 certification for eight photorelays
  • Toshiba announce next-generation superjunction power MOSFETs
  • Toshiba Expands Line-up of Arm® Cortex® -M3-based Microcontrollers
  • Toshiba sampling new high-definition microstepping motor driver
  • Toshiba gives more capacity to SAS 3.5” enterprise HDD models
  • 09
  • Toshiba releases automotive 40V ultra low Rds(on) MOSFETs in 5mm x 6mm packages with double-sided cooling
  • Toshiba H-bridge motor drive IC supports low voltage, high current drive
  • Toshiba launches power amplifier for automotive audio systems
  • Toshiba releases DC brushed motor IC with current limit detection
  • 10
  • Toshiba announces Bluetooth® 5 IC for automotive applications
  • 11
  • Toshiba adds new 4-channel linear power amplifier for car audio
  • Toshiba unveils 130nm Fit Fast Structured Array development platform
  • Toshiba recognised as Most Committed Supplier in Agfa HealthCare Supplier Excellence Awards
  • 12
  • Toshiba launches H-bridge driver IC supporting low-voltage, large current drive
  • 2019
  • 01
  • Toshiba Develops DNN Hardware IP for Image Recognition AI Processor Visconti 5 for Automotive Driver Assistance Systems
  • Toshiba announces new 16TB Enterprise Capacity Hard Disk Drives – MG08 Series
  • Toshiba Announces Latest Ethernet Bridge IC for Automotive and Industrial applications
  • 02
  • Toshiba to exhibit range of new products and technologies at Embedded World 2019
  • Toshiba releases small MOSFET with excellent ESD protection
  • Toshiba Image Recognition SoC for Automotive Applications Integrates a Deep Neural Network Accelerator
  • Toshiba launches single-supply single-gate logic devices supporting low voltage operation
  • 03
  • Toshiba starts sample shipments of automotive DC motor driver IC with LIN slave function
  • Toshiba’s new small surface mount LDO regulators lower power consumption
  • Toshiba launch a new adapter for unidirectional optical modules
  • Toshiba Employee Receives 2018 MIPI Lifetime Achievement Award
  • 04
  • Toshiba announces significant presence at PCIM Europe 2019
  • 05
  • Toshiba’s ARM® Cortex®-M4-based Microcontrollers deliver high-speed data processing
  • Toshiba high-current photorelays achieve UL 508 certification for factory automation applications
  • Analog Power IC Process Technology Developed by Toshiba and Japan Semiconductor
  • 06
  • Toshiba launches new family of low voltage driven photorelays
  • Toshiba launches compact, high-efficiency DC brushed motor driver IC with popular pin-assignment HSOP8 Package
  • Toyota Alphard/Vellfire with Toshiba’s Advanced Image Recognition Processor Wins Japan’s Highest Award for Preventive Safety Performance
  • Toshiba launches sensorless control pre-driver IC for BLDC motors
  • Toshiba launches CCD linear image sensor with enhanced performance
  • Toshiba launches three-phase brushless motor controller ICs with sine wave drive
  • 07
  • 08
  • Toshiba launches sensorless control pre-driver IC for BLDC motors
  • 09
  • Toshiba launches high-voltage dual-channel solenoid driver IC
  • 10
  • Toshiba Launches Voltage Drive Photorelay with a Tiny 2.9mm2 Footprint
  • Toshiba releases low capacitance TVS diodes suitable for ESD protection
  • Toshiba launches 600V sine-wave PWM Driver IC for three-phase brushless motors
  • Toshiba announces new three-phase brushless motor control pre-driver IC
  • 11
  • Toshiba launches compact resettable eFuse IC providing safety for low voltage applications
  • Toyota Lexus UX and Lexus NX with Toshiba’s Image Recognition Processor Win Highest Score in Japan’s Assessment of Preventive Safety Performance
  • 12
  • Toshiba launches a range of general-purpose system power ICs for automotive applications
  • Toshiba announces new three-phase brushless motor controller with gate driver
  • Toshiba announces new 100 V N-channel MOSFETs for automotive applications
  • Press Contacts
  • Toshiba launches a 10Mbps logic output photocoupler for PLCs
  • Toshiba launches new high-resolution micro-stepping motor driver IC with integrated current sensing
  • Toshiba to launch new Servo Drive Reference Model at Embedded World 2020
  • Toshiba announces trio of new high-current photorelays
  • Toshiba Withdraws from Participation at Embedded World 2020
  • Toshiba announces new cutting-edge CMOS silicon on insulator process
  • Toshiba Releases New 100V N-Channel Power MOSFET for Automotive Applications
  • Toshiba Adds New Brushed DC Motor Driver IC with wide operating voltage range
  • Toshiba's Latest Enterprise Hard Disk Drives Qualified for Microchip Technology’s Adaptec HBAs and RAID Adapters
  • Toshiba Expands 32-bit Microcontroller Product Line-up
  • Toshiba announces a new dual output IGBT / MOSFET driver
  • Toshiba launches two new 80V N-channel power MOSFETs
  • Toshiba Launches Improved 1350 V IGBT device for domestic appliance applications
  • Use of Shingled Magnetic Recording (SMR) technology in Toshiba Consumer Hard Drives
  • Toshiba Launches MOSFET Gate Driver Switch Intelligent Power Devices
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