• English
  • Semiconductor
  • Semiconductor – Quality / Reliability
  • e-Learning
  • Microcontroller Function Terms
  • ΔΣ AD Converters
  • Serial Interface
  • Seven serial interfaces of Toshiba MCU
  • Flash ROM
  • Control using MCU
  • Servo Control
  • Vector Engine and Vector control
  • Ultrasonic Motor Control Technology: High Resolution Control by MCU
  • USB interface
  • Inverter control
  • Basic Knowledge of Discrete Semiconductor Device
  • Chapter I : Basis of Semiconductors : p-type Semiconductor
  • Chapter I : Basis of Semiconductors : What is a Compound Semiconductor?
  • pn Junction
  • Chapter I : Basis of Semiconductors : Types of Semiconductor Devices
  • Chapter I : Basis of Semiconductors : What is a Semiconductor?
  • Chapter I : Basis of Semiconductors : Semiconductor Materials
  • Chapter I : Basis of Semiconductors : n-type Semiconductor
  • Chapter II : Diodes : Types of Diodes
  • Chapter II : Diodes : Characteristics Application of Various Diodes
  • Chapter II : Diodes : Schottky Barrier Diodes (SBDs)
  • Chapter II : Diodes : Functions of Rectifier Diodes
  • Chapter II : Diodes : Reverse Recovery Characteristic of Schottky Barrier Diodes (SBDs)
  • Chapter II : Diodes : TVS diode (ESD protection diode)
  • Chapter II : Diodes : Difference Depending on Metal of Schottky Barrier Diodes (SBDs)
  • Chapter II : Diodes : Forward Characteristic of Rectifier Diodes (IF-VF Characteristic)
  • Chapter II : Diodes : Difference between TVS Diodes and Zener Diodes (2)
  • Chapter II : Diodes : Variable-capacitance Diodes (Varicap Diodes)
  • Chapter II : Diodes : Difference between TVS Diodes and Zener Diodes (1)
  • Chapter II : Diodes : FRDs (Fast Recovery Diodes)
  • Chapter II : Diodes : Voltage Regulator Diodes (Zener Diodes)
  • Chapter III : Transistors : Types of Transistors
  • Chapter III : Transistors : Performance of MOSFETs: Characteristic of Capacitance
  • Chapter III : Transistors : Performance of MOSFETs: Safe Operating Area(or Area of Safe Operation)
  • Chapter III : Transistors : Bipolar Transistors (BJTs)
  • Chapter III : Transistors : Bias Resistor Built-in Transistors (BRTs)
  • Chapter III : Transistors : Junction Field-Effect Transistors (JFETs)
  • Chapter III : Transistors : Application of IGBTs
  • Chapter III : Transistors : Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs)
  • Chapter III : Transistors : Differences between BJT and MOSFET
  • Chapter III : Transistors : Structure and Operation of MOSFET
  • Chapter III : Transistors : MOSFET Performance Improvement: Decision Factors of RDS(ON)
  • Chapter III : Transistors : MOSFET Performance Improvement: Approach to Low RDS(ON)
  • Chapter III : Transistors : MOSFET Performance Improvement: Super-Junction MOSFETs (SJ-MOS)
  • Chapter III : Transistors : Summary of MOSFET Features by Structure
  • Chapter III : Transistors : Performance of MOSFETs: Drain Current and Power Dissipation
  • Chapter III : Transistors : Performance of MOSFETs: Avalanche Capability
  • Chapter III : Transistors : Comparison of Forward Characteristics of IGBTs and MOSFETs
  • Chapter III : Transistors : Insulated-Gate Bipolar Transistors (IGBTs)
  • Chapter III : Transistors : Operation of Insulated-Gate Bipolar Transistors (IGBTs)
  • Chapter III : Transistors : Performance Improvement of IGBTs:Evolution of Vertical Design
  • Chapter III : Transistors : What are RC-IGBTs and IEGTs?
  • Chapter III : Transistors : Comparison of Transistors by Structure
  • Chapter III : Transistors : Datasheets of MOSFET: Maximum Ratings
  • Chapter III : Transistors : Datasheets of MOSFET: Electrical Characteristics
  • Chapter III : Transistors : Datasheets of MOSFET: Capacitance and Switching Characteristics
  • Chapter III : Transistors : Datasheets of MOSFET: Body Diode
  • Chapter IV : Local Power Supply ICs : Operation of Switching Regulators
  • Chapter IV : Local Power Supply ICs : Why POL Supply ICs Are Wanted?
  • Chapter IV : Local Power Supply ICs : Functions of LDO
  • Chapter IV : Local Power Supply ICs : Types of Local Power Supply ICs
  • Chapter IV : Local Power Supply ICs : Load Switch IC
  • Chapter IV : Local Power Supply ICs : Functions of Load Switch IC
  • Chapter IV : Local Power Supply ICs : Power Management IC
  • Chapter IV : Local Power Supply ICs : Operation of Linear Regulators
  • Chapter IV : Local Power Supply ICs : Example of Power Line Structure in a System
  • Chapter V : Optical Semiconductors : Types of Optical Semiconductors
  • Chapter V : Optical Semiconductors : Characteristics of Photocouplers(Current Transfer Ratio: CTR)
  • Chapter V : Optical Semiconductors : Principal Characteristics of Photocouplers(Trigger LED Current)
  • Chapter V : Optical Semiconductors :Aging Variation Data of Photocouplers
  • Chapter V : Optical Semiconductors : How to Use a Photocoupler
  • Chapter V : Optical Semiconductors : Types of Photocouplers
  • Chapter V : Optical Semiconductors : Types of Photocouplers (Internal Structure)
  • Chapter V : Optical Semiconductors : How to Use a Photocoupler “Output-Side Resistor”
  • Chapter V : Optical Semiconductors : Types of Photocouplers (Packages)
  • Chapter V : Optical Semiconductors : The wavelength range of LEDs
  • Chapter V : Optical Semiconductors : Safety Standards of Photocouplers
  • Chapter V : Optical Semiconductors : How to Use a Photocoupler “Input Current”
  • Chapter V : Optical Semiconductors : How to Use a Photocoupler Check
  • Chapter V : Optical Semiconductors : How to Use a Photocoupler “Output Current”
  • Chapter V : Optical Semiconductors : What Is a Photocoupler?
  • Chapter V : Optical Semiconductors : Why Are Photocouplers Necessary?
  • Chapter V : Optical Semiconductors : Light-Emitting Principal of LEDs
  • Basics of Microcontrollers
  • Digital Value
  • Digital Value: Binary and Decimal
  • Digital Value: Units of Binary Data
  • Digital Value: Notation Method of Data
  • Digital Value: Conversion Method of the Data
  • Logic Circuit
  • Logic Circuit: AND Circuit
  • Logic Circuit: OR Circuit
  • Logic Circuit: NOT Circuit
  • Logic Circuit: Exclusive OR (XOR) Circuit
  • Logic Circuit: 3 State Buffer (1)
  • Logic Circuit: 3 State Buffer (2)
  • Logic Circuit: Application Example of Logic Circuits
  • Logic Circuit: RS flip-flop Circuit
  • History of Microcontrollers
  • History of Microcontrollers: Large Scale Integrated Circuits and Microcontrollers
  • 5 Elements of Microcontrollers
  • CPU (Calculation, Control)
  • Memory (Storage)
  • Memory Type (RAM & ROM)
  • I/O (Input, Output)
  • Bus Line
  • Bus Line Type
  • The Role of Software
  • Execution of Software
  • Programming Language
  • Programming Language: Machine Language
  • Programming Language: Assembly Language
  • Programming Language: C Language
  • Overall Configuration of the CPU
  • Overall Configuration of the CPU: CPU Core (1)
  • Overall Configuration of the CPU: CPU Core (2)
  • Overall Configuration of the CPU: Program Counter
  • Overall Configuration of the CPU: General-purpose Register
  • Overall Configuration of the CPU: PSW (Flag)
  • Overall Configuration of the CPU: Stack and Stack Pointer
  • Interrupt Processing
  • Interrupt Processing: Interrupt Type
  • Interrupt Processing: Maskable Interrupt
  • Interrupt Processing: Non Maskable Interrupt
  • System Development Procedure
  • System Development Procedure: Software Development
  • System Development Procedure: Test that Combines the Hardware and Software
  • System Development Procedure: Emulator
  • Stepping Motor
  • Motor Applications
  • What is a Stepping Motor?
  • Function in Printers
  • Function in Digital Cameras
  • Function in Air Conditioners
  • Function in Slot Machines
  • Function in Astronomical Telescopes
  • Open-Loop Control
  • Pros and Cons
  • Classification by Output Power
  • Classification by Power Supply
  • Unipolar Type and Bipolar Type
  • Classification by Stator
  • Classification by Rotor Types
  • Operation Image
  • Step Operation
  • Step Angle
  • Magnetic Pole of the Stator
  • Motor Current and Rotor Rotation
  • Excitation Mode
  • Excitation Mode: Full Step
  • Excitation Mode: Half Step
  • Excitation Mode: Micro Step
  • Summary of Excitation Modes
  • 2-Phase 4-Pole Motor
  • Two Input Types
  • CLOCK Input Type
  • PHASE Input Type
  • Brushless Motor
  • History of Brushless Motors
  • Brushed DC Motors and Brushless Motors
  • Classification of Brushless Motors
  • What is a Brushless Motor (1)
  • What is a Brushless Motor (2)
  • Application Examples of Brushless Motors
  • Driving Principle of a Motor (1)
  • Driving Principle of a Motor (2)
  • Brushed DC Motors and Brushless Motors
  • Sequence of a Brushed DC Motor
  • Sequence of a Brushless Motor
  • Relation Between a Pole, a Phase, and a Slot
  • Technical Explanation of a Brushless Motor
  • What is PWM?
  • What is an Inverter?
  • What is a Driver?
  • Position Detection by a Hall Sensor
  • Position Detection by an Induced Voltage
  • What is a Square-Wave Drive?
  • What is a Sine-Wave Drive?
  • Configuration of Square-Wave Drive
  • To Start with Square-Wave Drive
  • To Rotate by Square-Wave Drive
  • Configuration of Sine-Wave Drive
  • To Start with Sine-Wave Drive
  • To Rotate by Sine-Wave Drive
  • To Change Speed
  • Speed ​​Sequence
  • TX03 Series Microcontrollers
  • Lineup
  • Features of the TX03 Series.
  • Hardware Configuration
  • NVIC (Nested Vectored Interrupt Controller)
  • Main Core
  • Register Configuration
  • The Role of the Register
  • PC, LR
  • Stack Pointer
  • PUSH/POP to the Stack Pointer
  • Special Register
  • Operation Mode and Stack Pointer (1)
  • Operation Mode and Stack Pointer (2)
  • Exceptions (Reset, Interrupt, Fault, System Call)
  • The Role of NVIC
  • Tail Chain Control by NVIC
  • Memory Map
  • Memory Map for Arm® Cortex®-M3 Specifications
  • Memory Map of TMPM330: Example of TX03 Series
  • Vector Table (1)
  • Vector Table (2)
  • Bit Band Area and Bit Band Alias Area (1)
  • Bit Band Area and Bit Band Alias Area (2)
  • Memory Map (Bit Band Area and Bit Band Alias Area) 1
  • Memory Map (Bit Band Area and Bit Band Alias Area) 2
  • Memory Map (Bit Band Area and Bit Band Alias Area) 3
  • Memory Map (Bit Band Area and Bit Band Alias Area) 4
  • Memory Map (Bit Band Area and Bit Band Alias Area) 5
  • Memory Map (Bit Band Area and Bit Band Alias Area) 6
  • Memory Map (Bit Band Area and Bit Band Alias Area) 7
  • Memory Map (Bit Band Area and Bit Band Alias Area) 8
  • Memory Map (Bit Band Area and Bit Band Alias Area) 9
  • Memory Map (Bit Band Area and Bit Band Alias Area) 10
  • Low Power Consumption Technology
  • Low Power Consumption Control Block
  • Low Power Consumption Mode (1)
  • Low Power Consumption Mode (2)
  • Peripheral Circuits by Group of TX3
  • Peripheral Circuits of the M320 Group
  • M320 Group Application Example
  • Peripheral Circuits of the M330 Group
  • M330 Group Application Example (1)
  • M330 Group Application Example (2)
  • Peripheral Circuits of the M340 Group
  • M340 Group Application Example
  • Peripheral Circuits of the M360 Group
  • M360 Group Application Example
  • Peripheral Circuits of the M390 Group
  • M390 Group Application Example
  • Peripheral Circuits of the M370 Group
  • M370 Group Application Example
  • Overview of Vector Engine (VE)
  • Peripheral Circuits of the M380 Group
  • M380 Group Application Example (1)
  • M380 Group Application Example (2)
  • Basics of CMOS Logic ICs
  • What is a Logic IC?
  • What is a Standard Logic IC?
  • Types of Standard Logic ICs
  • Equipment in Which CMOS Logic ICs are Used
  • Reasons Why CMOS Logic ICs are Used
  • Classification of CMOS Logic ICs and Overview of Each Series
  • What is a CMOS Logic IC?
  • Basic CMOS Logic ICs
  • Basic Operations of CMOS Logic ICs
  • Basic Configuration of CMOS Logic ICs
  • Basic CMOS Logic ICs
  • Combinational Logic: Inverters and Buffers
  • Combinational Logic: Bidirectional Bus Buffers
  • Combinational Logic: Schmitt-Trigger Devices
  • Combinational Logic: Decoders
  • Combinational Logic: Multiplexers
  • Combinational Logic: Analog Multiplexer/Demultiplexers
  • Combinational Logic: Analog Switches
  • Sequential Logic: Latches
  • Sequential Logic: Flip-Flops
  • Sequential Logic: Counters
  • Sequential Logic: Shift Registers
  • Reading Datasheets: Absolute Maximum Ratings and Operating Ranges
  • Reading Datasheets: DC Electrical Characteristics
  • Reading Datasheets: Input Voltages (V(IH) and V(IL))
  • Reading Datasheets: Output Currents (I(OH) and I(OL))
  • Reading Datasheets: Input Current (I(IN))
  • Reading Datasheets: Quiescent Supply Current (I(CC))
  • Reading Datasheets: AC Electrical Characteristics
  • Reading Datasheets: Propagation Delay Times (t(pLH) and t(pHL))
  • Reading Datasheets: Power Dissipation Capacitance (C(PD))
  • Reading Datasheets: Input-Tolerant Function
  • Reading Datasheets: Output-Tolerant Function
  • Reading Datasheets: Power-Down Protection
  • Reading Datasheets
  • Usage Considerations of CMOS Logic ICs
  • Handling of Unused Input Pins
  • Input Rise and Fall Time Specifications
  • Multiple Outputs from a General-Purpose CMOS Logic IC Come Into Conflict (Short-Circuiting)
  • Connecting a Load Capacitance to a CMOS Output Pin
  • Calculating the Operating Supply Current and Power Dissipation
  • Level Shifting Using an Input-Tolerant Function
  • Example of Application of the Power-Down Protection Function (Partial Power-Down)
  • Input-Tolerant and Output Power-Down Protection Functions Available with Each Series
  • Types of Noise to be Noted
  • Countermeasures for Reducing Switching Noise
  • Countermeasures for Signal Reflection
  • Countermeasures for Crosstalk
  • Countermeasures for Hazards
  • Countermeasures for Metastability
  • Countermeasures for Latch-Up
  • Countermeasures for ESD Protection
  • Basics of eFuse ICs
  • What is the semi-conductor fuse eFuse IC?
  • Advantages of Semiconductor-fuse eFuse IC (1)
  • Advantages of Semiconductor-fuse eFuse IC (2)
  • Advantages of Semiconductor-fuse eFuse IC (3)
  • Comparison of eFuse IC performance with conventional fuses
  • Examples of applications where semiconductor fuses (eFuse ICs) are used
  • Overcurrent protection function (OCP)
  • Short circuit protection function
  • Overvoltage protection function (overvoltage clamp)
  • Slew rate control (Suppressing rush current)
  • Basics of Op-amps
  • 1. What is an op-amp?
  • 1.1. Characteristics of op-amps (What is the ideal op-amp?)
  • 1.2. Internal operation of an op-amp
  • 2. Using an op-amp
  • 2.1. Feedback (positive and negative feedback)
  • 2.2. Open-loop and closed-loop gains (Increasing the bandwidth of an amplifier)
  • 2.3. Oscillation
  • 2.4. Basic op-amp applications
  • 2.5. Virtual short (virtual ground)
  • 3. Electrical characteristics
  • 3.1. Input offset voltage (V(IO))
  • 3.2. Common-mode input voltage range (CMV(IN)) and common-mode input signal rejection ratio (CMRR)
  • 3.3. Internal noise of an op-amp
  • 3.4. Noise gain and signal gain
  • Basics of TVS Diodes (ESD protection diodes)
  • 1-1 Reverse breakdown voltage
  • 1-2 Using different types of protection diodes (ESD protection diodes and Zener diodes for overvoltage protection)
  • 1-3 Differences between protection diodes (ESD protection diodes and surge protection Zener diodes) and diodes for constant-voltage regulation
  • 1 What is a TVS diode (ESD protection diode)?
  • 2 Basic operations of TVS diodes (ESD protection diodes)
  • 2-1 Equivalent circuits and benefits
  • 3 Key electrical characteristics of TVS diodes (ESD protection diodes)
  • 3-1 Key characteristics for normal operation (in the absence of an ESD event)(1)
  • 3-1 Key characteristics for normal operation (in the absence of an ESD event)(2)
  • 3-1 Key characteristics for normal operation (in the absence of an ESD event)(3)
  • 3-2 Key characteristics for protection against ESD events(1)
  • 3-2 Key characteristics for protection against ESD events(2)
  • 3-2 Key characteristics for protection against ESD events(3)
  • 4 Selection guidelines for TVS diodes (ESD protection diodes)
  • 5 Layout considerations for TVS diodes (ESD protection diodes)
  • 6 Absolute maximum ratings of TVS diodes (ESD protection diodes)
  • Supplemental information: IEC61000-4-2 and IEC 61000-4-5
  • 7 Electrical characteristics of TVS diodes (ESD protection diodes)
  • Basics of Load Switch ICs
  • 1-2. Benefits of using load switch ICs
  • 1-1. What is a load switch IC?
  • 2-1. Useful functions available with load switch ICs
  • 2-2. Operation of overcurrent protection
  • 2-3. Operation of thermal shutdown
  • 2-4. Inrush current reducing
  • 2-5. Auto discharge
  • 2-6. Undervoltage lockout (UVLO)
  • 2-7. Reverse-current protection
  • 3-1. Glossary of terms used in the datasheets for load switch ICs
  • 4-1. Calculating the power dissipation of a load switch IC and heat dissipation
  • Basics of Low-Dropout (LDO) Regulators
  • 1-1. Types of voltage regulator ICs
  • 1-3. What is an LDO regulator?
  • 1-2. Advantages and disadvantages of linear regulators and switching regulators
  • 1-4. Need of LDO regulators for electronic systems
  • 1-5. What is a linear regulator?
  • 1-6. Operations of linear and switching regulators
  • 1-7. Principle of operation of series regulators
  • 1-8. Circuit configuration of a series regulator
  • 1-9. Differences between a three-terminal voltage regulator and an LDO regulator
  • 2-1. Useful functions available with LDO regulators
  • 2-2. Overcurrent protection operation of LDO regulators
  • 2-3. Thermal shutdown (TSD) operation of LDO regulators
  • 2-4. Inrush current reduction function of LDO regulators
  • 2-5. Auto discharge function of LDO regulators
  • 2-6. Undervoltage lockout (UVLO) function of LDO regulators
  • 3-1. Glossary of terms used in the datasheets for LDO regulators
  • 4-1. Efficiency of LDO regulators
  • 4-2. Calculating the power dissipation and junction temperature of an LDO regulator
  • 5-1. Usage considerations for LDO regulators
  • Basics of Schottky Barrier Diodes
  • 1. Conductors, semiconductors, and insulators
  • 1-1. Energy band diagram
  • 1-2. Characteristics of an intrinsic silicon semiconductor
  • 1-3. pn junction
  • 1-3-1. Forward biasing
  • 1-3-2. Reverse biasing
  • 3-1. Classification of diodes
  • 3-2. Comparison between SBDs and pn junction diodes
  • 3-3. Applications of SBDs
  • 3-4. Forward voltage
  • 3-5. Reverse recovery time
  • 3-6. Maximum rated reverse voltage (VR)
  • 3-7. Leakage current
  • 2. Metal-semiconductor junction
  • 2-1. Schottky contact (Schottky junction) Φm > Φn
  • 2-2. Ohmic contact (Ohmic junction) Φm < Φn
  • 2-3. Conductivity modulation
  • Basic of Thermoflagger™
  • The need for overheating (temperature) monitoring
  • What is Thermoflagger™ ?
  • Basic operations of Thermoflagger™
  • Using Thermoflagger™
  • Feature 1: Simplifies circuit design for overtemperature detection
  • Feature 2: Low-cost solution for monitoring multiple locations for overtemperature conditions
  • Feature 3: Supports failsafe design (1)
  • Feature 3: Supports failsafe design (2)
  • Application example for Thermoflagger™
  • Application of Thermoflagger™ (reference design)
  • Catalogs
  • Warning Regarding Counterfeit Goods
  • Frequently Asked Questions (FAQs)
  • Diodes
  • What are the items for the absolute maximum rating in technical datasheet of the diode?
  • Do the technical datasheets of diodes specify thermal resistance from the junction to the ambient?
  • How does heat change the characteristics of a diode? (Temperature Characteristic)
  • What is the temperature coefficient of the Zener diode (voltage regulator diode, constant voltage diode)?
  • What are the precautions when using switching diodes?
  • What electrical characteristics are specified in the diode technical datasheets?
  • Do SBDs have reverse recovery characteristic (trr)?
  • For what purposes are Zener diodes used?
  • How to calculate thermal resistance of diodes?
  • How to distinguish the anode and cathode terminals of a diode?
  • How can I use a Zener diode to create a relatively constant voltage that is not affected significantly by changes in temperature and supply voltage?
  • How do diodes work?
  • In what kinds of applications are fast recovery diodes (FRDs) used?
  • In what types of circuits are Zener diodes (voltage regulator diodes, constant-voltage diodes) used?
  • Is it OK to connect multiple diodes with the same part number in parallel?
  • Can Zener diodes be used in parallel connection?
  • Is it OK to connect multiple Zener diodes in series?
  • Is it possible to use Zener diodes in the same manner as typical pn junction diodes?
  • What is a diode?
  • What is a Schottky barrier diode (SBD)?
  • How do Zener diodes operation?
  • What are the key characteristics of a varicap diode?
  • What happens if trr is large?
  • What is a fast recovery diode (FRD)?
  • What is an HED?
  • What is a switching diode?
  • What is a variable-capacitance (varicap) diode?
  • What is a Zener diode (voltage regulator diode, constant-voltage diode)?
  • What is the difference between rectifier diodes and typical switching diodes?
  • What is the forward voltage (VF) of Schottky barrier diodes (SBDs)?
  • What is the dynamic impedance of a Zener diode (voltage regulator diode, constant voltage diode)?
  • How much frequency are used to fast recovery diodes?
  • What is diode reverse recovery time (trr)?
  • What is trr level of FRD?
  • What are the characteristics of Schottky barrier diodes (SBDs)?
  • What types of diodes does Toshiba provide?
  • Does the diode technical documentation specify the operating temperature range?
  • Linear ICs
  • How does a boost converter work?
  • How does a buck converter work?
  • In what parts are power supply ICs used?
  • What kinds of local power supply ICs exist?
  • What kinds of switching-type local power supply ICs (switching regulators) exist?
  • Isolators/Solid State Relays
  • What is a photocoupler?
  • Why is a photocoupler necessary?
  • What types of photocouplers are available?
  • What is the internal structure of a photocoupler?
  • How many volts can be applied to the input side LED?
  • Is it possible to use a photocoupler in such a way that for items such as the LED current, output current, and output voltage, the value specified for the absolute maximum rating is exceeded for a short time?
  • What are the parameters specific to photocoupler and photorelay optical isolation devices, transfer ratio (CTR), trigger LED current, and threshold input current?
  • How are the current transfer ratio (CTR), trigger LED current, and threshold input current measured?
  • For a photocoupler and photorelay incorporating a LED device, in designing equipment, which should be considered: LED life or photodetector life?
  • A photocoupler is an isolation device. What is dielectric strength, which indicates its insulation capability?
  • What is the difference between a photocoupler and a photorelay?
  • What are the safety standards required for photocouplers?
  • What are required by safety standards applicable to photocouplers? How are they specified in products?
  • How can I find safety standard authentication information about photocouplers?
  • What is the current transfer ratio?
  • What is the CTR classification by rank?
  • Why are there two current transfer ratios: CTR and CTR (Saturation)?
  • What is the difference between a dark current and OFF-state collector current?
  • Why is VECO very low (0.3V) for Darlington transistors such as TLP187 and TLP387? What precautions should be taken when using such transistors?
  • In designing a circuit using a transistor coupler, how should the current transfer ratio be reflected?
  • How should a circuit driving the LED of a transistor coupler be selected?
  • In a circuit using a transistor coupler, how should load resistance be selected?
  • How many volts are minimally required for transistor couplers to operate?
  • How many milliamps are minimally required for transistor couplers to operate?
  • Up to what frequency can transistor couplers transmit signals?
  • For a transistor coupler with the base terminal, if not using the base terminal, is it OK to keep the base terminal open and do nothing?
  • For IC couplers, there is a requirement related to common-mode transient immunity. However, for transistor couplers, such a requirement does not exist. Why?
  • What is the threshold input current?
  • In designing a circuit using an IC coupler, how should the threshold input current be reflected?
  • How should a circuit driving the LED at the input side of an IC coupler be selected?
  • In a circuit using a high-speed IC coupler, how should output pull-up resistance be selected?
  • For example, for 1Mbps-type IC couplers such as TLP109 and TLP759 to operate, how many volts are minimally required?
  • For IC couplers, some products are defined with a threshold input current, and others are defined with a current transfer ratio. What is the difference between them?
  • Is a bypass capacitor required between the VCC and GND terminals?
  • How should a frequency for signals that can be transmitted by a high-speed IC coupler be estimated?
  • What is the UVLO function?
  • Is there any problem with waveforms with input signals rising or falling gently?
  • What is the difference between the open collector output type and the totempole output type? Also, what precautions should be taken for use?
  • What is the voltage range in which IC couplers can operate?
  • What is common-mode transient immunity? Why is this required for IC couplers?
  • How can I find the resistance values when the photorelay is OFF and when it is ON?
  • Up to what level of voltage can be used at the switch section of a photorelay?
  • How much input current should be passed for switch operation?
  • Up to what level of current can be used at the switch section of a photorelay? Also, for a pulsed current or AC current, what happens?
  • For signals to be switched, up to what frequency can be used?
  • How long does it take from when an input signal enters until the switch changes?
  • Can photorelays be used by series connections or parallel connections? If yes, what points require attention?
  • What is the CR product of the photorelay?
  • Can photorelays be replaced with and used in the same way as mechanical relays? What is the difference, if any?
  • What are Form A contacts and Form B contacts in a photorelay? Also, what are A, B, and C connections? What is the difference?
  • For what purposes are triac couplers used?
  • What precautions should be taken when replacing mechanical relays with triac couplers?
  • What are the differences among triac couplers, SSR (solid state relays), and photorelays?
  • What is the difference between zero-cross triac couplers and non-zero-cross triac couplers? How should they be used properly?
  • What precautions should be taken when performing phase control with triac couplers?
  • For triac couplers, how should a VDRM (400V, 600V, 800V) be selected?
  • How much input current should be set for turning the triac ON/OFF?
  • What precautions should be taken when using triac couplers for a long time?
  • How should values be selected for the constants for the snubber circuit connected to the triac?
  • When using a triac coupler to drive the main triac, how should the current limiting resistor RT directly connected to the triac be determined?
  • Can high-frequency signals be switched ON/OFF with a triac coupler?
  • When controlling a load with a triac coupler, can a load be controlled even if using a rectangular wave power supply at the load side instead of a sinusoidal wave (AC) power supply?
  • What are fiber couplers (TOSLINK?) used for?
  • What are the characteristics of optical transmission?
  • What is a fiber coupler (TOSLINK™)?
  • What is optical fiber?
  • What is optical transmission?
  • What types of optical connectors are available?
  • What's the difference in internal construction between a photocoupler and a digital isolator?
  • What are the pros and cons of different types of galvanic isolations?
  • What are the benefits of Toshiba standard digital isolators compared to other companies?
  • How does the Active Miller Clamp (AMC) in power device gate driver couplers work?
  • SiC MOSFETs / MOSFETs / IGBTs / Bipolar Transistors
  • A dotted line in a safe operating area is annotated as “This area is limited by RDS(ON).” What does it mean?
  • Aren't there maximum guaranteed values for capacitance, gate charge (Qg) and switching characteristics?
  • Are there any reasons why forward transfer admittance,
  • What is the maximum rating listed in the MOSFET data sheet?
  • Electrical characteristics of MOSFETs (Static Characteristics IGSS/IDSS/V(BR)DSS/V(BR)DXS)
  • What are the characteristics of MOSFET body diodes?
  • Electrical characteristics of MOSFETs (Charge Characteristic Qg/Qgs1/Qgd/QSW/QOSS)
  • Electrical characteristics of MOSFETs (Dynamic Characteristics Ciss/Crss/Coss)
  • Electrical characteristics of MOSFETs (Dynamic Characteristics　tr/ton/tf/toff)
  • What is RDS(ON), MOSFET drain-source on-resistance?
  • Electrical characteristics of MOSFETs (Static Characteristics Vth)
  • How can I calculate the channel-to-ambient thermal resistance, Rth(ch-a), of a small-signal MOSFET?
  • How does the series gate resistor affect the MOSFET?
  • How do N-channel MOSFETs work?
  • How much gate-source voltage should be applied to drive the MOSFET?
  • What are the parasitic diodes between the drain and source of the MOSFET?
  • Why are two MOSFETs used in series in the Lithium-ion secondary battery protection circuit?
  • Is it acceptable to use a body diode between the drain and source?
  • Is it possible to use the Zener diode between the gate and source for surge absorption?
  • Is a high drive current necessary for power MOSFETs?
  • Is the on-state resistance of a MOSFET dependent on temperature?
  • MOS is sensitive to static electricity. How do you protect MOSFETs from static electricity?
  • How to select a suitable high voltage MOSFET for the application that current flows in the body diode.
  • How to calculate the avalanche energy.
  • Resistors are often inserted between a CPU and MOSFETs. Why are these resistors necessary?
  • The MOSFET does not turn off by a turn-off signal. How do I solve this problem?
  • How are super-junction MOSFETs different from common D-MOS?
  • What are the capacitance characteristics of MOSFET.
  • What are the considerations when using MOSFETs in parallel?
  • What attention should be paid when the reverse voltage is applied between drain and source of power MOSFET?
  • What attention should be paid to rising and falling time of the driving signal for MOSFET?
  • What is derating of the safe operating area (SOA)?
  • What does the dv/dt of the MOSFET mean?
  • What is avalanche in MOSFET? (avalanche capability)
  • What is the avalanche capability specified as part of the absolute maximum ratings?
  • What is the definition of "drain current (DC) (Silicon limit)" listed in the Absolute Maximum Ratings table?
  • What is the definition of power dissipation?
  • What is the meaning of “Logic-Level Gate Drive” for the MOSFET?
  • What should I pay attention to when mounting a MOSFET?
  • When using a MOSFET as a load switch, how do I reduce the inrush current that occurs?
  • Where can I find information about the MOSFET naming conventions?
  • Why do Toshiba's power MOSFETs exhibit larger gate-source leakage current, IGSS, than those of other companies?
  • Why is no operating temperature range specified?
  • Are the drain current ID and IDP (absolute maximum ratings) constant to temperature?
  • What part of the semiconductor is the case temperature measured on?
  • What is Kelvin connection?
  • All Semiconductor Devices
  • How much power is it permissible for the semiconductor device to dissipate?
  • How to approximate power dissipation wave to square wave
  • How to calculate for selecting a heat sink of a semiconductor device (1)
  • How to calculate for selecting a heat sink of a semiconductor device (2)
  • How to calculate the junction temperature of a semiconductor device whose datasheets do not include a “thermal resistance” value
  • How to calculate the junction temperature when the power is dissipated in a semiconductor device
  • How to calculate the transient thermal impedance at short pulse width, which is not included in the datasheet
  • If the packages are the same, are the thermal resistances the same?
  • In a board design, what are the methods for reducing the junction temperature?
  • Is case temperature or lead temperature the same as junction temperature?
  • What are the effects of a double-sided cooling package?
  • What are the effects of thermal via holes?
  • What are the important considerations when using a heat sink?
  • What do the thermal resistance suffixes in Rth(j-c), Rth(j-a) and Rth(ch-c) mean?
  • What is a radiation equivalent circuit?
  • What is thermal resistance?
  • What is transient thermal impedance?
  • When multiple semiconductor devices are arranged on the same board, is it necessary to consider thermal interference?
  • General-Purpose Logic ICs
  • Radio-Frequency Devices
  • Are there any special considerations for using RF devices?
  • How can I distinguish between the cathode and anode terminals?
  • What is an RF MMIC (RF cell pack)?
  • What is an RF Schottky barrier diode?
  • What is an RF switching diode?
  • What is a PIN diode?
  • What is a variable-capacitance diode?
  • What is important when selecting a variable-capacitance diode?
  • What is "rs" shown in the Electrical Characteristics table?
  • Radio-Frequency Devices
  • Microcontroller
  • Are there any products that allow memory to be connected without using an external address decoder ?
  • What is the meaning of LSB in representation of AD conversion errors ?
  • Does Toshiba provide Flash programming service ?
  • Are there any products with a built-in LCD driver ?
  • How do I connect a microcontroller with 16-bit data bus and a NOR Flash memory with 16-bit data bus ?
  • How do I identify whether a malfunction is caused by hardware or software ?
  • Although operation checks with test tools in the development environment were successful, proper operation cannot be achieved with the actual device.
  • It looks as if the argument is not passed to the function properly.
  • It looks as if the function call returns an unintended value.
  • What is a wide-band-gap semiconductor?
  • What is surge current?
  • What is the temperature characteristic of the SiC-Schottky barrier diode (SBD)?
  • What is thermal runaway * of the SiC Schottky barrier diode (SBD)?
  • Why does the SiC Schottky barrier diode (SBD) have a high withstand voltage?
  • Are power supply decoupling capacitors required?
  • How to calculate current consumption and power consumption?
  • How to set the output current.
  • How many ICs per reel of taping?
  • What wattage resistor should we choose for the EXT terminal？
  • What should be the power supply and input turn-on order/descent?
  • Are there any problems if the SCK waveform is dulled that cascaded LED drivers are used?
  • What is the difference between absolute maximum ratings and operating conditions?
  • What is the definition of Power dissipation?
  • What is a high-side switch?
  • What is a low-side switch?
  • What is a short to ground?
  • What is a short to power?
  • What is the difference between IPD and IPS?
  • What does the diagnostic function available with low-voltage IPDs do?
  • What is the open-load detection function available with low-voltage IPDs?
  • What is active clamping available with low-voltage IPDs?
  • How does a low-voltage IPD sense temperature for thermal shutdown?
  • How does the thermal shutdown of a low-voltage IPD work for device protection?
  • How does the overcurrent protection of a low-voltage IPD work?
  • Are low-voltage IPDs with a high-side and a low-side switch distinguished with part numbers?
  • What is a bias resistor built-in transistor (BRT)?
  • What are the variations in resistance?
  • What is the maximum voltage that can be applied to the base of a bias resistor built-in transistor (BRT)? (How many watts is the allowable power dissipation of the built-in resistors?)
  • How to calculate the allowable power dissipation of a bias resistor built-in transistor (BRT)
  • At what voltages does the bias resistor built-in transistor (BRT) turn on and off?
  • Basic idea of how to calculate the base current and input voltage of a bias resistor built-in transistor (BRT)　
  • About the hFE of a bias resistor built-in transistor (BRT)
  • What types of bias resistor built-in transistors (BRTs) are available?
  • How to select bias resistor built-in transistors (BRTs)
  • How to read the datasheet (electrical characteristics) of a bias resistor built-in transistor (BRT)
  • How does a bias resistor built-in transistor (BRT) operate?
  • If the VCE(sat) of a bias resistor built-in transistor (BRT) does not drop to the design target because of a heavy load, what can I do?
  • What can I do to increase the switching speed of a bias resistor built-in transistor (BRT)?
  • Obtaining necessary voltage when a bias resistor built-in transistor (BRT) is on (i.e., reducing a collector-emitter voltage drop in the “on” state)
  • Are the collector and emitter terminals of a bipolar transistor interchangeable?
  • Are there any special considerations for heat dissipation from bipolar transistors?
  • What are the electrical characteristics of bipolar junction transistors (BJTs) ?
  • What is the method for measuring the electrical characteristics of bipolar junction transistors (BJTs) ?
  • How can I calculate the junction-to-ambient thermal resistance, Rth(j-a), of a small-signal transistor?
  • How do npn and pnp transistors operate?
  • Reading individual technical datasheets for bipolar transistors
  • Datasheets and other documents for bipolar transistors contain a safe operating area (SOA) graph. What is it?
  • What is the relationship between transient thermal impedance and safe operating area of bipolar transistors?
  • What are the applications of bipolar transistors (bipolar junction transistors: BJTs) ?
  • What is the relationship between the base current and collector current of a bipolar junction transistor (BJT) ?
  • What types of bipolar transistors (bipolar junction transistors: BJTs) are available?
  • What occurs if reverse voltage exceeding the absolute maximum rated emitter-base voltage is applied to the base terminal of bipolar junction transistors (BJTs) ?
  • A junction FET is widely used for impedance conversion. What is it for?
  • Are there any reasons why junction-to-case (or channel-to-case) thermal resistance is not specified for small-package devices?
  • Are there any special considerations for thermal calculation?
  • What drives transistors: current or voltage?
  • I heard that a junction FET could be used as a constant-current source. How can I create a constant-current source?
  • Is it OK to use a transistor as diodes?
  • Neither Rth(ch-a) nor Rth(j-a) is specified for MOSFETs, IGBTs and bipolar transistors. Why is that?
  • Technical documents for MOSFETs and bipolar transistors contain a safe operating area (SOA) graph. What is it?
  • What is a bias resistor built-in transistor?
  • What is a bipolar transistor?
  • What is a JFET?
  • What is a MOSFET?
  • What is a multi-chip discrete device?
  • What is an IGBT?
  • What kinds of tape packing does Toshiba offer for transistors?
  • What types of transistors are available?
  • Why is no operating temperature range specified?
  • What is a transistor
  • What is an IPD?
  • What is an SOI?
  • How to distinguish high-voltage IPDs for sine-wave and square-wave drive based on part numbers?
  • What are the applications of high-voltage IPDs?
  • How does a high-voltage IPD detect temperature for thermal shutdown?
  • What is the bootstrap circuit in high-voltage IPDs?
  • What is the level-shift driver in high-voltage IPDs?
  • What type of Hall-effect devices is suitable for use with a high-voltage IPD?
  • Does the E-Pad (metal frame) exposed on the surface of a high-side IPD have the same potential as GND?
  • Metals are exposed on the sides of the SSOP30 package of high-voltage IPDs. What voltage potential do they have?
  • Is there a recommended land pattern for high-voltage IPDs?
  • What kind of packages are available for high-voltage IPDs?
  • What kind of control IC can be used in combination with high-voltage IPDs?
  • Is there a way to dissipate heat from high-voltage IPDs?
  • How are local power supply ICs used?
  • What kinds of linear-type local power supply ICs (linear regulators) exist?
  • Do LDO ICs need external parts?
  • About absolute maximum ratings (Understanding datasheet values)
  • About electrical characteristics of LDO (Understanding datasheet)
  • Is it possible to use LDO regulators at low supply voltage? What is the minimum voltage required for their proper operation?
  • How can a low-noise power supply be created using an LDO regulator?
  • What is the resistance of the pulldown resistor connected to the CONTROL pin of the LDO regulator?
  • How does overcurrent protection work in an LDO regulator?
  • When the operating mode of the load-side IC is changed, the output voltage of an LDO regulator drops, causing the IC to malfunction. What can I do to prevent a malfunction?
  • What is the thermal shutdown (TSD) that is available with LDO regulators?
  • Are there any LDO regulators with adjustable output voltage available (requiring external resistors)?
  • What type of capacitor is suitable for use with an LDO regulator?
  • What is the quiescent current of an LDO?
  • Which characteristics in a datasheet should I refer to in order to determine whether a given LDO maintains a regulated output voltage even when input voltage varies?
  • The output voltage of an LDO drops when I increase the output current even though it is operating within the rated conditions. What type of LDO should I choose to avoid such a problem?
  • A small noise is superimposed on the output voltage of an LDO. What can I do to reduce the noise?
  • What voltage is required at the CONTROL terminal to enable an LDO?
  • Why does the LDO output voltage oscillate?
  • How can I quickly bring the output voltage of a circuit with an LDO to zero in order to set a power supply sequence for the load IC?
  • Why is the output of an LDO disabled when its input voltage decreases?
  • How can I prevent the output voltage from overshooting following the application of the control voltage to an LDO?
  • Large inrush current flows when an LDO is enabled. What can I do to prevent this?
  • Is the power-on sequence of the input voltage (VIN) and the control voltage (VCT) of an LDO significant?
  • What is the purpose of the capacitor connected to one of the external resistors for an adjustable-output LDO?
  • Is it OK to reverse-bias an LDO, causing its output voltage to become higher than the input voltage?
  • How can I calculate the junction temperature of an LDO?
  • Is there a low-current LDO with an input voltage greater than 5 V?
  • If you want to step down the supply voltage, select either DCDC converter or LDO regulator?
  • What is an output discharge function of the load switch IC?
  • What is the input-tolerant function?
  • Is it OK to apply the input voltage following the application of an “on” signal to the CONTROL terminal?
  • How can I suppress inrush current with a load switch IC?
  • What is the value of the pull-down resistor connected to the active-High CONTROL terminal of load switch ICs?
  • Does the overvoltage lockout of the load switch IC recover automatically?
  • Does the undervoltage lockout function of the load switch IC provide a hysteresis?
  • What is the FLAG output function of the load switch IC?
  • What is the hold time of a load switch IC?
  • What are the Auto Selection and Manual Selection modes?
  • What is a break-before-make circuit?
  • What is reverse-current blocking using external back-to-back MOSFETs?
  • What is the difference between true reverse-current blocking and reverse-current blocking?
  • How does a load switch IC operate if overcurrent protection is tripped?
  • How can I calculate the power dissipation and junction temperature of a load switch IC?
  • What is a bus switch?
  • How should unused terminals of bus switches and analog switches be handled?
  • What is the difference between CMOS logic IC multiplexers and bus switch multiplexers?
  • Does the bus switch have a tolerant function?
  • How should I select a bus switch?
  • Is there a bus switch that can switch high-speed signals (USB3.0/3.1, PCIe™3.0, etc.)?
  • Are there any restrictions on the power up/down order of the dual power supply bus switch?
  • Can the power of the bus switch is turn off while the signal on?
  • What are the leaks in a dual power bus switch?
  • What is Break Before Make (TBBM)?
  • What is the difference between a bus switch and an analog switch?
  • What do SPST and SPDT in bus switches mean?
  • What are the Switch Characteristics and Timing Characteristics of a bus switch?
  • Are there any concerns when switching high-speed signals using AC coupling capacitors with a bus switch?
  • Are there Mux (multiplexer) / De-Mux (demultiplexer) type bus switches supporting PCIe® Gen 5.0, PCIe®Gen 4.0, Thunderbolt™ 4, USB4®?
  • When a bus switch is used for a differential signal, is it possible to transmit a differential signal whose positive and negative terminals are opposite to the terminal names?
  • When a Mux (multiplexer) /De-Mux (demultiplexer) -type bus switch is used for differential signaling, is the I/O terminal of the bus switch specified for directionality, such as dedicated TX, RX?
  • Is the output status of the sequential circuit such as flip-flops, registers, counters, and one-shot multivibrators determined after the power is turned on?
  • Are there any problems with the input pins of CMOS logic ICs and the bus pins (input/output pins) of bidirectional bus buffers in a floating state?
  • What countermeasures should be taken for signals with a low slew rate (signals with slow input rise and fall times)is input?
  • What is the main reason why a CMOS logic IC is unstable?
  • What are the possible causes when the output voltage of CMOS logic ICs does not rise to the power supply voltage?
  • When a CMOS logic IC is switched, what is the measure for the voltage-waveform (overshoot or undershoot) like the spike that occurs at the output terminal?
  • What are the possible causes of noise in the voltage waveform input to the CMOS logic IC
  • What is the difference between CMOS logic IC 04 (inverter) and U04 (unbuffered inverter)?
  • What are the differences among the general-purpose logic ICs?
  • What are the differences between "Absolute Maximum Ratings" and "Operating Ranges" of the general purpose logic ICs?
  • What is the tolerant function of the general-purpose logic ICs?
  • In what sequence should I turn on and off the power and input signals of a general purpose logic IC?
  • Is a decoupling capacitor required for the supply of a general purpose logic IC?
  • Is it possible to leave the unused inputs of the general purpose logic ICs open?
  • What is bushold of the general-purpose logic ICs?
  • How should unused output pins of the general-purpose logic ICs be handled?
  • Is there a specification for the input-signal rise time and fall time of the general-purpose logic ICs?
  • Are there any regulations for the capacitance of the capacitor attached to the output terminal of a general-purpose logic IC?
  • Is it possible to short-circuit the outputs of multiple general-purpose logic ICs?
  • Is it possible to configure a wired OR circuit by connecting output terminals in general-purpose logic ICs?
  • How can I find the maximum operating frequency of a general-purpose logic IC?
  • How many amperes is the output current of a general-purpose logic IC able to drive?
  • What is fanout of a general-purpose logic IC?
  • How can the power dissipation of a general-purpose logic IC be calculated?
  • What kind of faults could occur if static electricity is discharged (ESD) into a general-purpose logic IC?
  • What types of voltage level translation ICs (level shifters) are available?
  • In order to achieve a step-down (5 V → 3.3 V) and step-up (3.3 V → 5 V) level shift (voltage conversion), how should this be achieved?
  • How can I achieve level shifting from 2.5 V to 1.8 V and vice versa?
  • Are there level shifters (voltage translation IC) compatible with serial communication standards (UART, I2C)?
  • What is the difference between the bus switch type and the buffer type of the voltage-level transformation IC (level shifter)?
  • In what order should the voltage level translation IC (level shifter) of the dual power supply type be powered up and the signals input?
  • Do bidirectional bus buffers have any constraints on the timing of the direction (DIR), bus, and other signals?
  • Is it necessary to pull up the input/output pins of dual power supply bus switch?
  • How can I calculate the maximum operating frequency of a level shifter (voltage translation logic IC)?
  • What is an IGBT?
  • What is the difference between MOSFETs and IGBTs?
  • For what applications should MOSFETs and IGBTs be used?
  • What is the principle of operation of the IGBT?
  • In what structures are IGBTs available?
  • What is a reverse-conducting IGBT (RC-IGBT)?
  • What is conductivity modulation?
  • What is a safe operating area?
  • What is the definition of IGBT power dissipation?
  • What is the tail current of an IGBT?
  • Please give some application examples for IGBTs.
  • Please explain hard switching and soft switching using IGBTs.
  • Please explain the operation of voltage-resonant soft switching of an IGBT.
  • Please explain the operation of current-resonant soft switching of the IGBT.
  • How can I provide protection against the surge voltage generated by the turn-off of an IGBT?
  • Is it possible to connect multiple IGBTs in parallel? If so, is there anything to note about parallel connection?
  • At what voltage should the IGBT gate be driven?
  • Besides silicon, what other types of semiconductors exist?
  • Do semiconductor devices tolerate the rated absolute maximum conditions if such conditions exist only instantaneously?
  • Generally speaking, what does “semiconductor” mean?
  • What is a compound semiconductor?
  • What happens if a P-type semiconductor contacts an N-type?
  • What is an N-type semiconductor?
  • What is a P-type semiconductor?
  • Where can I find information on tape specifications and packing quantities per reel?
  • What are open-loop and closed-loop gains of an op-amp?
  • For what applications are op-amps used?
  • Why is feedback used in op-amps?
  • What is an op-amp?
  • What types of amplifier circuits can be configured using an op-amp?
  • What types of op-amps are available?
  • What is the maximum frequency at which an op-amp can be used?
  • What is the purpose of using a differential amplifier such as an op amp? (Common-mode rejection ratio: CMRR)
  • Characteristics of op-amps (What is the ideal op-amp?)
  • What is the virtual short-circuit (virtual ground) of an op-amp?
  • What is the input offset voltage of an op-amp?
  • Is it necessary to connect bypass capacitors to the power supply terminal of an op-amp?
  • Is there any way to amplify a signal with a voltage close to the power supply level?
  • What types of noise affect an op-amp?
  • Are there any considerations for using an op-amp at low voltage?
  • What is the common-mode input voltage of an op-amp?
  • What does rail-to-rail mean (Rail-to-Rail Op amp) ?
  • How can I provide hysteresis (schmitt trigger) for a comparator?
  • Why are voltage followers prone to oscillation?
  • diode_tvs-diodes
  • What are TVS diodes (ESD protection diodes)?
  • Where are TVS diodes (ESD protection diodes) used?
  • Why are TVS diodes (ESD protection diodes) needed?
  • How do TVS diodes (ESD protection diodes) work?
  • What should I consider when selecting TVS diodes (ESD protection diodes) for high-speed signal lines?
  • How should I select TVS diodes (ESD protection diodes) according to the voltage level of a signal line to be protected?
  • What should I pay attention to when TVS diodes (ESD protection diodes) do not work properly?
  • Is it necessary to use bidirectional TVS diodes (ESD protection diodes) to protect against both positive and negative ESD events?
  • Board design considerations for TVS diodes (ESD protection diodes)
  • Could ESD events destroy TVS diodes (ESD protection diodes)? (What is their ESD tolerance level?)
  • How to select TVS diodes (ESD protection diodes)
  • What is a TLP test?
  • ESD Protection for Wi-Fi® Antennas and Other RF Applications
  • The quality of an RF signal should not be degraded when there is no ESD event
  • The device under protection (DUP) should not be degraded or destroyed in the event of an ESD strike
  • Considerations for board design
  • What is electrostatic discharge (ESD)?
  • What is Electrostatic discharge (ESD) testing？
  • What is an ESD protection diode？
  • How do ESD protection diodes operate？
  • What are the typical electrical characteristics of ESD protection diodes?
  • Are there board design considerations for adding ESD protection diodes？
  • How do I choose an ESD protection diode?
  • Even ESD protection diodes fail to protect the DUP. What is the cause of its destruction?
  • What is a surge?
  • What is IEC61000-4-5?
  • What is the difference between ESD protection diode and varistor?
  • Motor Driver ICs
  • What is the meaning of alphanumeric characters at the end of the product name?
  • Please tell me how to calculate the current consumption and power consumption of the meter driver.
  • What are the differences between the absolute maximum ratings and the recommended operating conditions?
  • Please explain the concept of permissible loss for motor drivers.
  • Is it OK to connect capacitors to the output lines of a motor driver IC?
  • Is a decoupling capacitor required on the power supply pins of the IC?
  • Is it okay to make deliberate use of body diodes of MOSFETs?
  • MOS is sensitive to static electricity. How do you protect MOSFETs from static electricity?
  • How will it affect the device when static electricity is applied to the logic pins? And how to deal with the issue?
  • What are the taping specifications and how many ICs per reel?
  • Are there any land pattern preferences or recommendations?
  • How can i purchase samples and evaluation boards?
  • Is there anything to keep in mind when using a sensorless BLDC motor?
  • What are the benefits of lead angle control in brushless motors?
  • What causes motor failure and sine-wave distortion?
  • What is the maximum rotation speed that a sine wave drive motor driver IC can support?
  • What does the symbol at the end of the product name mean?
  • How to distinguish RoHS compliant transistor array products?
  • Is Halogen-free available?
  • What is eFuse IC (electronic fusing)?
  • What are the advantages of using eFuse ICs (electronic fuses) over glass fuses and PTC thermistors (polyswitches, polyfuses)?
  • What applications are eFuse IC (electronic fuses) used for?
  • Can eFuse IC (electronic fusing) be used to protect USB VBUS from short circuits and IEC62368 Qualification?
  • What are the differences between eFuse IC (electronic fuses) and load switch ICs?
  • What functions are built into eFuse IC (electronic fusing)?
  • When a spike-voltage is applied to the input or output terminals of eFuse IC (electronic fuse),How do I take measures?
  • How do I use eFuse IC (electronic fuses) and load switch ICs separately?
  • How does overcurrent protection of eFuse IC (electronic fuses) work?
  • How does short-circuit protection of eFuse IC (electronic fuses) work?
  • What is the difference between the overcurrent protection and the short-circuit protection of eFuse IC?
  • How does thermal shutdown(TSD) of eFuse IC (electronic fuses) work?
  • How does overvoltage protection on eFuse IC (electronic fuses) work?
  • What is the slew rate control function of eFuse IC (electronic fuses) intended to do? And how does it works?
  • What is the under voltage lockout (UVLO) function of eFuse IC (electronic fuses) intended to do? And how does it works?
  • Can eFuse IC (electronic fuse) be used for hot-swap (hot-line insertion/extraction)?
  • Does the eFuse IC (electronic fuse) have reverse current blocking(RCB) function?
  • Power Management ICs
  • Intelligent Power ICs
  • What is the symbol at the end of the product name?
  • How do I calculate the current consumption and power dissipation?
  • How do I estimate the junction temperature?
  • How do I obtain the thermal resistance of the heat sink?
  • Is there a problem with installing a capacitor to the output?
  • What is the electric potential of the heat sink (metallic surface) on back side of IC package? Is that a GND?
  • What kind of material SiC is? And what kind of characteristics does SiC MOSFET have?
  • Can SiC MOSFET be connected in parallel and used?
  • Is the back of the SiC MOSFET package insulated?
  • What are the characteristics of body diode in SiC MOSET?
  • What changes when Si MOSFET/IGBT is replaced with SiC MOSFET?
  • What should be noted when setting SiC MOSFET gate voltage (VGS)?
  • What is Thermoflagger™?
  • What specific applications are Thermoflagger™ used for?
  • How many PTC thermistors can be connected simultaneously?
  • Is it possible to identify the heating point when several PTC thermistors are connected?
  • How accurate is the detected temperature?
  • What temperature ranges can be detected?
  • How do I select a PTC thermistor to use with Thermoflagger™?
  • long-term-supply-of-semiconductor-products
  • Highlighted Contents
  • The Journey of Motor Control
  • Passion For Power Solutions
  • SiC MOSFETs support downsizing and low-loss power supplies
  • 3-Phase AC 400 V Input PFC Converter Reference Design
  • 5 kW Isolated Bidirectional DC-DC Converter Reference Design
  • High accurate SPICE models are released
  • High accurate SPICE model for low voltage MOSFET (12V-300V)
  • High accurate SPICE model for medium to high voltage MOSFET (400V-900V)
  • High accurate SPICE model download lists
  • Proposal for Electric Motor Applications
  • MBD (Model Based Development) using high-speed, high-precision thermal and noise simulation technology for automotive power semiconductor devices
  • How to install and use Accu-ROM™ on Ansys® Twin Builder™
  • Toshiba GaN Power device balances performance and ease of use
  • Cooling simulation model: Expanding the number of Simplified CFD Models for three-dimensional thermal fluid analysis in MOSFETs
  • Implementing Efficient and Accurate Servo Drives in Robots, SCARA and Autonomous Guided Vehicles.
  • Automotive Ethernet Architectures: High-quality in-car audio with Ethernet-AVB/TSN
  • Thermal Management for Designs Using Discrete Semiconductor Devices
  • Half-bridge DC-DC Converter Scheme Shrinks Power in Data Centers
  • Developing Thermal Design Guidelines for Power MOSFETs in a Chassis
  • Power semiconductors. Essential devices for a carbon-neutral future.
  • Building a More Efficient DC-DC Converter: Efficiency Evaluation and Loss Analysis of a 300 W Isolated DC-DC Converter
  • The Online Circuit Simulator eliminates the need for special software
  • Reference Design of High Efficiency Power Supply for Server
  • RF SPDT (Single-Pole Double-Throw that realizes high-power input in a small package.)
  • Model-Based Development (MBD) initiatives for automotive semiconductor products
  • 3D Thermal Fluid Analysis of MOSFETs: Expanding Simplified CFD Model Suitable for cooling simulation
  • Excellence in Power
  • Security Advisories
  • TDSCSA00038: Installers of development tool software products for Toshiba original core-based microcontrollers have a security vulnerability
  • Product Information API Service
  • FAB Sheets
  • MOSFETs
  • 12V - 300V MOSFETs
  • DSOP Advance, a Thermally Enhanced Double Side Cooling Package, improves the efficiency of power supply for high-current applications.
  • The U-MOSⅨ-H series are the ideal MOSFETs for improving the efficiency of switched-mode power supplies.
  • A wide choice of product variations ranging from ultra-small packages to general-purpose packages.
  • Pch MOSFET series using latest process
  • The U-MOSⅨ-H series has a greatly improved figure of merit that represents losses.
  • Switching noise reduction by snubber circuits (Low Spike Technology)
  • Toshiba's MOSFETs are ideal for low-voltage drive equipment.
  • Contributes to reducing loss of switching power supplies
  • Efficiency Improvement by Multi-Level Inverter with 150 V MOSFET
  • U-MOS X-H series 150 V MOSFET ideal for efficient switching power supplies
  • 30V N-Channel Common-Drain MOSFET Suitable for USB Devices and Battery Pack Protection
  • Automotive MOSFETs
  • Process Trends of Automotive MOSFETs
  • Switching characteristics of the N-ch U-MOS series
  • Package Trends of Automotive MOSFETs
  • Automotive applications drive miniaturization of small MOSFET sets
  • 400V - 900V MOSFETs
  • State-of-the-art super junction MOSFET DTMOSVI
  • Commercialization of new TO-247-4L packaging 600-V Super Junction Power MOSFET (DTMOSIV-H Series)
  • State-of-the-art double-diffusion MOSFET(D-MOS)π-MOSIX series
  • Contributes to Higher Efficiency of switched-mode power supply
  • 600V Super Junction Structure N-channel Power MOSFET DTMOSⅥ Series "TK024N60Z1" Improves Efficiency of Power Supply
  • SiC MOSFETs
  • 2nd Generation Features of SiC MOSFETs
  • Loss-Comparison between SiC MOSFET and Si IGBT
  • 2nd Generation SiC MOSFET/IGBT Switching Loss Comparison
  • 3rd generation SiC MOSFETs that contributes to lower loss of power supply in application
  • 3rd generation SiC MOSFETs with New package TO-247-4L(X) released
  • SiC MOSFET Modules
  • Features of SiC MOSFET Modules
  • Features of Toshiba SiC MOSFET Modules
  • Isolators/Solid State Relays
  • Photocouplers for High Speed Communication
  • Compatibility with 3.3-V power supply and low power consumption
  • Broad lineup that supports transmission speeds ranging from 20 kbps to 50 Mbps
  • Sink/source logic input signal compatible products
  • Digital I/O design for industrial PLC
  • Gate Driver Photocouplers
  • Overcurrent protection function (VCE(sat) detection) and built-in active Miller clamp function
  • Compatible with full-swing output
  • UVLO function support
  • Insulated gate driver expands the freedom of inverter drive circuit design
  • What is the gate-driver that facilitates the overcurrent protection design of inverter applications
  • Photocoupler for MOSFET and IGBT Gate Driver Suitable for Industrial Equipment
  • Lineup Expansion of Photocouplers for MOSFET and IGBT Gate Driver Suitable for Industrial Equipment
  • Photocouplers for IPM Interface
  • Response to higher speeds
  • Higher common-mode transient immunity (CMTI)
  • Support for high active and low active IPM
  • Isolation Amplifiers & Isolated Delta - Sigma Modulator
  • Implementing high-precision isolated signal transmission of input analog signal
  • Contributing to lower power consumption and stabilization of primary power supply design
  • Contributing to reduction of mounting space by adoption of a thin package
  • Photorelays (MOSFET Output)
  • What is a photorelay?
  • Photorelays using the latest-generation U-MOS
  • Small S-VSON4 packages
  • High-current (high-capacity) photorelay
  • UL 508 certification
  • 110°C Operation Guaranteed, High-capacity Compact Photorelay
  • Contributing to improved reliability of equipment in intense noise environments
  • Compact photorelays with low voltage drive and high temperature operation rating
  • Photocouplers for high-speed communications
  • Small photorelay with high-speed switching
  • Small Photorelay with High ON-State Current and High-Speed Switching
  • Photorelay Thank You
  • Suitable for driving high voltage power MOSFET
  • Standard Digital Isolators
  • Over 100kV/μs high Common Mode Transient Immunity (CMTI)
  • Isolated 4 channel logic supporting 150Mbps data rate
  • Pulse Width Distortion (PWD) 3ns (max) corresponds to 150Mbps high-speed communication
  • What is the isolation life of the standard digital isolator "DCL54x01"?
  • What is the impulse voltage tolerance of the standard digital isolator "DCL54x01"?
  • Standard Digital Isolator with Robust Electromagnetic Compatibility (EMC)
  • ICs for Wireless Communication Equipment
  • ICs for Bluetooth® wireless communication
  • RF ICs for Extremely Low-Power Radio Applications
  • Intelligent Power ICs
  • 3-phase Brushless DC Motor Driver ICs, built-in Power Devices
  • Increased efficiency and increased current through multi-chip modules with built-in MOSFET
  • Reduction of Loss by the Latest High-breakdown-voltage SOI Processes
  • Reduction of mounting area by small surface-mount package compatible with high voltage
  • Automotive Driver ICs
  • High-side and low-side switch products
  • Gate driver products
  • Optimal driver ICs for various automotive applications
  • General Purpose Logic ICs
  • CMOS Logic ICs
  • Supports all applications (industrial equipment-portable equipment) with an abundant lineup
  • What are the additional functions (input tolerant, power down protection) required for voltage level conversion and partial power down?
  • One-Gate Logic ICs (L-MOS)
  • One-gate logic (L-MOS) 7UL series (7ULxG) with 0.9V operation guarantee
  • L-MOS Supports industrial and portable equipment applications with wide lineup
  • Level Shifters
  • Dual power supply level shifter
  • Why are Level-shifters needed?
  • 4-bit Dual-Supply Bus Transceivers Supporting a Minimum Voltage of 0.8V
  • Bus Switches
  • Bus switches suitable for switching various high-speed signals
  • Dual Power supply bus switch level shifter capable of voltage level conversion
  • Bus switch supporting high-speed digital signals of PCIe® Gen 5.0 and USB4®
  • Diodes
  • SiC Schottky Barrier Diodes
  • SiC devices suitable for power supply circuits
  • Improved JBS structure to reduce the leakage current and increase the surge current capability
  • SiC Schottky barrier diodes (SBDs) with low switching loss
  • High withstand voltage (reverse voltage) characteristics of SiC SBDs
  • Contributes to high efficiency and low loss of high output power supply
  • 3rd generation SiC Schottky barrier diode
  • TVS Diodes (ESD Protection Diodes)
  • ESD tolerance
  • ESD-pulse absorption performance for reducing 1st peak voltage
  • Extensive package lineup: developing smaller packages
  • Low dynamic resistance
  • Extensive package lineup: multi-bit packages
  • Ensuring signal quality: insertion power loss
  • Schottky Barrier Diodes
  • Schottky Barrier Diodes
  • Improved junction barrier Schottky (JBS) structure to reduce the leakage current and increase the surge current capability: Schottky barrier diodes (SBDs)
  • Zener Diodes
  • Zener diode for overvoltage protection
  • Zener diode that protects from various surges of overvoltage pulse
  • Radio-Frequency Devices
  • Motor Driver ICs
  • Brushless DC Motor Driver ICs
  • Intelligent Phase Control Technology
  • Toshiba Releases Three-Phase Gate Driver ICs that Can Accommodate a Wide Range of Applications
  • Brushed DC Motor Driver ICs
  • Configurable Motor Drivers
  • Toshiba Releases H-bridge Driver for Brushed DC Motors with Current Monitoring Function
  • Stepping Motor Driver ICs
  • Advanced Dynamic Mixed Decay (ADMD) Technology
  • Advanced Current Detect System (ACDS) Technology
  • Active Gain Control (AGC) Technology
  • Microstepping technology
  • High-Voltage Analog Process Technology
  • PSpice® model download page
  • Stepping Motor Driver ICs
  • Sensors
  • Linear Image Sensors
  • TCD2726DG
  • Monochrome sensor
  • Color sensor
  • Example of use
  • Interface Bridge ICs for Mobile Peripheral Devices
  • Display Interface Bridge ICs
  • Camera Interface Bridge ICs
  • HDMI® Interface Bridge ICs
  • I/O Expander ICs
  • Power Management ICs
  • Low-Dropout Regulators (LDO Regulators)
  • Noise reduction due to high ripple rejection ratio
  • Fast load transient response performance
  • Reduction of power consumption by low dropout voltage
  • Ultra-low Quiescent current
  • Extensive package lineup
  • Various additional functions
  • How to manage the power supply of mobile devices with high accuracy
  • How to drive battery-powered devices for a long time?
  • Contributes to downsizing of equipment and reduction of power consumption
  • Toshiba releases the TCR3DMxxA and TCR3EMxxA Series of LDO regulators in Toshiba Semiconductor (Thailand)
  • Load Switch ICs
  • Overcurrent protection function
  • Overvoltage protection function
  • Inrush current reduction circuit
  • Thermal shutdown
  • Extensive package lineup
  • Low input voltage operation/low on-resistance characteristics
  • Low current consumption characteristic of load switch ICs
  • Smaller Area and Higher Functionality
  • PFC Control ICs
  • LED Driver ICs
  • eFuse ICs
  • High-precision overvoltage clamp function
  • IEC 62368-1 Safety standard certification
  • Function to suppress inrush current
  • All major protection functions are realized in one package
  • Quick short-circuit protection
  • High-precision overcurrent protection
  • Thermal shutdown function and recovery operation
  • Reverse current blocking function
  • The fuse electronization changes the design?
  • How quick is the protection speed of the electronic fuse?
  • MOSFET Gate Driver ICs
  • MOSFET Gate Driver IC Overview
  • Example of load switch circuit with MOSFET Gate Driver IC and N-channel MOSFET.
  • Linear ICs
  • Operational Amplifiers and Comparators
  • Contributing to long-term operation of equipment, ultra-low-current operational amplifier
  • Low-voltage, wide-range input signals can be amplified and processed
  • Ultra-low-noise Operational Amplifier Optimal for Sensor Small-signal Amplification
  • Extensive package lineup
  • Realizes high-sensitivity and high-precision sensing performance
  • Transistor Arrays
  • Realize low on resistance from bipolar output to DMOS output
  • Package lineup
  • Automotive audio power amplifier ICs
  • 4-channel High-Efficiency Automotive Audio Power Amplifier IC: TCB701FNG
  • 4-channel High-Efficiency Automotive Audio Power Amplifier IC Featuring Maximum 45W Output: TCB702FNG
  • Automotive Audio Power Amplifier IC with Strong Resistance to Power Surges: TCB503HQ
  • Current-Feedback 4-channel Automotive Audio Power Amplifier IC with Built-In Full-Time Offset Detection: TCB502HQ
  • 45-W class 4-channel Automotive Audio Power Amplifier IC with using a new CD-0.13 process: TCB001HQ
  • Current-Feedback 4-channel Automotive Audio Power Amplifier IC with Built-In Full-Time Offset Detection: TCB501HQ
  • Supports external audible outputs from vehicles, allowing use of electric vehicle warning sound systems in HEVs and EVs: TB2909FNG
  • Thermoflagger™ (Over temperature detection IC)
  • Over temperature detection solution with Thermoflagger™
  • Automotive Devices
  • Automotive Ethernet Bridge ICs
  • Video Processors
  • TC90193SBG
  • Automotive Brushless Motor Driver ICs
  • 3-phase BLDC Motor Pre-driver IC for Sine Wave Current Control: TB9080FG
  • Sensorless 3-phase BLDC Motor Pre-driver IC: TB9061AFNG
  • Three-Phase Brushless Sensorless Pre-driver IC TB9062FNG
  • 3-Phase BLDC Motor Pre-driver IC for EPS Applications: TB9081FG
  • Gate-Driver IC for Automotive Three-Phase Brushless Motor: TB9083FTG
  • Gate-Driver IC for Automotive Three-Phase Brushless Motor: TB9084FTG
  • Automotive TVS Diodes (ESD Protection Diodes)
  • ESD tolerance
  • Low dynamic resistance
  • Ensuring signal quality: insertion power loss
  • Extensive product lineup in a wide choice of packages: developing smaller packages
  • Automotive Stepping Motor Driver ICs
  • Automotive Stepping Motor Driver IC:IC TB9120FTG
  • Automotive Stepping Motor Driver IC: TB9120AFTG
  • Automotive Brushed DC Motor Driver ICs
  • 1-Channel Brushed DC Motor Driver IC: TB9051FTG
  • H-bridge Pre-driver IC: TB9057FG
  • Automotive DC motor driver IC with LIN slave function：TB9058FNG
  • PWM 2ch H-Bridge DC Brushed Motor Driver Integrated Circuit (IC) for Automotive
  • Gate Driver IC for Automotive Brushed Motors
  • Video Decoder ICs
  • Product Introduction
  • Automotive System Power Supplies ICs
  • TB9044AFNG Overview
  • TB9045FNG Series Overview
  • Sub-GHz transceiver IC for Automotive TC32306FTG
  • Automotive Network Communication
  • Microcontrollers
  • TX Family / TX00 Series
  • Application : Sencer Hub (TMPM066/067/068)
  • Application : Smart Meters (TMPM061)
  • M030 Group
  • M060 Group
  • TX Family/TX04 Series
  • Application : AV Amplifier
  • Application : Air Conditioner
  • M460 Group
  • M470 Group
  • TX Family/TX03 Series
  • Application : Smart Meters
  • Application : Digital TV
  • Application : Camera Lens
  • Features of the TMPM369FDFG and TMPM369FDXBG
  • Application : Printer
  • Features of the Vector Engine (VE)
  • Application : Washing Machine
  • Application : Induction Cooktops
  • M310 Group
  • M330 Group
  • M360 Group
  • M380 Group
  • M370 Group
  • CAN (Controller Area Network)
  • Multi Purpose Timer (MPT)
  • OFD (Oscillation Frequency Detector)
  • Remote Control Signal Processor (RMC)
  • EtherMAC (Ethernet Media Access Control)
  • USB (Universal Serial Bus)
  • Vector Engines
  • I2S (Inter-IC Sound)
  • TLCS™ Family/TLCS™-870/C1 Series and TLCS™-870/C1E Series
  • TLCS™-870/C1 Series and TLCS™-870/C1E Series
  • Oscillator Manufacturer Information
  • Not Recommended for New Design / EOL Announced Products
  • TX19A Series
  • TLCS-900 Series
  • TLCS-900/H Series
  • TLCS-900/L Series
  • TLCS-900/L1 Series
  • TLCS-870/C Series
  • TLCS-870/X Series
  • TX09 Series
  • Software Library
  • M030 Group Sample Software
  • M060 Group Sample Software
  • M310 Group Sample Software
  • M330 Group Sample Software
  • M340 Group Sample Software
  • M360 Group Sample Software
  • M370 Group Sample Software
  • M380 Group Sample Software
  • TMPM3U0 Group Sample Software
  • TMPM3V6 / M3V4 Group Sample Software
  • TMPM3U6 Group Sample Software
  • M440 Group Sample Software
  • M460 Group Sample Software
  • TLCS-870/C1 Series Sample Software
  • Download Agreement
  • M4K Group Sample Software
  • M4M Group Sample Software
  • M4G Group Sample Software
  • M4N Group Sample Software
  • M3H Group Sample Software
  • M470 Group Sample Software
  • M4K Group Sample Software
  • Partner Information
  • IAR Systems AB
  • ESP Co., Ltd
  • Arm Ltd. (KEIL)
  • Computex Co.,Ltd.
  • Green Hills Software / Advanced Data Controls Corp.
  • iFORCOM KYOEI Co.,Ltd.
  • Sohwa & Sophia Technologies Inc.
  • DTS INSIGHT CORPORATION (formerly Yokogawa Digital Computer Corporation)
  • GRAPE SYSTEMS INC.
  • Ubiquitous AI Corporation
  • Elnec s.r.o.
  • Andor System Support Co., Ltd.
  • SEGGER Microcontroller GmbH & Co. KG
  • ZLG (GUANGZHOU ZHIYUAN ELECTRONICS CO., LTD)
  • BITRAN CORPORATION
  • Technohands Co., Ltd.
  • CATS CO.,LTD.
  • Techno Mathematical Co.,Ltd.
  • TOA ELECTRONICS, Inc. Flash Support Group Company
  • Tokyo Eletech Corporation
  • TOSHIBA INFORMATION SYSTEMES (JAPAN) CORPORATION
  • Falcon Denshi K.K.
  • MICROTEK Inc.
  • Minato Advanced Technologies Inc.
  • SORD CORPORATION
  • Ubiquitous Computing Technology Corporation
  • Lauterbach Japan Ltd.
  • VAMOS
  • P&E Microcomputer Systems, Inc.
  • Xeltek Inc.
  • eForce Co., Ltd.
  • KYOCERA Corporation
  • Kyoto Microcomputer Co.,Ltd.
  • HI-LO SYSTEMS RESEARCH CO.,LTD
  • GAIO TECHNOLOGY CO.,LTD.
  • DediProg Technology Co., Ltd
  • Thunder Software Technology Co.,Ltd.
  • Development Environment
  • TX Family / TXZ Family Development System
  • Development tool download
  • TX19A/H1 Series Development System
  • TLCS-900/H1 Series Development Environment
  • TLCS-870/C1 Series Development System incircuit
  • TLCS-870/C1 Series Development System onchipdebug
  • FLASH / OTP Programming tools
  • TLCS-900/H1 Series Development System onchipdebug
  • TLCS-900/H1 Series Development System incircuit
  • TLCS-900/H1 Series Development System cf29a30_incircuit
  • TLCS-900/H1 Series Development System m15incircuit
  • TLCS-900/H1 Series Development System m25incircuit
  • TLCS-900/H1 Series Development System m15onchipdebug
  • TLCS-900/H1 Series Development System cf29a30_m15incircuit
  • TX19A/H1 Series Development System lightonchipdebug
  • TLCS-870/C1 Series Development Environment
  • TXZ+™ Family/TXZ+™4A Series
  • M4K Group
  • M4M Group
  • M4G Group
  • M4N Group
  • TXZ+™ Family/TXZ+™3A Series
  • Application : Refrigerator
  • M3H Group
  • MCU Motor Studio 3.0
  • IGBTs/IEGTs
  • IEGT (PPI)
  • Press-Pack package
  • Principle of Operation
  • IGBTs
  • Low loss (IGBT)
  • Low loss (FRD)
  • Short-circuit current reduction
  • Wide safe operation area
  • Low radiated emission noise
  • Bipolar Transistors
  • Power Semiconductors
  • Automotive
  • Industrial Equipment
  • Consumer / Personal Equipment
  • Package & Packing Information
  • Linear ICs
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  • Optical Semiconductor Devices
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  • DIP Type
  • ZIP Type
  • Sensors
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  • General-Purpose Logic ICs
  • Power Management ICs
  • Intelligent Power ICs
  • IGBTs/IEGTs
  • Reference Design Center
  • Innovation Centre
  • Application Posts
  • Product Group Posts
  • Thank You
  • Improving the efficiency of solar panels with advanced MOSFET technology
  • Innovations in isolation - advanced photocoupler technologies enable greater protection in smaller packages
  • Power MOSFETs explained - a 5 minute guide for the busy design engineer
  • Low-Power Inverter Drives for High-Power Environments
  • Getting to know your photocoupler - key phrases & characteristics that you need to be aware of
  • DSOP Advance: high power density MOSFETs in a small package
  • Thermal Management Implications of Advances in Packaging & Silicon Technologies for Power Semiconductor Devices
  • HV-IPDs Will Play Integral Role in Driving Further Energy Improvements in Domestic Appliances
  • Cost-Effective Inverters Set to Bring About Next Generation Low Power Motor Drives
  • Implementing More Effective Motor Drives
  • How to Select the Right Power MOSFET
  • Knowledge is Power - Essential Attributes of Power MOSFETs
  • How to protect analogue circuits using isolation amplifiers
  • DSOP Advance: Addressing the fundamentals of heat in power systems
  • Realizing benefits through full integration of smart gate-drivers
  • Why Ethernet Holds the Key to Data Hungry Automotive Infotainment
  • Satisfying Automobile Industry’s Demands for More Effective Motor Control Solutions
  • In search of a quieter life - combatting noise and vibration via innovations in motor control
  • Role of HV-IPD Technology in Boosting Efficiency of Modern Household Appliances for a More Energy Aware Society
  • Combatting Heat Dissipation Issues as Higher Density Power Systems are Deployed
  • How MOSFET technology will boost the effectiveness solar energy installations
  • Ethernet-based in-vehicle networking shows it credentials in relation to automotive infotainment
  • Processes enable higher efficiency in motion control
  • Using integrated drivers to deliver functional safety in automotive motor control?
  • Using Intelligent Phase Control (InPAC) to deliver low noise and optimized motor efficiency
  • How to improve power conversion performance with new MOSFET technologies
  • MOSFETS: Improving power switching, reducing noise
  • Optimising MOSFET performance – chip and package
  • High performance MOSFETs build better power tools
  • Why new superjunction developments are delivering cooler, more efficient MOSFETs
  • Paralleling MOSFETs: Some key considerations
  • How do MOSFET current and thermal limitations interact?
  • Ethernet Based Communication Set to be Foundation of Automobile Infotainment Systems
  • Designing USB Type-C: How to address power and data integrity challenges
  • Next generation MOSFET technology takes on the challenges of the automotive sector
  • Advanced power MOSFET technology addresses cordless power tool challenge
  • Unique packaging technology drives automotive MOSFETs
  • How semiconductor advances can drive improved motor control
  • Challenging high-power automotive applications demand parallel switching
  • Incremental improvements deliver significant benefits to high-power automotive applications
  • Superjunction MOSFET Technology Trends for Power Design
  • Why MOSFETs can make cordless power tools smaller and lighter
  • USB Type-C: Everything to everyone?
  • Will USB Type-C make power adapters obsolete?
  • Which storage system: HDD or SSD?
  • HDD-Based solutions to meet the tasks for storage systems virtualisation
  • HDD-based solutions to meet the tasks for archiving and video streaming
  • Long term availability of replacement HDDs for enterprise storage systems
  • How to control latching relays in smart power meters - an alternative use for brush motor driver ICs
  • Efficient motor control for e-bike applications
  • Testing replacement drives in hardware-based RAID systems
  • What benefits will Automotive Ethernet deliver to vehicle cable harnesses?
  • Making Field-Oriented Control of motors simple
  • Bridging video interfaces to automotive SoCs with image enhancement capability
  • Enhanced connectivity for e-bike applications
  • Replacing wire bonds enhances automotive MOSFET performance and reliability
  • HDD or SSD for storage systems? – Comparing the performance
  • Complying with IEC 60730 in motor control applications
  • How do hardware accelerators simplify motor control applications?
  • Finding the optimal power switching solution for cordless handheld tools
  • Protecting and delivering power and data in USB Type-C designs
  • Is Automotive Ethernet the next revolution in in-car audio?
  • A simple solution to the challenges of Automotive Ethernet audio systems
  • Field-Oriented Control of Brushless Motors without the Math
  • Displaying automotive’s best side in the vehicle
  • MTTF – What hard drive reliability really means
  • HAMR vs. MAMR – Microwave technology delivers higher storage densities in hard disks
  • Introducing the clever fuse
  • Storing the world’s most valuable experimental data
  • Can Ethernet help with a weighty automotive challenge?
  • The H-bridge motor driver building on a wonderful heritage
  • Bringing the backing track of motoring into the 21st century
  • Efficient, Targeted Heating with Induction-Based Cooking
  • Stepper, DC or BLDC – There’s a Solution for Every Application
  • Meeting the motor drive challenge of power tool design
  • Futureproofing vehicles – cameras and displays
  • Sophisticated fuses for smarter protection
  • eFuses: Much more than ‘just a fuse’
  • Get started, or continue, with this H-bridge motor driver
  • IGBTs for Induction Heating in Cooking Appliances
  • A Range of Motor Control Devices for Every Application
  • Facilitating Servo Drive Development in Robots and AGVs
  • Importance of TSN in Fulfilling Next Generation Industrial Automation
  • Changing the Rules of Engagement in USB
  • Developing Servo Drives for Next-Generation Robotics
  • Streamlining DC Motor Implementation and Elevating Efficiency Levels in 10A-Rated Automotive Applications
  • Migration to Automotive Ethernet and the Opportunity to Enhance In-Vehicle Audio
  • Low-Noise Sensorless Field-Oriented Control of Motors via Advanced Hardware & Software
  • Essential Electronics - The H-bridge Motor Controller
  • More Effective IGBT Soft Switching for Induction Cookers
  • Making Servo Drives More Efficient in a Robotic/AGV Context
  • Continued Need for HDD Data Storage in this Increasingly Data-Centric Era
  • Case Study: Cost-Optimised HDD Solution Meets Exacting Demands of Surveillance Sector
  • Validating HDD Storage System Performance in a Real-World Context
  • Accelerating EV Charging System Development: New PFC Reference Design Proves Invaluable Tool
  • Why Designers are Looking to SiC for Bidirectional DC-DC Converters
  • TSN Signifies the Start of New Era in Industrial Automation
  • A More Effective Integration Strategy within Automotive Brushed DC Motor Systems
  • The Ongoing Progression of FOC Motor Control
  • Enhancing Automobile Audio Networks via Ethernet-AVB
  • Toshiba’s H-Bridge Legacy Continues
  • Transforming the Factory Floor - The Increasing Prevalence of Robotics and the Need for More Efficient Servo Technology
  • Maximising Induction Cooker Efficiency by Choosing Better Switching Components
  • Game-Changing SiC-Based Reference Design for EV Charging
  • How SiC is Changing Bidirectional DC-DC Converter Designs
  • Implementing Advanced Servo Operation in Robotic Designs
  • Maximizing Motor Control Effectiveness at Lower Operational Speeds
  • Bidirectional charging is an essential part of a renewable future
  • New bidirectional 3-phase PFC reference design speeds up the development of EV charging solutions
  • Flexible integration is key for brushed DC motors
  • Advanced IGBT Technology Helps Broaden Appeal of Induction Cookers
  • The continuing story of H-bridge motor driving
  • Applying a Better Approach to Servo Drive Implementation in Next Generation Robotic Systems
  • Implementing Superior Sensor-Less BLDC Motor Control
  • Engineers favour SiC devices for bidirectional DC-DC converters
  • Innovative bi-directional EV charging
  • Why continue to use brushed DC motors?
  • Understanding H-bridge motor drivers and their ongoing importance
  • Can storage really be maintenance free?
  • Implementing More Effective In-Vehicle Network Infrastructure
  • Success story from the Technology Experience Lab at NTT Global Data Center
  • Photorelays support mechanical relays in EV BMS applications
  • The journey to a zero footprint in datacenters just got shorter
  • How green is the PROMISE VTrack J5960 4U really?
  • Integration of Superior SoC Solutions into Zonal Automotive Networks
  • Toshiba’s smart gate driver solutions
  • Correct drive for IGBTs and SiC MOSFETs enhances control and protection
  • Will 10Gbps alone be enough to support automotive data transfer requirements? - Exploring a new architectural approach
  • I2C Bus Interface – An Overview
  • Isolating I2C designs with optocouplers
  • Photorelay applications within electric vehicles (EVs)
  • Rapid motor control development - Hardware
  • Rapid motor control development - Firmware
  • Controlling Vehicle Door Mirrors with Current Sensing Diagnostics Included
  • Time sensitive networking for automotive applications
  • BLDC motor control without the need for an MCU
  • Factory automation needs better Ethernet
  • Making PWM IO Adjustment in Motor Drivers More Streamlined
  • Starting a sensorless BLDC motor
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  • Ultra-low power graphics processor for wearable applications
  • Toshiba Memory Corporation Develops World’s First 3D Flash Memory with TSV Technology
  • Toshiba Bluetooth® Low Energy Product Line-up Supports New Bluetooth Mesh Standard
  • Toshiba’s Visconti™4 Image Recognition Processor Powers DENSO’s Front-Camera-Based Active Safety System
  • Vulnerability found related to the generation and management of WPA2 Key on CANVIO (STOR.E) wireless products
  • 08
  • Toshiba Unveils Single Package SSDs with 64-Layer 3D Flash Memory
  • Toshiba Memory Corporation Introduces World’s First Enterprise-Class SSDs with 64-Layer 3D Flash Memory
  • Toshiba Announces Next Generation Client SSD with 64-Layer 3D Flash Memory
  • Toshiba Launches Smart Gate Driver Photocoupler
  • Toshiba Launches H-Bridge Driver ICs for Low-Voltage 2.5V Drive
  • 09
  • Toshiba Launches High-Current 4-Channel H-bridge Motor Driver IC
  • Toshiba Expands Line-Up of Photorelays in DIP8 packages
  • Toshiba’s New Stepping Motor Driver IC has an Anti-Stall Feedback Architecture
  • Toshiba Announces New 1TB Hard Disk Drive for Mobile Client Storage Applications
  • Toshiba’s New Reference Board Solution for TZ1200 App-Lite™ Graphics Processor
  • Toshiba Adds 60V and 100V Products to High Current Photorelays
  • Toshiba’s SO6L Package IC Photocouplers Now Have Option for Wide Leadform
  • Toshiba Launches High-Voltage Multi-Channel Solenoid and Unipolar Motor Driver IC
  • Toshiba Announces 10TB Enterprise Capacity HDD Generation with SATA Model Line-Up
  • 10
  • Toshiba’s New Low Power Consumption Photocoupler Achieves High Speed Communication in Automotive Applications
  • Toshiba Launches 40V and 60V MOSFETs Based on Latest Generation of Trench Process
  • 11
  • Toshiba Expands Line-up of Latest Generation Trench MOSFETs with Ultra-Compact 40V Device for Low EMI Designs
  • Toshiba’s New Three-phase Brushless Motor Drivers Realise High Speed Rotation for Small Motors
  • Toshiba Expands Line-up of New-generation Transistor Arrays
  • Toshiba starts sample shipment of automotive stepping motor driver
  • New Stepper Motor Drivers from Toshiba Improve Motion Accuracy and Motor Efficiency
  • Toshiba Announces 10TB Surveillance Hard Disk Drive
  • Toshiba Memory Europe Unveils UFS Devices Utilizing 64-Layer, 3D Flash Memory
  • Toshiba Increases Performance, Doubles Capacity with New XG5-P NVMe SSDs
  • 12
  • Toshiba introduces new Bluetooth® low energy IC for automotive applications
  • Toshiba sets new standard with advanced high-efficiency Audio Power Amplifier
  • Toshiba Electronic Devices & Storage Corporation Launches World’s First 14TB HDD with Conventional Magnetic Recording
  • Toshiba Memory Europe Announces UFS 2.1-Compliant Embedded NAND Flash for Automotive Applications
  • Toshiba Introduces New 10,500rpm Enterprise Performance HDD Model Generation
  • News Release
  • 2017
  • 10
  • Relationship with Wor(l)d Media Technology Corp.
  • 2018
  • 01
  • Toshiba releases new Bluetooth 4.2 evaluation and prototyping platform
  • Toshiba launches two new ICs compliant with Bluetooth® Ver. 5.0
  • Toshiba Unveils Mainstream RC100 NVMe SSD Series at CES 2018
  • Ultra-Compact Bi-Directional ESD Protection Diode for Portable Devices
  • Toshiba launches small LDO regulator ICs suitable for IoT applications
  • 02
  • Toshiba releases 100V N-channel power MOSFETs for industrial applications
  • Toshiba adds power amplifier IC adopting pure MOS for car audio
  • Toshiba releases medium voltage, high current photorelay in small package
  • Toshiba introduces SOI process for low-noise RF Amplifiers
  • Toshiba Announces New 2TB Hard Disk Drive for Client Storage Applications
  • 03
  • Toshiba Launches High Peak Pulse Current TVS Diodes for Power Line Protection
  • Toshiba add new line-up of high speed signal transmission photorelays
  • Toshiba releases N-channel MOSFET driver ICs
  • Toshiba Launches Photocoupler with UVLO Function for Digitally Controlled Switching Power Supplies and IPM Drives
  • Toshiba launches 1.5A LDO regulators in ultra-small package
  • Toshiba unveils next generation 600V planar MOSFET series
  • Toshiba releases high-current photorelays for factory automation
  • 04
  • Toshiba releases medium voltage photorelay for industrial applications
  • Toshiba launches new surface-mount brushed motor driver IC
  • Toshiba gate driver photocoupler with 2.5A peak output current in low profile package
  • Toshiba releases new, powerful surveillance and video streaming internal hard disk drives
  • 05
  • PCIM 2018: Toshiba releases automotive 40V N-Channel power MOSFETs in 5mm x 6mm package
  • Toshiba to exhibit multiple exciting new products at PCIM Europe
  • Toshiba releases photorelay for factory automation and other industrial applications
  • Toshiba releases new three-phase brushless fan motor driver IC
  • World’s first[1] 14 TB[2] server HDD joins Toshiba’s enterprise and consumer product line up on api - partner stand at CEBIT 2018
  • Toshiba develops 4.5 kV press-pack IEGT with improved rupture resistance
  • 06
  • Toshiba releases interface bridge devices for automotive infotainment applications
  • Toshiba announce new evaluation board for three-phase BLDC motor drive ICs
  • Toshiba Launches active-clamp MOSFET series for relay drivers
  • 07
  • Toshiba Announces 14TB HDD Availability on Select Supermicro Storage Servers
  • Toshiba announce new analog output IC photocoupler for automotive applications
  • Toshiba develops low reverse-current Schottky diode with improved thermal performance
  • Toshiba release compact power MOSFET gate driver intelligent power device
  • Toshiba launch high current photorelays in DIP4 package
  • 08
  • Toshiba adds new three-phase brushless fan motor controller IC
  • Toshiba obtains UL 508 certification for eight photorelays
  • Toshiba announce next-generation superjunction power MOSFETs
  • Toshiba Expands Line-up of Arm® Cortex® -M3-based Microcontrollers
  • Toshiba sampling new high-definition microstepping motor driver
  • Toshiba gives more capacity to SAS 3.5” enterprise HDD models
  • 09
  • Toshiba releases automotive 40V ultra low Rds(on) MOSFETs in 5mm x 6mm packages with double-sided cooling
  • Toshiba H-bridge motor drive IC supports low voltage, high current drive
  • Toshiba launches power amplifier for automotive audio systems
  • Toshiba releases DC brushed motor IC with current limit detection
  • 10
  • Toshiba announces Bluetooth® 5 IC for automotive applications
  • 11
  • Toshiba adds new 4-channel linear power amplifier for car audio
  • Toshiba unveils 130nm Fit Fast Structured Array development platform
  • Toshiba recognised as Most Committed Supplier in Agfa HealthCare Supplier Excellence Awards
  • 12
  • Toshiba launches H-bridge driver IC supporting low-voltage, large current drive
  • 2019
  • 01
  • Toshiba Develops DNN Hardware IP for Image Recognition AI Processor Visconti 5 for Automotive Driver Assistance Systems
  • Toshiba announces new 16TB Enterprise Capacity Hard Disk Drives – MG08 Series
  • Toshiba Announces Latest Ethernet Bridge IC for Automotive and Industrial applications
  • 02
  • Toshiba to exhibit range of new products and technologies at Embedded World 2019
  • Toshiba releases small MOSFET with excellent ESD protection
  • Toshiba Image Recognition SoC for Automotive Applications Integrates a Deep Neural Network Accelerator
  • Toshiba launches single-supply single-gate logic devices supporting low voltage operation
  • 03
  • Toshiba starts sample shipments of automotive DC motor driver IC with LIN slave function
  • Toshiba’s new small surface mount LDO regulators lower power consumption
  • Toshiba launch a new adapter for unidirectional optical modules
  • Toshiba Employee Receives 2018 MIPI Lifetime Achievement Award
  • 04
  • Toshiba announces significant presence at PCIM Europe 2019
  • 05
  • Toshiba’s ARM® Cortex®-M4-based Microcontrollers deliver high-speed data processing
  • Toshiba high-current photorelays achieve UL 508 certification for factory automation applications
  • 06
  • Toshiba launches new family of low voltage driven photorelays
  • Toshiba launches compact, high-efficiency DC brushed motor driver IC with popular pin-assignment HSOP8 Package
  • Toyota Alphard/Vellfire with Toshiba’s Advanced Image Recognition Processor Wins Japan’s Highest Award for Preventive Safety Performance
  • Toshiba launches sensorless control pre-driver IC for BLDC motors
  • Toshiba launches CCD linear image sensor with enhanced performance
  • Toshiba launches three-phase brushless motor controller ICs with sine wave drive
  • 07
  • 08
  • Toshiba launches sensorless control pre-driver IC for BLDC motors
  • 09
  • Toshiba launches high-voltage dual-channel solenoid driver IC
  • 10
  • Toshiba Launches Voltage Drive Photorelay with a Tiny 2.9mm2 Footprint
  • Toshiba releases low capacitance TVS diodes suitable for ESD protection
  • Toshiba launches 600V sine-wave PWM Driver IC for three-phase brushless motors
  • Toshiba announces new three-phase brushless motor control pre-driver IC
  • 11
  • Toshiba launches compact resettable eFuse IC providing safety for low voltage applications
  • Toyota Lexus UX and Lexus NX with Toshiba’s Image Recognition Processor Win Highest Score in Japan’s Assessment of Preventive Safety Performance
  • 12
  • Toshiba launches a range of general-purpose system power ICs for automotive applications
  • Toshiba announces new three-phase brushless motor controller with gate driver
  • Toshiba announces new 100 V N-channel MOSFETs for automotive applications
  • Press Contacts
  • 2020
  • 01
  • Toshiba launches a 10Mbps logic output photocoupler for PLCs
  • 02
  • Toshiba launches new high-resolution micro-stepping motor driver IC with integrated current sensing
  • Toshiba to launch new Servo Drive Reference Model at Embedded World 2020
  • Toshiba announces trio of new high-current photorelays
  • Toshiba Withdraws from Participation at Embedded World 2020
  • Toshiba announces new cutting-edge CMOS silicon on insulator process
  • 03
  • Toshiba Releases New 100V N-Channel Power MOSFET for Automotive Applications
  • Toshiba Adds New Brushed DC Motor Driver IC with wide operating voltage range
  • Toshiba's Latest Enterprise Hard Disk Drives Qualified for Microchip Technology’s Adaptec HBAs and RAID Adapters
  • Toshiba Expands 32-bit Microcontroller Product Line-up
  • Toshiba announces a new dual output IGBT / MOSFET driver
  • Toshiba launches two new 80V N-channel power MOSFETs
  • 04
  • Toshiba Launches Improved 1350 V IGBT device for domestic appliance applications
  • Use of Shingled Magnetic Recording (SMR) technology in Toshiba Consumer Hard Drives
  • 05
  • Toshiba Launches MOSFET Gate Driver Switch Intelligent Power Devices
  • Toshiba announces compact intelligent power device with 600V rating
  • 06
  • Toshiba adds automotive display interface bridge ICs for IVI systems
  • Toshiba expands super junction N-Channel MOSFET series with addition of new 650V devices
  • Toshiba Releases Industry’s First High-Speed Communications Photocouplers that can operate from a 2.2V supply
  • 07
  • 2-Phase Stepping Motor Driver IC from Toshiba Fully Addresses Automotive Sector Requirements
  • New 1500pixel Image Sensor Arrays from Toshiba Accelerate AOI Throughput Figures
  • 08
  • Toshiba Collaborates with MikroElektronika to Create Five New Motor Control Click boards™
  • Toshiba’s Visconti™4 Image Recognition Processor Selected by Leading Chinese Manufacturer for ADAS Solution
  • Toshiba Announces Compact Low ON-Resistance N-Channel MOSFETs for automotive
  • Toshiba’s New Photorelays with Low Trigger Current Contribute to Low Power Consumption in Battery-Powered Equipment
  • 09
  • New Photorelays from Toshiba Contribute to Equipment Downsizing by Reducing Mounting Density
  • Toshiba Introduces new Compact-Sized Photorelay Devices
  • Toshiba Electronic Devices & Storage Corporation Implements New Strategies for System LSI Business
  • 10
  • Toshiba Launches 1200V Silicon Carbide (SiC) MOSFET
  • Toshiba Launches Ultra-Low Current Consumption CMOS Operational Amplifier
  • Toshiba Announces Updated 4TB, 6TB and 8TB Enterprise Capacity Hard Disk Drive Models
  • Compact Low On-Resistance MOSFET Devices from Toshiba Significantly Enhance Battery Pack Operation
  • 11
  • Toshiba focuses on power system designs at Electronica Virtual 2020
  • Toshiba’s Announces New Dual-Channel H-bridge Motor Driver IC with PWM Control
  • Compact, low noise, high ripple rejection LDO regulator series delivers enhanced power rail stabilization in space-constrained designs
  • 12
  • 10A H-Bridge Motor Driver ICs from Toshiba Fully Optimised for Automotive Deployment
  • 2021
  • 01
  • Toshiba Expands Portfolio of Low-Power Performance-Enhanced 32-Bit Microcontrollers Using Arm® Cortex®-M Technology
  • 02
  • Toshiba Adds New Function-Rich Resettable eFuse to its Product Portfolio
  • Toshiba Introduces High-Current Photorelay Optimised for Industrial Implementation
  • Toshiba Unveils New 18TB MG09 Series Hard Disk Drives
  • 03
  • SiC MOSFET Modules from Toshiba Enable Downsizing of Industrial Implementations While Simultaneously Boosting Efficiency Levels
  • Toshiba's announces five 650V superjunction power MOSFETs housed in the new TOLL package
  • Compact, Low-Profile LDOs from Toshiba Deliver Low Output Voltage Noise Alongside Exceptional Output Voltage Accuracy
  • 04
  • 05
  • 06
  • Latest 1-Form-B Photorelay from Toshiba Offers 1.2A On-State Current Rating
  • 07
  • Toshiba announces new photovoltaic-output photocoupler with increased open voltage for isolated solid-state relays
  • Toshiba release ARM® Cortex®-M4 microcontrollers for motor control
  • 08
  • Toshiba launches low-spike-type 40V, N-channel power MOSFET
  • Toshiba`s latest 18TB HDDs receive Adaptec® HBA and RAID Adapter Qualification
  • 09
  • Toshiba expand the TXZ+TM family with ARM® Cortex®-M4 microcontrollers for high-speed data processing
  • 10
  • Toshiba release new 40V/2.0A constant current stepper motor driver IC
  • Toshiba Releases New M4N Group of ARM® Cortex®-M4 Microcontrollers in the TXZ+TM Family Advanced Class
  • 11
  • Toshiba announce new automotive BLDC pre-driver IC supporting ASIL-D
  • 12
  • New automotive photocoupler offers highest collector-emitter voltage of 200V
  • 2022
  • 01
  • Toshiba launches ultra-small 4-Form-A voltage driven photorelays
  • Toshiba launches high performance Ethernet PCIe bridge IC
  • Toshiba releases new high peak output current photocouplers
  • Toshiba announces new high voltage laboratory in Germany
  • Toshiba release high voltage 1500V automotive photorelay
  • Toshiba announces load switches with ultra-low quiescent current consumption of 0.08nA
  • 02
  • Toshiba announces new low power photorelays with extended operating temperature
  • Toshiba announces three-phase BLDC pre-driver IC featuring sensorless sine-wave motor control
  • Toshiba introduces a new size-reduced MOSFET gate driver
  • New ultra-low capacitance TVS diode launched by Toshiba
  • 03
  • Toshiba Defines Nearline HDD Technology Roadmap to Meet Ever-Increasing Global Data Demands
  • New range of Mikroelektronika Click boards™ featuring stepper motor drivers from Toshiba
  • New 150V N-channel power MOSFET improves power supply efficiency
  • 04
  • Toshiba further expands super junction MOSFET range with four additional 650V devices
  • Toshiba Releases New M3H Group of ARM® Cortex®-M3 Microcontrollers in the TXZ+TM Family Advanced Class
  • 05
  • Toshiba expands collaboration with MikroElektronika introducing the Clicker 4 for TMPM4K development board for Motor Control
  • 06
  • Toshiba extends miniature MOSFET gate driver family for portable applications
  • Toshiba partners with Farnell to strengthen supply chain for an extended range of new and innovative products
  • Toshiba announces availability of highly accurate SPICE models
  • 07
  • Collaboration between Toshiba and Visiotech addresses demand for high capacity data storage in video surveillance applications
  • 08
  • Toshiba releases 2.5A output smart gate driver photocoupler for IGBT and MOSFET control and power protection in industrial applications
  • Toshiba Introduces First Smart Gate Driver Photocoupler with Automatic Recovery Function
  • Toshiba launches third generation 650V silicon carbide (SiC) MOSFETs
  • Third generation 1200V SiC MOSFETs from Toshiba boost industrial power-conversion efficiency
  • 09
  • Toshiba to exhibit solutions for power efficiency, smart industry, and mobility at Electronica 2022
  • Toshiba announces 4.5V-33V stepper motor driver in tiny package that saves space and simplifies design
  • 10
  • Toshiba Announces 20TB MG10 Series Hard Disk Drives
  • 11
  • Toshiba simplifies motor control with new software and hardware ecosystem
  • Toshiba’s latest 20TB HDDs receive Microchip’s Adaptec® SmartRAID controller qualification
  • 12
  • New N-channel power MOSFETs leverage advanced heat dissipation capabilities to support larger automotive currents
  • Toshiba announces new 8-channel high- and low-side switches for driving loads in industrial applications
  • Toshiba’s highly-compact automotive-grade BLDC motor gate driver is now in volume production
  • Toshiba announces new IGBT device based upon latest generation semiconductor process
  • Toshiba develops automotive CXPI communication driver IC
  • New high-performance 150V U-MOS X-H MOSFET from Toshiba
  • Contributing to a sustainable future: Toshiba proves its power credentials at PCIM 2023
  • Toshiba’s advanced digital isolators deliver high-speed multi-channel operation
  • storage-20230509-1
  • Toshiba announces Thermoflagger over-temperature detection ICs
  • Toshiba’s compact new photorelays feature maximum turn on time of only 0.25ms
  • Toshiba’s 50V motor driver ICs reduce component count, save board space and enable second sourcing strategies
  • Toshiba launches 600V super junction N-channel power MOSFET series with ultra-low RDS(on)
  • Toshiba releases a new range of low current, high input voltage LDO regulators
  • Toshiba Introduces ARM® Cortex®-M3 Microcontrollers with 1MB Flash Memory
  • Toshiba announces new 100V N-Channel MOSFET to support miniaturization within power supply applications
  • Toshiba Electronics Europe announces new Vice President of its Battery Division
  • Toshiba Electronics Europe announces new President and CEO
  • SiC 650V Schottky barrier diodes with forward voltage of 1.2V released by Toshiba
  • Toshiba launches tiny common-drain N-channel MOSFET
  • Toshiba teams with MikroElektronika to accelerate automotive motor control development
  • New 2200V silicon carbide MOSFETs enhance efficiency in challenging applications
  • Toshiba releases 3rd generation silicon carbide (SiC) MOSFETs with reduced switching losses
  • Toshiba sample software package expands microcontroller development tools ecosystem
  • Toshiba introduces 600V-rated intelligent power devices for BLDC motor drive
  • Toshiba to demonstrate a petabyte scale media storage solution at IBC
  • Toshiba expands range of Thermoflagger™ temperature monitoring ICs
  • Toshiba Announces 22TB MG10F Series Hard Disk Drives
  • Toshiba launches a small photorelay for high-frequency signal switching
  • Toshiba introduces automotive MOSFETs in an innovative new package
  • New MikroElektronika Click Boards™ feature Toshiba digital isolators for isolated signal transmission in industrial applications
  • Toshiba enhances range of 600V-rated IPDs for BLDC motor drive
  • Toshiba launches first 30V N-Channel Common-Drain MOSFET
  • Toshiba launches photovoltaic output photocoupler for automotive
  • Toshiba releases new photorelay with comprehensive protection features
  • Toshiba Electronic Devices & Storage’s Status and Measures in Response to the Earthquakes in Ishikawa Region (Fifth Report)
  • Toshiba Electronic Devices & Storage’s Status and Measures in Response to the Earthquakes in Ishikawa Region (Sixth Report, Final, Update on March 4)
  • Toshiba introduces additional -60V P-channel MOSFETs
  • Toshiba announces new photorelays for semiconductor test applications
  • Toshiba software for motor-drive development supports faster time to market
  • Toshiba introduces a pair of automotive N-channel MOSFETs to expand range
  • Toshiba Releases New Microcontrollers with Expanded Code Flash Memory Capacity to Support Firmware Updates
  • Toshiba releases motor control driver IC enhanced with built-in microcontroller and gate driver for efficient and precise motor control
  • Toshiba releases power MOSFETs with high-speed body diode that help to improve efficiency of power supplies
  • Photocouplers for speed-challenged applications
  • Toshiba Successfully Demonstrates Nearline HDDs with Massive Capacity of Over 30 Terabytes
  • Innovating for a sustainable future: Toshiba focuses on e-mobility, industrial, energy and infrastructure at PCIM 2024
  • Toshiba releases new LDO for ultra-miniature applications
  • Toshiba Succeeds in Reducing On-resistance in SBD embedded SiC MOSFET While Securing Reliability and Short-Circuit Ruggedness
  • Toshiba Announces MG10-D Series of Enterprise HDDs with Capacities up to 10TB
  • Toshiba Develops 48V-to-1V Non-Isolated DC-DC Converter IC
  • Toshiba Extends 150V N-Channel Power U-MOS X-H MOSFET Lineup to Reduce Power Consumption for Power
  • Toshiba Develops Technology that Can Mitigate Parasitic Oscillation Between Parallel-Connected Chips in SiC Power Modules with Minimal Gate Resistance that Support High Speed Switching
  • Toshiba announces new SPDT RF switch in a compact package
  • Toshiba announces small intelligent power device for BLDC motor drives
  • Toshiba Is Sampling an Automotive CXPI Responder Interface IC that Contributes to Shorter Software Development Times
  • Toshiba Announces 24TB CMR and 28TB SMR Enterprise Hard Disk Drives
  • Toshiba introduces automotive photocoupler with output withstand voltage of 900V (min)
  • Toshiba introduces 32Gbps 2:1 multiplexer/1:2 demultiplexer switches for high-speed signals
  • New Toshiba 1200V SiC Schottky barrier diodes achieve typical low forward voltage of 1.27V
  • Toshiba sampling automotive gate driver IC for brushed DC motors
  • Toshiba Releases TCKE9 Series Compact Electronic Fuses (eFuse ICs) for High-Voltage Power Management Applications
  • Toshiba and MIKROE introduce motor driving board streamlining prototyping of automotive applications
  • Toshiba Collaborates with PROMISE Technology on Providing the Optimal Data Storage Technology for CERN’s Large Hadron Collider
  • Toshiba showcases innovative technologies for a sustainable future at electronica 2024
  • Toshiba and MIKROE develop a safety-focused automotive gate driver board for brushless motors
  • Toshiba Starts Test-Sample Shipments of a Bare Die 1200V SiC MOSFET with Low On-Resistance and High Reliability, for Use in Automotive Traction Inverters
  • Toshiba releases gate driver ICs for three-phase brushless DC motors used in consumer and industrial equipment
  • Toshiba releases high-speed photorelay for semiconductor testers
  • Toshiba now sampling automotive gate driver IC for brushless DC motors
  • Toshiba releases automotive photorelay with high breakdown voltage of 900V
  • Toshiba releases new microcontrollers for motor control in consumer and industrial equipment
  • Toshiba introduces new 50V/3.0A constant current stepper motor driver IC
  • Compact photorelay with high ON-state current and high-speed switching
  • Boost efficiency and expand possibilities with Toshiba’s advanced H-bridge drivers
  • Toshiba introduces the TCR3DMxxA and TCR3EMxxA series of 300mA LDO voltage regulators
  • Toshiba Releases Small Photorelays with High Speed Turn-On Time that Help Shorten Test Time for Semiconductor Testers
  • New Toshiba 600V 24mΩ MOSFET improves power supply efficiency
  • Toshiba launches H-bridge motor driver for high-torque applications
  • Toshiba Celebrates Completion of New Back-End Production Facility for Power Semiconductors
  • Toshiba expands storage evaluation services in EMEA with new HDD Innovation Lab
  • Toshiba Releases Gate Driver IC for Automotive Brushed DC Motors that Will Contribute to Downsizing of Equipment
  • Updated Motor Control Studio software from Toshiba streamlines motor control solutions
  • 4-bit dual-supply bus transceivers from Toshiba support low voltage level-shifting in systems featuring widely-used communications protocols
  • Clicker 4 Inverter Shield 2 extension board allows gate driver evaluation in various BLDC motor applications
  • Toshiba drives ‘Excellence in Power’ at PCIM 2025
  • Toshiba introduces new 4-channel automotive high-speed digital isolators
  • Highly integrated gate driver photocoupler from Toshiba enhances safety when switching SiC MOSFETs in industrial applications
  • Ultra-compact DFN8x8 packaged 650V SiC MOSFETs from Toshiba enhance power density and efficiency in industrial equipment
  • Toshiba Develops Technology to Reduce Losses in SiC Trench MOSFETs and Semi-Super-Junction Schottky Barrier Diodes
  • Kaga Toshiba and Himeji Semiconductor Introduce Off-site PPA Model
  • Toshiba Releases 2-Channel Automotive Standard Digital Isolators Compliant with AEC-Q100
  • Toshiba Electronic Devices & Storage Corporation Announces a Plan to Change Auditors of June 27, 2025
  • Toshiba Starts Sample Shipments of Second Product in its Smart Motor Control Driver “SmartMCD™” Series
  • Technical Review
  • Design Method to Improve Clamping Capability of Parasitic pn Diodes Utilizing Newly Developed Equivalent Circuit Model of SBD-Embedded SiC MOSFETs
  • 3D integration technology with photosensitive mold for fan-out package
  • Analysis of dependence of dVCE/dt on turn-off characteristics with a 1200 V double-gate insulated gate bipolar transistor
  • Implementation of security features in storage products
  • Cybersecurity of automotive semiconductor products
  • Novel Approach to Mitigate Parasitic Oscillation of Power Modules with Parallel Connected SiC-MOSFETs
  • Improving the Short-Circuit Capability of RC-IEGT by Backside Double P-ring Structure
  • Demonstration of Pseudo Independent Driving of Buried Gate in Trench Field Plate MOSFETs
  • Impact of Reverse Current Spreading on Diode Conduction Reliability of SBD-Embedded SiC-MOSFET with Deep p-Shield Structure
  • Paralleling 3.3-kV/800-A rated SiC-MOSFET Modules: An Optimization Method
  • Improved reliability of a 2200 V SiC MOSFET module with an epoxy-encapsulated insulated metal substrate
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